Solder supply device including a sensor to detect movement of a solder container

Patent metadata

Field	Value
Publication number	US-9802264-B2
Application number	US-201315100908-A
Country	US
Kind code	B2
Filing date	Dec 18, 2013
Priority date	Dec 18, 2013
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

A solder supply device is provided with a solder cup housing liquid solder that is cylindrical and open at one end; a nozzle section, for ejecting solder from the solder container, that is inserted into the solder container; a flange section that is provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup; solder supplied from the tip of the nozzle section by the solder cup being moved; a magnet provided in the outer circumferential surface of the solder cup; and magnetic sensors able to detect the approaching of the magnet are provided at a position facing the outer circumferential surface of the solder container. Based on the positions of the magnet and the sensor, the post-movement position of the solder container is detected. Thus, it can be detected that solder has run out from inside the solder cup.

First claim

The invention claimed is:

1. A solder supply device comprising:
a solder container housing liquid solder that includes a tubular section, an opening at a first end, and a bottom at a second end, the solder container including a flange section closer to the first end of the solder container than to the second end of the solder container:
an outer tube that is tubular with an opening at a first end of the outer tube and a bottom at a second end of the outer tube, the outer tube slidably stores the solder container inside the outer tube, the outer tube including a first inner circumferential surface closer to the first end of the outer tube and a second inner circumferential surface closer to the second end of the outer tube, an inside diameter of the first inner circumferential surface being greater than an outer diameter of the flange section of the solder container, and an inside diameter of the second inner circumferential surface being greater than an outer diameter of the tubular section of the solder container:
an inner tube including a cylindrical tube section and a ring section which covers an edge of the cylindrical tube section of the inner tube; and
a supply nozzle including a nozzle section and a flange section, for ejecting solder from the solder container, that is inserted into the solder container, and
wherein the flange section of the supply nozzle is fixedly provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder container from the opening of the solder container,
wherein the supply nozzle is fixedly held by the ring section of the inner tube,
wherein the solder supply device supplies solder from a tip of the nozzle section by moving the solder container such that the flange section of the supply nozzle advances inside the solder container and the solder exits the supply nozzle via a nozzle hole in the nozzle section, the solder container being moved by air being supplied to an air chamber that is demarcated by the second end of the solder container and the second end of the outer tube such that the bottom of the solder container moves towards the supply nozzle, and
wherein the solder supply device includes
a magnet provided on an outer circumferential surface of the solder container, and
a sensor provided at a fixed position facing the outer circumferential surface of the solder container so as to detect an approaching of the magnet due to movement of the solder container.

2. The solder supply device according to claim 1 , wherein
the sensor is provided on an outer section of the outer tube and faces the outer circumferential surface of the solder container, and at least a portion of the outer tube that faces the sensor is formed from non-magnetic material.

3. The solder supply device according to claim 1 , wherein
the sensor is provided in a plural quantity lined up in a movement direction of the solder container.

4. The solder supply device according to claim 1 , wherein
the magnet is a ring-shaped member with an inside diameter that is smaller than the outer diameter of the flange section of the solder container, and larger than the outer diameter of the tubular section of the solder.

5. The solder supply device according to claim 1 , wherein
the magnet abuts the flange section of the solder container.

6. The solder supply device according to claim 1 , wherein the nozzle section includes a first outer circumferential surface on the flange section of the supply nozzle side of the nozzle section and a second outer circumferential surface on a tip section side of the nozzle section, an outer diameter of the second outer circumferential surface of the nozzle section being greater than an outer diameter of the first outer circumferential surface of the nozzle section.

7. The solder supply device according to claim 6 , wherein the outer diameter of first outer circumferential surface of the nozzle section is smaller than an inside diameter of the ring section of the inner tube.

Assignees

• Fuji Machine Mfg

Inventors

• Fujita Yoji

Classifications

• B05B12/124

  responsive to distance between spray apparatus and target · CPC title

• G01F23/00

  Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm · CPC title

• H05K3/3484

  Electricity · mapped topic

• B23K3/0638 Primary

  for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence) · CPC title

• B05C11/1002

  Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves · CPC title