Method for etching metal or metal oxide by ozone water, method for smoothing surface of metal or metal oxide by ozone water, and patterning method using ozone water

Patent metadata

Field	Value
Publication number	US-9797046-B2
Application number	US-201314396462-A
Country	US
Kind code	B2
Filing date	Apr 25, 2013
Priority date	Apr 27, 2012
Publication date	Oct 24, 2017
Grant date	Oct 24, 2017

Abstract

Provided are a method for etching a metal or metal oxide without using a reagent, etc., that affects the environment, a method for smoothing a surface of a metal or metal oxide on an atomic level, and a method for patterning on an atomic level. Etching of a metal or metal oxide, or smoothing of a surface of a metal or metal oxide is possible using ozone water in which only ozone is dissolved. Patterning can also be performed by providing a metal that does not dissolve in the ozone water as a resist on a metal or metal oxide that can be etched by ozone water in which only ozone is dissolved, and etching using the ozone water.

First claim

The invention claimed is:

1. A patterning method comprising the step of patterning a surface by etching with ozone water of solely ozone dissolved in water, wherein
the etching is performed after Ti is provided on a metal or metal oxide that is etchable with the ozone water at an etching temperature of 20 to 60° C., and
the metal or the metal oxide is ionized either directly or via an intermediate in the ozone water at a pH of 4.3 to 4.4, and an oxidation-reduction potential of +2.07 V.

2. The patterning method according to claim 1 , wherein the etching involves ultrasonic vibration and/or ultraviolet irradiation.

3. A patterning method comprising the step of patterning a surface by etching with ozone water of solely ozone dissolved in water, wherein
the etching is performed after Ti is provided on a metal or metal oxide that is etchable with the ozone water at an etching temperature of 20 to 60° C., and
the metal or the metal oxide is ionized either directly or via a hydroxide in the ozone water at a pH of 4.3 to 4.4, and an oxidation-reduction potential of +2.07 V.

4. The patterning method according to claim 3 , wherein the etching involves ultrasonic vibration and/or ultraviolet irradiation.

5. A patterning method comprising the step of patterning a surface by etching with ozone water of solely ozone dissolved in water, wherein
the etching is performed after Ti is provided on a metal or metal oxide that is etchable with the ozone water at an etching temperature of 20 to 60° C., and
the metal or the metal oxide is ionized either directly or via an oxide in the ozone water at a pH of 4.3 to 4.4, and an oxidation-reduction potential of +2.07 V.

6. The patterning method according to claim 5 , wherein the etching involves ultrasonic vibration and/or ultraviolet irradiation.

Assignees

• Japan Science & Tech Agency

Inventors

• Yamamoto Takatoki
• HATSUKI Ryuji

Classifications

• H10P50/667

  by liquid etching only · CPC title

• C23F3/06

  with acidic solutions · CPC title

• C23F3/03

  with acidic solutions · CPC title

• C23F1/16

  Acidic compositions (C23F1/42 takes precedence) · CPC title

• C09K13/00

  Etching, surface-brightening or pickling compositions (for glass C03C15/00, {C03C25/66; for mortars, concrete, artificial or natural stone or ceramics C04B41/5338}; for metallic material C23F, C23G1/00, C25F1/00; {for semi-conductors H10P52/40}) · CPC title