Printed circuit board
US-2024057251-A1 · Feb 15, 2024 · US
Solder masks
Solder masks · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/3452 |
| Official title | Solder masks |
| Display label | Solder masks |
| Total patents | 711 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 81 |
| 2016 | 72 |
| 2017 | 66 |
| 2018 | 47 |
| 2019 | 73 |
| 2020 | 65 |
| 2021 | 52 |
| 2022 | 49 |
| 2023 | 68 |
| 2024 | 58 |
| 2025 | 68 |
| 2026 | 12 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Printed circuit board and manufacturing method thereof
US-2015382456-A1 · Dec 31, 2015 · US
Photocurable compositions
US-9217920-B2 · Dec 22, 2015 · US
Method for manufacturing multilayer substrate for having bga-type component thereon
US-2015366080-A1 · Dec 17, 2015 · US
Preparation method for dry film solder resist and film laminate used therein
US-2015366070-A1 · Dec 17, 2015 · US
Surface pretreatment and drop spreading control on multi component surfaces
US-2015359094-A1 · Dec 10, 2015 · US
Circuit substrate and method for manufacturing circuit substrate
US-2015359090-A1 · Dec 10, 2015 · US
Imaging on substrates with aqueous alkaline soluble uv blocking compositions and aqueous soluble uv transparent films
US-2015351249-A1 · Dec 3, 2015 · US
Method for manufacturing printed wiring board and printed wiring board
US-9185806-B2 · Nov 10, 2015 · US
Wiring board
US-9179552-B2 · Nov 3, 2015 · US
Wiring board
US-2015313015-A1 · Oct 29, 2015 · US
Escape routes
US-9171809-B2 · Oct 27, 2015 · US
Multicolor printing
US-2015296627-A1 · Oct 15, 2015 · US
Flip chip interconnection having narrow interconnection sites on the substrate
US-9159665-B2 · Oct 13, 2015 · US
Printed wiring board and method for manufacturing printed wiring board
US-9161445-B2 · Oct 13, 2015 · US
Printed circuit board
US-2015282316-A1 · Oct 1, 2015 · US
Methods and compositions for forming solder bumps on a substrate with radiation curable or thermal curable solder flux
US-2015258638-A1 · Sep 17, 2015 · US
Wiring substrate and semiconductor device using the same
US-2015264809-A1 · Sep 17, 2015 · US
Printed circuit board and method for manufacturing the same
US-9137886-B2 · Sep 15, 2015 · US
Wiring substrate and method for producing wiring substrate
US-9131621-B2 · Sep 8, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/3452?
- CPC H05K3/3452 is the Cooperative Patent Classification code for “Solder masks.”
- How many patents are filed under CPC H05K3/3452 (Solder masks)?
- Our database includes 711 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/3452 growing?
- Publication counts under this code: 58 in 2024 vs 68 in 2025 (latest complete years).