Image sensor package

Patent metadata

Field	Value
Publication number	US-9793309-B2
Application number	US-201514606010-A
Country	US
Kind code	B2
Filing date	Jan 26, 2015
Priority date	Feb 20, 2014
Publication date	Oct 17, 2017
Grant date	Oct 17, 2017

Abstract

Provided is an image sensor package that includes a transparent protection cover for protecting a plurality of unit pixels each including a microlens. The image sensor package includes a substrate which has a first surface and a second surface that are opposite to each other, and includes a sensor array region including a plurality of unit pixels formed in the first surface and a pad region including a pad arranged in the vicinity of the sensor array region, a plurality of microlenses formed on the plurality of unit pixels, respectively, at least two transparent material layers covering the plurality of microlenses, and a transparent protection cover attached onto the plurality of microlenses with the at least two transparent material layers interposed therebetween.

First claim

What is claimed is:

1. An image sensor package, comprising:
a substrate having a first surface and a second surface that are opposite to each other, the substrate including a sensor array region including a plurality of unit pixels formed in the first surface and a pad region including a pad arranged in a vicinity of the sensor array region;
a plurality of microlenses formed on the plurality of unit pixels, each microlense being formed on a corresponding unit pixel, the plurality of microlenses having a first surface that is opposite the plurality of unit pixels that has differences in levels corresponding to the plurality of microlenses;
at least two transparent material layers covering the plurality of microlenses, a first layer of the at least two transparent material layers being conformally formed on the first surface of the plurality of microlenses and having a second surface that is opposite the first surface of the plurality of microlenses, the second surface having differences in levels corresponding to differences in levels of the first surface of the plurality of microlenses; and
a transparent protection cover attached onto the plurality of microlenses with the at least two transparent material layers interposed therebetween,
wherein a second layer of the at least two transparent material layers has a refractive index that is less than a refractive index of the first layer of the at least two transparent material layers and a refractive index of the transparent protection cover.

2. The image sensor package of claim 1 , wherein the at least two transparent material layers fill a space between the sensor array region of the substrate and the transparent protection cover.

3. The image sensor package of claim 1 , wherein the transparent protection cover overlaps the sensor array region in a direction that is substantially perpendicular to the first surface of the substrate and exposes the pad.

4. The image sensor package of claim 1 , wherein at least one of the at least two transparent material layers covers the pad.

5. The image sensor package of claim 4 , wherein one of the at least two transparent material layers exposes at least a portion of the pad in a direction substantially perpendicular to the first surface of the substrate.

6. The image sensor package of claim 1 , further comprising a package base substrate,
wherein the substrate is attached onto the package base substrate.

7. The image sensor package of claim 6 , wherein the package base substrate has an upper surface that defines a recess, and wherein the substrate is attached to the inside of the recess.

8. The image sensor package of claim 7 , wherein the first surface of the substrate has a level which is lower than that of an uppermost surface of the package base substrate.

9. The image sensor package of claim 6 , further comprising:
a bonding wire connecting the pad to the package base substrate; and
an opaque resin layer surrounding the bonding wire and covering lateral sides of the substrate and the transparent protection cover.

10. The image sensor package of claim 1 , further comprising a through electrode which is electrically connected to the pad and passes through the substrate to be exposed through the second surface of the substrate,
wherein the substrate and the transparent protection cover have the same area and overlap each other in a direction substantially perpendicular to the first surface of the substrate.

11. The image sensor package of claim 1 , wherein an infrared shielding film is formed on a lower surface of the transparent protection cover.

12. An image sensor package, comprising:
a package base substrate;
a substrate having a first surface and a second surface that are opposite to each other, the substrate including a sensor array region including a plurality of unit pixels formed in the first surface and a pad region including a pad arranged in a vicinity of the sensor array region, and the substrate attached onto the package base substrate so that the second surface of the substrate faces the package base substrate;
a plurality of microlenses formed on the plurality of unit pixels, each microlense being formed on a corresponding unit pixel, the plurality of microlenses having a first surface that is opposite the plurality of unit pixels that has differences in levels corresponding to the plurality of microlenses;
a first transparent material layer covering the substrate and exposing at least a portion of the pad, the first transparent material layer being conformally formed on the first surface of the plurality of microlenses and having a second surface that is opposite the first surface of the plurality of microlenses, the second surface of the first transparent material layer having differences in levels corresponding to differences in levels of the first surface of the plurality of microlenses;
a second transparent material layer formed on the first transparent material layer; and
a transparent protection cover attached onto the first transparent material layer with the second transparent material layer interposed therebetween, the transparent protection cover covering an entire area of the entire sensor array region in a direction substantially perpendicular to the first surface of the substrate, and exposing the pad,
wherein the second transparent layer has a refractive index that is less that a refractive index of the first transparent material layer and a refractive index of the transparent protection cover.

13. The image sensor package of claim 12 ,
wherein the package base substrate has an upper surface that defines a recess, and
wherein the substrate is attached to inside of the recess so that the first surface of the substrate is positioned within the recess.

14. The image sensor package of claim 13 , further comprising an opaque resin layer that covers lateral sides of the substrate and the transparent protection cover and fills the recess.

15. An image sensor package, comprising:
a package base substrate;
a substrate having a first surface and a second surface that are opposite to each other, the substrate including a sensor array region comprising a plurality of unit pixels formed in the first surface and a pad region comprising a pad arranged in the vicinity of the sensor array region, and the substrate attached onto the package base substrate so that the second surface faces the package base substrate;
a plurality of microlenses formed on the plurality of unit pixels, respectively, each microlense being formed on a corresponding unit pixel, the plurality of microlenses having a first surface that is opposite the plurality of unit pixels that has differences in levels corresponding to the plurality of microlenses;
a first transparent material layer formed on the substrate to cover the plurality of microlenses and the pad, the first transparent material layer being conformally formed on the first surface of the plurality of microlenses and having a second surface that is opposite the first surface of the plurality of microlenses, the second surface of the first transparent material layer having differences in levels corresponding to differences in levels of the first surface of the plurality of microlenses;
a second transparent material layer formed on the first transparent material layer to not cover the pad in a direction substantially perpendicular to the first surface of the substrate; and
a transparent protection cover covering the sensor array region in a direction substantially perpendicular to the first surface of the substrate with the first and second transparent material la

Assignees

• Samsung Electronics Co Ltd
• Furex Co Ltd

Inventors

• Seo Byoung-Rim
• Choi Yoon-Young
• Choi Kyoung-Sei
• Jin Chang-Soo
• Mok Seung-Kon
• Suh Tae-Weon
• Kim Pyoung-Wan

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/01515

  Forming coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/075

  of bond wires · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title