Compliant thermal contact device and method

Patent metadata

Field	Value
Publication number	US-9791501-B2
Application number	US-201213625334-A
Country	US
Kind code	B2
Filing date	Sep 24, 2012
Priority date	Sep 24, 2012
Publication date	Oct 17, 2017
Grant date	Oct 17, 2017

Abstract

Examples of thermal contact devices and methods are shown. Compliant thermal contact devices are shown that include interleaved conducting structures to provide a high thermal conduction contact area. Selected examples include a thermal interface material located at the interleaved interface between the conducting structures. Selected examples also include designs for alternate chip orientations.

First claim

What is claimed is:

1. A thermal contact device, comprising;
a first physically compliant thermally conducting device contact pad;
a first number of thermal conducting structures protruding from the device contact pad;
a heat distributing pad located adjacent to the device contact pad, and movable with respect to the device contact pad;
a second number of thermal conducting structures protruding from the heat distributing pad, wherein the first number of thermal conducting structures and the second number of thermal conducting structures are interleaved with one another;
two rigid thermally conducting device contact pads located adjacent to the first physically compliant thermally conducting device, wherein the first physically compliant thermally conducting device contact pad and the two rigid thermally conducting device contact pads are each configured to simultaneously be in communication with individual chips of a number of chips to be tested; and
a heat source separate from the number of chips to be tested, the heat source coupled to the heat distributing pad.

2. The thermal contact device of claim 1 , further including a thermal interface material located at an interface between the first number of thermal conducting structures and the second number of thermal conducting structures.

3. The thermal contact device of claim 2 , wherein the thermal interface material includes a heat conducting grease.

4. The thermal contact device of claim 1 , wherein the first and second number of thermal conducting structures include fins.

5. The thermal contact device of claim 1 , further including a biasing device to provide a contact pad pressure.

6. The thermal contact device of claim 5 , wherein the biasing device includes a metallic spring.

7. The thermal contact device of claim 5 , wherein the biasing device includes one or more Belleville washers.

8. The thermal contact device of claim 1 , further including one or more guide pins coupled between the device contact pad and the heat distributing pad.

9. A thermal testing device, comprising;
a test fixture base;
a plurality of semiconductor chip thermal test fixtures coupled to the test fixture base, wherein at least one semiconductor chip thermal test fixture is a physically compliant semiconductor chip thermal test fixture capable of moving independently from other fixed thermal test fixtures in the plurality, and at least one other semiconductor chip thermal test fixture is a rigid semiconductor chip thermal test fixture, the physically compliant semiconducting thermal test fixture including:
a thermally conducting device contact pad;
a first number of thermal conducting structures protruding from the device contact pad;
a heat distributing pad located adjacent to the device contact pad, and movable with respect to the device contact pad;
a second number of thermal conducting structures protruding from the heat distributing pad, wherein the first number of conducting structures and the second number of conducting structures are interleaved with one another,
a viscous thermal interface material in contact between the first number of thermal conducting structures and the second number of thermal conducting structures; and
a heat source separate from a number of chips to be tested, the heat source coupled to each heat distributing pad in the number of test fixtures; and
wherein the plurality of semiconductor chip thermal test fixtures are each configured to be in communication with individual chips of the number of chips to be tested.

10. The thermal testing device of claim 9 , wherein the plurality of semiconductor chip thermal test fixtures includes two fixed semiconductor chip thermal test fixtures and one physically compliant semiconductor chip thermal test fixture.

11. The thermal testing device of claim 9 , wherein the plurality of semiconductor chip thermal test fixtures are arranged in a substantially straight line.

12. The thermal testing device of claim 9 , wherein the first and second number of thermal conducting structures include fins.

13. The thermal testing device of claim 9 , further including a biasing device to provide a contact pad pressure.

14. The thermal testing device of claim 13 , wherein the biasing device includes a metallic spring.

15. The thermal testing device of claim 13 , wherein the biasing device includes one or more Belleville washers.

Assignees

• Intel Corp

Inventors

• Diglio Paul
• Song David W

Classifications

• F28F2013/005

  Thermal joints · CPC title

• G01R31/2875 Primary

  related to heating · CPC title

• G01R31/2863

  Contacting devices, e.g. sockets, burn-in boards or mounting fixtures (in general G01R1/04) · CPC title