Method of forming ANA regions in an integrated circuit

Patent metadata

Field	Value
Publication number	US-9786545-B1
Application number	US-201615271519-A
Country	US
Kind code	B1
Filing date	Sep 21, 2016
Priority date	Sep 21, 2016
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

A method includes providing a structure having a first hardmask layer, interposer layer, second hardmask layer and mandrel layer disposed respectively over a dielectric stack. An array of mandrels is patterned into the mandrel layer with a mandrel mask. An ANA trench is patterned into the mandrel layer with a first cut mask. The ANA trench is patterned into the interposer layer with a second cut mask. An organic planarization layer (OPL) is disposed over the structure. The OPL is etched to dispose it only in the ANA trench such that a top surface of the OPL is lower than the second hardmask layer. The structure is etched to form a pattern in a dielectric layer of the dielectric stack to form an array of metal lines in the dielectric layer, a portion of the pattern formed by the ANA trench forms an ANA region within the dielectric layer.

First claim

What is claimed is:

1. A method comprising:
providing a structure having a first hardmask layer, interposer layer, second hardmask layer and mandrel layer disposed respectively over a dielectric stack;
patterning an array of mandrels into the mandrel layer with a mandrel mask;
patterning an ANA trench into the mandrel layer with a first cut mask;
patterning the ANA trench into the interposer layer with a second cut mask;
disposing an organic planarization layer (OPL) over the structure;
etching the OPL to dispose the OPL only in the ANA trench such that a top surface of the OPL is lower than the second hardmask layer;
etching the structure to form a pattern in a dielectric layer of the dielectric stack; and
forming an array of alternating mandrel and non-mandrel metal lines from the pattern in the dielectric layer, a portion of the pattern formed by the ANA trench forming an ANA region within the dielectric layer.

2. The method of claim 1 comprising:
disposing a spacer layer over the structure after patterning the ANA trench into the interposer layer; and
etching the spacer layer to form an array of spacers disposed on sidewalls of the mandrels, to expose top surfaces of the mandrels in the mandrel layer and to expose the first hardmask layer at a bottom of the ANA trench.

3. The method of claim 2 comprising:
removing the mandrels to expose the second hardmask layer; and
selectively etching the second hardmask layer to expose the interposer layer without etching away the spacers.

4. The method of claim 3 comprising:
selectively etching the interposer layer to expose the first hardmask layer without etching away the spacers and OPL, the spacers, OPL and first hardmask layer forming the pattern; and
anisotropically etching the pattern into the dielectric layer of the dielectric stack.

5. The method of claim 1 comprising:
forming a beta trench into a mandrel of the mandrel layer with the first cut mask;
utilizing the beta trench to form a portion of the pattern; and
forming a mandrel line cut in a mandrel line of the array of metal lines from the portion of the pattern formed by the beta trench.

6. The method of claim 1 comprising:
forming a gamma trench into the interposer layer between mandrels of the mandrel layer with the second cut mask;
utilizing the gamma trench to form a portion of the pattern; and
forming a non-mandrel line cut in a non-mandrel line of the array of metal lines from the portion of the pattern formed by the gamma trench.

7. The method of claim 1 wherein the ANA region extends through the mandrel and non-mandrel metal lines of the array of metal lines.

8. The method of claim 1 wherein the step of etching the OPL comprises etching the OPL selectively relative to the mandrels, interposer layer and the spacers.

9. The method of claim 1 wherein the interposer layer has a predetermined thickness that is thick enough to enable the OPL to be etched in a controlled manner such that:
the OPL is removed from the entire structure except from that of the ANA trench,
the top surface of the OPL is lower than a bottom surface of the second hardmask layer, and
no portion of the first hard mask layer at a bottom of the ANA trench is exposed.

10. The method of claim 1 wherein the interposer layer is a spin-on-hardmask.

11. The method of claim 1 wherein the interposer layer is a spin-on-hardmask.

12. A method comprising:
providing a structure having a first hardmask layer, interposer layer, second hardmask layer and mandrel layer disposed respectively over a dielectric stack;
patterning an array of mandrels into the mandrel layer with a mandrel mask;
patterning a beta trench and an ANA trench into the mandrel layer with a first cut mask;
patterning a gamma trench and the ANA trench into the interposer layer with a second cut mask;
disposing an organic planarization layer (OPL) over the structure;
etching the OPL to dispose the OPL only in the ANA trench;
etching the structure to form a pattern in the dielectric stack; and
forming an array of metal lines from the pattern in the dielectric stack, a portion of the pattern formed by the ANA trench forming an ANA region within the dielectric stack.

13. The method of claim 12 comprising etching the OPL such that a top surface of the OPL is lower than the second hardmask layer.

14. The method of claim 12 comprising:
etching the structure to form the pattern in a dielectric layer of the dielectric stack; and
forming an array of alternating mandrel and non-mandrel metal lines from the pattern in the dielectric layer, the portion of the pattern formed by the ANA trench forming the ANA region in the dielectric layer.

15. The method of claim 14 comprising:
utilizing the beta trench to form a portion of the pattern;
utilizing the gamma trench to form a portion of the pattern;
forming a mandrel line cut in a mandrel line of the array of metal lines from the portion of the pattern formed by the beta trench; and
forming a non-mandrel line cut in a non-mandrel line of the array of metal lines from the portion of the pattern formed by the gamma trench.

16. The method of claim 12 comprising:
disposing a spacer layer over the structure after patterning the ANA trench into the interposer layer; and
etching the spacer layer to form an array of spacers disposed on sidewalls of the mandrels and on sidewalls of the ANA trench, to expose top surfaces of the mandrels in the mandrel layer and to expose the first hardmask layer at a bottom of the ANA trench.

17. The method of claim 16 comprising:
removing the mandrels to expose the second hardmask layer; and
selectively etching the second hardmask layer to expose the interposer layer without etching away the spacers.

18. The method of claim 17 comprising:
selectively etching the interposer layer to expose the first hardmask layer without etching away the spacers and OPL, the spacers, OPL and first hardmask layer forming the pattern; and
anisotropically etching the pattern into a dielectric layer of the dielectric stack.

19. The method of claim 12 wherein the step of etching the OPL comprises etching the OPL selectively relative to the mandrels and the spacers.

20. The method of claim 12 wherein the interposer layer has a predetermined thickness that is thick enough to enable the OPL to be etched in a controlled manner such that:
the OPL is removed from the entire structure except from that of the ANA trench,
the top surface of the OPL is lower than a bottom surface of the second hardmask layer, and
no portion of the first hard mask layer at a bottom of the ANA trench is exposed.

Assignees

• Globalfoundries Inc

Inventors

• Bouche Guillaume
• Stephens Jason Eugene
• Kim Byoung Youp
• Child Jr Craig Michael
• Narasimha Shreesh

Classifications

• H10P95/06

  Planarisation of inorganic insulating materials · CPC title

• H10P76/4085 Primary

  characterised by the processes involved to create the masks · CPC title

• H10P50/287

  by chemical means · CPC title

• H10P50/73 Primary

  using masks for insulating materials · CPC title

• H10W20/089

  using processes for implementing desired shapes or dispositions of the openings, e.g. double patterning · CPC title