Substrate supporting table, substrate processing apparatus, and manufacture method for semiconductor device

Patent metadata

Field	Value
Publication number	US-9786528-B2
Application number	US-201213407091-A
Country	US
Kind code	B2
Filing date	Feb 28, 2012
Priority date	Mar 4, 2011
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

The substrate supporting table includes a supporting plate that supports a substrate, a peripheral wall that encompasses a flow path of a coolant under the supporting plate and has an upper end enclosed by the supporting plate, a lower cover that encloses a bottom portion of the flow path and encloses a lower end of the peripheral wall. The substrate supporting table further includes a coolant supplying component that supplies a coolant through an upstream input of the flow path, a discharging component that discharges the coolant through a downstream output of the flow path, and a partition disposed between a supplying hole of the coolant supplying component and a discharging hole of the discharging component. A gap is formed between the partition and the bottom portion of the flow path.

First claim

What is claimed is:

1. A substrate supporting table, comprising:
a supporting plate configured to support a substrate;
a cylindrical peripheral wall, an upper end of the peripheral wall being enclosed by the supporting plate;
a lower cover configured to enclose a lower end of the peripheral wall;
a pillar-shaped member connecting the supporting plate and the lower cover and disposed in a region surrounded by the peripheral wall;
a ring-shaped flow path of a liquid coolant being between the peripheral wall and the pillar-shaped member and configured to pass the liquid coolant in one direction along the ring-shaped flow path;
a supplying hole formed at an upstream input of the ring-shaped flow path;
a discharging hole formed at a downstream output of the ring-shaped flow path;
an inner wall configured to contact the lower cover and connect the pillar-shaped member to the peripheral wall, the inner wall being between the supplying hole and the discharging hole such that a flow of the liquid coolant from the supplying hole to the discharging hole opposite to the one direction along the ring-shaped flow path is prevented by the inner wall; and
partitions disposed in the ring-shaped flow path between the supplying hole and the discharging hole, and configured to form a gap between each of the partitions and a bottom portion of the ring-shaped flow path, the partitions intersecting with the ring-shaped flow path such that a flow direction of the liquid coolant passing through the gap intersects with an elongate direction of the partitions,
wherein a distance between the peripheral wall and an end portion, which faces the peripheral wall, of at least one of the partitions is different from a distance between the peripheral wall and an end portion, which faces the peripheral wall, of at least another one of the partitions adjacent to the at least one partition, and
wherein each partition of a pair of adjacent partitions is spaced apart from the peripheral wall and the pillar-shaped member at different distances.

2. The substrate supporting table of claim 1 , wherein the partitions are disposed in a radial direction which intersect with an outer circumference direction of the peripheral wall.

3. The substrate supporting table of claim 1 ,
wherein the supplying hole is formed between a partition among the partitions adjacent to the supplying hole and the inner wall, and
wherein a direct distance between the peripheral wall and an end portion, which faces the peripheral wall, of the partition adjacent to the supplying hole is shorter than a direct distance between the pillar-shaped member and an end portion, which faces the pillar-shaped member, of the partition adjacent to the supplying hole, and a direct distance between the end portion, which faces the peripheral wall, of the partition adjacent to the supplying hole and the supplying hole is shorter than a direct distance between the end portion, which faces the pillar-shaped member, of the partition adjacent to the supplying hole and the supplying hole.

4. The substrate supporting table of claim 1 ,
wherein the discharging hole is formed between a partition among the partitions adjacent to the discharging hole and the inner wall, and
wherein a direct distance between the peripheral wall and an end portion, which faces the peripheral wall, of the partition adjacent to the discharging hole is shorter than a direct distance between the pillar-shaped member and an end portion, which faces the pillar-shaped member, of the partition adjacent to the discharging hole, and a direct distance between the end portion, which faces the peripheral wall, of the partition adjacent to the discharging hole and the discharging hole is shorter than a direct distance between the end portion, which faces the pillar-shaped member, of the partition adjacent to the discharging hole and the discharging hole.

5. The substrate supporting table of claim 1 ,
wherein the supplying hole is formed between a partition among the partitions adjacent to the supplying hole and the inner wall, and
wherein a direct distance between the pillar-shaped member and an end portion, which faces the pillar-shaped member, of the partition adjacent to the supplying hole is shorter than a direct distance between the peripheral wall and an end portion, which faces the peripheral wall, of the partition adjacent to the supplying hole, and a direct distance between the end portion, which faces the pillar-shaped member, of the partition adjacent to the supplying hole and the supplying hole is shorter than a direct distance between the end portion, which faces the peripheral wall, of the partition adjacent to the supplying hole and the supplying hole.

6. The substrate supporting table of claim 1 ,
wherein the discharging hole is formed between a partition among the partitions adjacent to the discharging hole and the inner wall, and
wherein a direct distance between the pillar-shaped member and an end portion, which faces the pillar-shaped member, of the partition adjacent to the discharging hole is shorter than a direct distance between the peripheral wall and an end portion, which faces the peripheral wall, of the partition adjacent to the discharging hole, and a direct distance between the end portion, which faces the pillar-shaped member, of the partition adjacent to the discharging hole and the discharging hole is shorter than a direct distance between the end portion, which faces the peripheral wall, of the partition adjacent to the discharging hole and the discharging hole.

7. A substrate processing apparatus, comprising:
a processing chamber configured to process a substrate;
a substrate supporting table disposed inside the processing chamber, and configured to support the substrate;
a gas supplying component configured to supply a processing gas into the processing chamber;
a plasma generating component configured to transform the processing gas, supplied to the processing chamber, into plasma; and
an exhausting component configured to perform exhaust in the processing chamber,
wherein, the substrate supporting table comprises: a supporting plate configured to support the substrate; a cylindrical peripheral wall, an upper end of the peripheral wall being enclosed by the supporting plate; a lower cover configured to enclose a lower end of the peripheral wall; a pillar-shaped member connecting the supporting plate and the lower cover and disposed in a region surrounded by the peripheral wall; a ring-shaped flow path of a liquid coolant being between the peripheral wall and the pillar-shaped member and configured to pass the liquid coolant in one direction along the ring-shaped flow path; a supplying hole formed at an upstream input of the ring-shaped flow path; a discharging hole formed at a downstream output of the ring-shaped flow path; an inner wall configured to contact the lower cover and connect the pillar-shaped member to the peripheral wall, the inner wall being between the supplying hole and the discharging hole such that a flow of the liquid coolant from the supplying hole to the discharging hole opposite to the one direction along the ring-shaped flow path is prevented by the inner wall; and partitions disposed in the ring-shaped flow path between the supplying hole and discharging hole, and configured to form a gap between each of the partitions and a bottom portion of the ring-shaped flow path, the partitions intersecting with the ring-shaped flow path such that a flow direction of the liquid coolant passing through the gap intersects with an elongate direction of the partitions,
wherein a distance between the peripheral wall and an end portion, which faces the peripheral wall, of at least one of the partitions is different from a distance between the p

Assignees

• Sakata Masakazu
• Hitachi Int Electric Inc

Inventors

• Sakata Masakazu

Classifications

• H10P72/10

  using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] · CPC title

• H10P72/0434 Primary

  mainly by convection · CPC title

• H10P50/242

  of Group IV materials · CPC title

• H10P72/70 Primary

  for supporting or gripping · CPC title

• F28F1/128

  Fins with openings, e.g. louvered fins · CPC title