Method and apparatus for substrate rinsing and drying

Patent metadata

Field	Value
Publication number	US-9786523-B2
Application number	US-201414211303-A
Country	US
Kind code	B2
Filing date	Mar 14, 2014
Priority date	Mar 14, 2013
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

A method and apparatus are disclosed for optimizing a rinsing and drying process in semiconductor manufacturing. The optimization seeks to maximize processing throughput while maintaining low defect counts and high device yields, and utilizes simulation and experimental data to set the optimal process parameters for the rinsing and drying process. Improved methods of rinse liquid and purge gas nozzle movement are also disclosed.

First claim

What is claimed is:

1. A method for substrate rinsing and drying, comprising:
loading the substrate into a rinse module, the substrate being mounted horizontally on a rotatable spin chuck within the rinse module;
starting a first flow of rinse liquid from a dispense nozzle onto the substrate;
moving the dispense nozzle horizontally on a dispense nozzle path from the center of the substrate towards the edge of the substrate;
starting a second flow of purge gas from a first purge gas nozzle initially located proximate the center of the substrate, to establish a meniscus of the dispensed rinse liquid on the substrate, wherein the meniscus defines an interface between a wet portion of the substrate radially outward of the meniscus and a dry portion of the substrate radially inward of the meniscus;
moving the first purge gas nozzle horizontally towards the edge of the substrate, so as to cause radial movement of the meniscus and dispensed rinse liquid towards the edge of the substrate, wherein shear stress exerted on the dispensed rinse liquid on the substrate and an air flux above the substrate caused by velocity of the purge gas flowing parallel to the substrate are established; and
during moving the first purge gas nozzle, changing a a distance between the first purge gas nozzle and the dispense nozzle as the meniscus increases radially toward the edge of the substrate to maintain both the shear stress and the air flux at values from the center to the edge of the substrate where the radial movement of the meniscus proceeds uniformly at a maximum rate without splashing of the rinse liquid onto the dry portion and without disruption of the uniform radial movement of the meniscus during movement of the first purge gas nozzle or disruption of the first flow of rinse liquid from the dispense nozzle, or both.

2. The method of claim 1 , wherein the rinse liquid comprises deionized water.

3. The method of claim 1 , wherein the purge gas comprises nitrogen.

4. The method of claim 1 , wherein the dispense nozzle and the first purge gas nozzle are both maintained aligned along a radial line extending outwards from the center of the substrate.

5. The method of claim 1 , wherein the dispense nozzle and the first purge gas nozzle are both maintained aligned respectively along two diametrally-opposing radial lines extending outwards from the center of the substrate.

6. The method of claim 1 , wherein the dispense nozzle and the first purge gas nozzle are azimuthally displaced with respect to one another.

7. The method of claim 1 , wherein the dispense nozzle and the first purge gas nozzle are mounted on a first scanning arm.

8. The method of claim 1 , wherein the dispense nozzle is mounted on a first scanning arm, and the first purge gas nozzle is mounted on a second scanning arm different than the first scanning arm.

9. The method of claim 1 , wherein changing the distance between the first purge gas nozzle further comprises adjusting a height of the first purge gas nozzle above the substrate.

10. The method of claim 1 , wherein the changing of the distance between the first purge gas nozzle is determined by computer simulation or experimental measurement data, or both.

11. The method of claim 1 , wherein a radius of the meniscus is determined by lookup or interpolation from a library of meniscus positions, wherein the library of meniscus positions was formed by experimentally determining the meniscus position.

12. The method of claim 1 , further comprising, during moving the first purge gas nozzle:
starting a third flow of purge gas from a second purge gas nozzle;
moving the second purge gas nozzle horizontally towards the edge of the substrate,
wherein moving the second purge gas nozzle assists in-maintaining both the shear stress and the air flux at values from the center to the edge of the substrate where the radial movement of the meniscus proceeds uniformly at a maximum rate without splashing of the rinse liquid onto the dry portion and without disruption of the uniform radial movement of the meniscus during movement of the second purge gas nozzle towards the edge of the substrate or disruption of the first flow of rinse liquid from the dispense nozzle, or both.

13. The method of claim 7 , wherein the first scanning arm changes the distance between the first purge gas nozzle and the dispense nozzle.

14. The method of claim 12 , wherein the first and second purge gas nozzles are both maintained aligned respectively along two diametrally-opposing radial lines extending outwards from the center of the substrate.

15. The method of claim 12 , wherein the first and second purge gas nozzles are azimuthally displaced with respect to one another.

16. The method of claim 12 , wherein the dispense nozzle and the first purge gas nozzle are mounted on a first scanning arm, and the second purge gas nozzle is mounted on a second scanning arm different than the first scanning arm.

17. The method of claim 12 , wherein a position of the second purge gas nozzle relative to the dispense nozzle and the meniscus is determined by computer simulation or experimental measurement data, or both.

Assignees

• Tokyo Electron Ltd

Inventors

• Fonseca Carlos A
• Carcasi Michael A

Classifications

• H10P72/0411

  for wet cleaning or washing · CPC title

• H10P72/0408

  for drying · CPC title

• H10P70/15

  by wet cleaning only (H10P70/52 takes precedence) · CPC title

• H10P72/0406

  for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title