Tungsten-processing slurry with cationic surfactant and cyclodextrin

US9771496B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9771496-B2
Application numberUS-201514924997-A
CountryUS
Kind codeB2
Filing dateOct 28, 2015
Priority dateOct 28, 2015
Publication dateSep 26, 2017
Grant dateSep 26, 2017

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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Described are chemical-mechanical polishing compositions (e.g., slurries) and methods of using the slurries for chemical-mechanical polishing (or planarizing) a surface of a substrate that contains tungsten, the compositions containing cationic surfactant and cyclodextrin.

First claim

Opening claim text (preview).

The invention claimed is: 1. A chemical mechanical polishing composition useful for processing a tungsten-containing surface, comprising: liquid carrier, abrasive particles dispersed in the liquid carrier, wherein the abrasive particles are colloidal silica particles having a permanent positive charge in a range from about 6 mV to about 50 mV, cyclodextrin selected from alpha-, beta-, gamma-cyclodextrin, or a combination thereof, and cationic surfactant having a cation and a hydrophobic tail that extends from the cation and that includes a chain comprising at least 7 carbon atoms, the cationic surfactant being capable of forming a complex with the cyclodextrin in the slurry. 2. The composition of claim 1 wherein the cationic surfactant has the structure: wherein: n is at least 1, X is P + or N + , R 1 is a straight or branched alkyl group, optionally substituted, optionally containing unsaturation, that contains at least 7 carbon atoms, R 2 , R 3 , and R 4 can independent be selected from: hydrogen, a saturated or unsaturated cyclic group that may be substituted or unsubstituted and may optionally include a heteroatom, a charged group, or both, and a linear or branched alkyl group that may optionally include one or more of unsaturation, a heteroatom, or charged group and a saturated or unsaturated ring structure formed from two or three of R 2 , R 3 , and R 4 , the ring optionally being substituted. 3. The composition of claim 2 wherein R 1 is a linear alkyl of from 7 to 20 carbon atoms. 4. The composition of claim 2 wherein R 2 is an alkyl group comprising not more than 6 carbon atoms. 5. The composition of claim 2 wherein each of R 3 and R 4 is independently an alkyl having from 1 to 6 carbon atoms. 6. The composition of claim 2 wherein the cationic surfactant is dicationic. 7. The composition of claim 6 wherein the surfactant has the formula: wherein R1 is an alkyl group having from 8 to 20 carbon atoms, each R 3 , R 4 , R 5 , R 6 , and R 7 is independently an alkyl group having from 1 to 5 carbon atoms, and Z is a divalent linking group having from 1 to 5 carbon atoms. 8. The composition of claim 7 wherein the dicationic surfactant is N,N,N′,N′, N′-pentamethyl-N-tallow-1,3-propanediammonium dichloride. 9. The composition of claim 1 wherein the cationic surfactant has the formula: wherein: n is at least 1, X is P + or N + , R 1 is a straight or branched alkyl group, optionally containing unsaturation, that contains at least 7 carbon atoms, and R 8 , R 9 , R 10 , R 11 , and R 12 can independent be selected from: hydrogen, a saturated or unsaturated cyclic group that may be substituted or unsubstituted and may optionally include a heteroatom, a charged group, or both, and a linear or branched alkyl group that may optionally include one or more of unsaturation, a heteroatom, or charged group. 10. The composition of claim 9 wherein each of R 8 , R 9 , R 11 , and R 12 is hydrogen and R 10 is an unsaturated cyclic group that may be substituted or unsubstituted and may optionally include a heteroatom (e.g., nitrogen), a charged group (e.g., a charged nitrogen heteroatom), or both. 11. The composition of claim 1 comprising from about 0.001 to about 0.5 weight percent of the cationic surfactant based on total weight composition. 12. The composition of claim 1 comprising from about 0.01 to about 2 weight percent of the beta-cyclodextrin based on total weight composition. 13. The composition of claim 1 comprising a cationic surfactant-cyclodextrin complex of the beta-cyclodextrin associated with the cationic surfactant. 14. The composition of claim 13 comprising from about 0.001 to about 0.5 weight percent of the cationic surfactant-beta cyclodextrin complex. 15. The composition of claim 1 wherein 30 percent or more of the silica abrasive particles include three or more aggregated primary particles. 16. The composition according to claim 1 wherein the silica abrasive particles include a cationic compound incorporated into the particles, wherein the cationic compound is a charged nitrogen-containing compound or a charged phosphorous-containing compound. 17. The composition of claim 1 wherein the silica abrasive particles have a permanent positive charge of at least 10 millivolts. 18. The composition of claim 1 wherein the silica abrasive particles have a mean particle size in a range from about 30 to about 70 nanometers. 19. The composition of claim 1 comprising from about 1 to about 4 weight percent abrasive particles. 20. The composition of claim 1 further comprising: from about 0.001 to about 1 weight percent inhibitor, wherein the inhibitor is an amino alkyl, an amino acid, or a combination thereof, and from about 0.001 to about 0.5 weight percent catalyst. 21. The composition of claim 20 wherein the catalyst is a soluble iron-containing catalyst. 22. The composition of claim 1 further comprising an oxidizing agent.

Assignees

Inventors

Classifications

  • Heavy metals · CPC title

  • C09G1/02Primary

    containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)} · CPC title

  • characterised by the composition or properties of the pad materials · CPC title

  • with acidic solutions · CPC title

  • Abrasive powders, suspensions and pastes for polishing · CPC title

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What does patent US9771496B2 cover?
Described are chemical-mechanical polishing compositions (e.g., slurries) and methods of using the slurries for chemical-mechanical polishing (or planarizing) a surface of a substrate that contains tungsten, the compositions containing cationic surfactant and cyclodextrin.
Who is the assignee on this patent?
Cabot Microelectronics Corp
What technology area does this patent fall under?
Primary CPC classification C09G1/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 26 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).