Semiconductor package
US-2024047418-A1 · Feb 8, 2024 · US
the encapsulations being on at least the sidewalls of the semiconductor body
the encapsulations being on at least the sidewalls of the semiconductor body · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W74/141 |
| Official title | {the encapsulations being on at least the sidewalls of the semiconductor body} |
| Display label | the encapsulations being on at least the sidewalls of the semiconductor body |
| Total patents | 2,657 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 74 |
| 2016 | 124 |
| 2017 | 161 |
| 2018 | 136 |
| 2019 | 184 |
| 2020 | 233 |
| 2021 | 257 |
| 2022 | 297 |
| 2023 | 297 |
| 2024 | 400 |
| 2025 | 405 |
| 2026 | 89 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor package using a coreless signal distribution structure
US-11869879-B2 · Jan 9, 2024 · US
Method of manufacturing semiconductor package
US-2015380275-A1 · Dec 31, 2015 · US
Post-cmos processing and 3d integration based on dry-film lithography
US-2015371978-A1 · Dec 24, 2015 · US
Patterned photoresist to attach a carrier wafer to a silicon device wafer
US-9219044-B2 · Dec 22, 2015 · US
Wiring substrate and method of manufacturing the same
US-2015364405-A1 · Dec 17, 2015 · US
Semiconductor packages and methods of packaging semiconductor devices
US-2015357256-A1 · Dec 10, 2015 · US
Optoelectronic semiconductor component
US-9209328-B2 · Dec 8, 2015 · US
Contact Pad for Semiconductor Device
US-2015348877-A1 · Dec 3, 2015 · US
Semiconductor device
US-9196601-B2 · Nov 24, 2015 · US
Method For Reducing Particle Generation At Bevel Portion Of Substrate
US-2015332949-A1 · Nov 19, 2015 · US
Semiconductor device including semiconductor chip covered with sealing resin
US-2015332986-A1 · Nov 19, 2015 · US
Semiconductor package
US-2015325492-A1 · Nov 12, 2015 · US
Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages
US-9184105-B2 · Nov 10, 2015 · US
Wafer level package and fan out reconstitution process for making the same
US-2015318229-A1 · Nov 5, 2015 · US
Chip package and method for forming the same
US-9177919-B2 · Nov 3, 2015 · US
Chip package comprising alignment mark and method for forming the same
US-9165890-B2 · Oct 20, 2015 · US
Microelectronic package with stacked microelectronic units and method for manufacture thereof
US-9165911-B2 · Oct 20, 2015 · US
Chip package and method for forming the same
US-2015287659-A1 · Oct 8, 2015 · US
Semiconductor Device and Method
US-2015287697-A1 · Oct 8, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W74/141?
- CPC H10W74/141 is the Cooperative Patent Classification code for “the encapsulations being on at least the sidewalls of the semiconductor body.”
- How many patents are filed under CPC H10W74/141 (the encapsulations being on at least the sidewalls of the semiconductor body)?
- Our database includes 2,657 publications tagged with this CPC code.
- Is patent activity under CPC H10W74/141 growing?
- Publication counts under this code: 400 in 2024 vs 405 in 2025 (latest complete years).