Electronic module for a control unit

Patent metadata

Field	Value
Publication number	US-9763344-B2
Application number	US-201214352436-A
Country	US
Kind code	B2
Filing date	Sep 4, 2012
Priority date	Nov 8, 2011
Publication date	Sep 12, 2017
Grant date	Sep 12, 2017

Abstract

An electronic module for a vehicle includes a covering element, a component-carrier printed circuit board element, a carrier element having a first side and a second side, a printed circuit board element, and at least one contact-connection element. The contact-connection element is configured to provide a conductive contact-connection between the component-carrier printed circuit board element and the printed circuit board element. The covering element and component-carrier printed circuit board element are positioned on the first side of the carrier element, and the printed circuit board element is positioned on the second side of the carrier element. The carrier element has at least one opening, and the contact-connection element is led through the opening.

First claim

The invention claimed is:

1. An electronic module for a vehicle, comprising:
a plate formed from a metal material, the plate defining a support element that includes:
a first side;
a second side opposite the first side; and
at least one opening through the support element from the first side to the second side;

a component support printed circuit board element affixed to the first side of the support element;
a printed circuit board element affixed to the second side of the support element, such that the support element is between the component support printed circuit board element and the printed circuit board element, the printed circuit board element being at least one of a printed circuit board having an epoxy resin and a flexible printed circuit board;
a covering element affixed to the first side of the support element so as to encapsulate the component support printed circuit board and the at least one opening in an interior region between the covering element and the support element; and

at least one contact-making element that is conductively connected to the printed circuit board element on the second side of the support element, that passes through the at least one opening and into the interior region, and that is conductively connected to the component support printed circuit board element to provide conductive contact between the component support printed circuit board element and the printed circuit board element;
wherein the support element has at least one cutout with a sealing element between at least one of:
the support element and the covering element; and
the support element and the printed circuit board element.

2. The electronic module as claimed in claim 1 , wherein the electronic module is hermetically sealed.

3. The electronic module as claimed in claim 1 , wherein a material of the covering element and a material of the support element have a similar coefficient of thermal expansion.

4. The electronic module as claimed in claim 1 , wherein at least one of:
the covering element and the support element are connected by a connection from amongst the group consisting of an adhesive connection, a welded connection, an encapsulated connection, and a rivet connection; and
the printed circuit board element and the support element are connected using an adhesive bond.

5. The electronic module as claimed in claim 1 , wherein the support element has a further opening outside the covering element that is configured to connect a conductor element or a sensor element to the printed circuit board element.

6. The electronic module as claimed in claim 1 , wherein the support element and the printed circuit board element each have a respective closable hole in a region inside the covering element.

7. The electronic module as claimed in claim 1 , wherein a molded encapsulation is disposed on the support element in a region outside the covering element.

8. A control unit for a vehicle, comprising:
an electronic module that includes:
a plate formed from a metal material, the plate defining a support element that has:
a first side;
a second side opposite the first side; and
at least one opening through the support element from the first side to the second side;

a component support printed circuit board element affixed to the first side of the support element;
a printed circuit board element affixed to the second side of the support element, such that the support element is between the component support printed circuit board element and the printed circuit board element, the printed circuit board element being at least one of a printed circuit board having an epoxy resin and a flexible printed circuit board;
a covering element affixed to the first side of the support element so as to encapsulate the component support printed circuit board and the at least one opening in an interior region between the covering element and the support element; and
at least one contact-making element that is conductively connected to the printed circuit board element on the second side of the support element, that passes through the at least one opening and into the interior region, and that is conductively connected to the component support printed circuit board element to provide conductive contact between the component support printed circuit board element and the printed circuit board element;
wherein the support element and the printed circuit board element each have a respective closable hole in a region inside the covering element.

9. A vehicle, having at least one of:
(i) an electronic module that includes:
a plate formed from a metal material, the plate defining a support element that has:
a first side;
a second side opposite the first side; and
at least one opening through the support element from the first side to the second side;

a component support printed circuit board element affixed to the first side of the support element;
a printed circuit board element affixed to the second side of the support element, such that the support element is between the component support printed circuit board element and the printed circuit board element, the printed circuit board element being at least one of a printed circuit board having an epoxy resin and a flexible printed circuit board;
a covering element affixed to the first side of the support element so as to encapsulate the component support printed circuit board and the at least one opening in an interior region between the covering element and the support element; and
at least one contact-making element that is conductively connected to the printed circuit board element on the second side of the support element, that passes through the at least one opening and into the interior region, and that is conductively connected to the component support printed circuit board element to provide conductive contact between the component support printed circuit board element and the printed circuit board element;
wherein the support element and the printed circuit board element each have a respective closable hole in a region inside the covering element; and

(ii) a control unit that includes the electronic module.

10. An electronic module for a vehicle, having:
a covering element;
a component support printed circuit board element;
a support element having a first side and a second side;
a printed circuit board element; and
at least one contact-making element configured to provide conductive contact between the component support printed circuit board element and the printed circuit board element;
wherein the covering element and the component support printed circuit board element are positioned on the first side of the support element;
wherein the printed circuit board element is positioned on the second side of the support element;
wherein the support element has at least one opening;
wherein the contact-making element is routed through the opening; and
wherein the support element and the printed circuit board element each have a respective closable hole in a region inside the covering element.

11. The electronic module as claimed in claim 10 , wherein the electronic module is hermetically sealed.

12. The electronic module as claimed in claim 10 , wherein a material of the covering element and a material of the support element have a similar coefficient of thermal expansion.

13. The electronic module as claimed in claim 10 , wherein at least one of:
the covering element and the support element are connected by a connection from amongst the group consisting of an adhesive connection, a welded connection, an encapsulated connection, and a rivet connection; and

Assignees

• Ott Harald
• Bosch Gmbh Robert

Inventors

• Ott Harald

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H10W76/157

  having interconnections parallel to the insulating or insulated base · CPC title

• H10W76/60

  Seals · CPC title