Control module and method for producing same

Patent metadata

Field	Value
Publication number	US-9408291-B2
Application number	US-201113991485-A
Country	US
Kind code	B2
Filing date	Oct 20, 2011
Priority date	Dec 8, 2010
Publication date	Aug 2, 2016
Grant date	Aug 2, 2016

Abstract

A control module includes a circuit board having conductor paths arranged on at least one plane and having at least one rigid, inflexible conductor path section. The control module also includes an electronic control circuit which electrically contacts the conductor paths and has electrical components. The control module also includes a pan-shaped cover part protecting the control circuit. The cover part is arranged over a part of the electronic control circuit and contacts a side of the circuit board in a sealing manner with a flat contact region aligned parallel to the side. At least part of the electronic control circuit is protectively arranged in a housing inner chamber between the cover part and the circuit board, and electrical contacts of the circuit board are provided outside of the housing inner chamber, which is covered by the cover part, to contact electrical components of the control module.

First claim

The invention claimed is:

1. A control module, comprising:
a circuit board configured as a base carrier, the-circuit board including conductor paths arranged at least on one plane of the circuit board, and the circuit board including at least one rigid, non-flexible conductor path region;
an electronic control circuit electrically contacted by the conductor paths of the circuit board, the electronic control circuit including electrical components; and
a bowl-shaped cover part configured as a protection for the electronic control circuit and arranged at least over a part of the electronic control circuit, the cover part including a planar contact region aligned in parallel to a first face of the circuit board and lying in a sealing manner on the first face of the circuit board,
wherein at least a part of the electronic control circuit is arranged in a protected manner in a housing inner chamber formed between the cover part and the circuit board,
wherein electrical contacts of the circuit board are provided outside the housing inner chamber that is covered by the cover part in order to contact the electrical components of the control module,
wherein at least one part of the electronic control circuit is arranged on a carrier substrate arranged in the housing inner chamber,
wherein the carrier substrate is electrically contacted by the conductor paths or contact areas of the circuit board,
wherein a flowable material is applied over the carrier substrate onto the electrical components within the housing inner chamber, and
wherein the flowable material completely fills the housing inner chamber except for volume that is occupied by the carrier substrate and the electrical components.

2. The control module as claimed in claim 1 , further comprising at least one orifice configured to be sealed by a sealing element, the at least one orifice provided in at least one of the cover part and the circuit board to introduce heat-conducting material.

3. The control module as claimed in claim 1 , wherein the flowable material is configured to conduct heat and is configured to form a heat-conducting contact between the electrical components and the cover part.

4. The control module as claimed in claim 1 , further comprising a cooling body in heat-conducting contact with the cover part, the cooling body arranged over the cover part.

5. The control module as claimed in claim 2 , wherein:
the at least one orifice is provided in the cover part, and
the sealing element includes a press-in part that is ball-shaped and is configured to be pressed into the at least one orifice.

6. The control module as claimed in claim 2 , wherein:
the at least one orifice is formed as at least one through-connection having a central through-going cut-out in the circuit board, and
the sealing element is solder applied into the central through-going cut-out of the at least one through-connection.

7. The control module as claimed in claim 1 , wherein the carrier substrate is a multi-layer substrate.

8. The control module as claimed in claim 1 , wherein the carrier substrate is fastened to the first face of the circuit board.

9. The control module as claimed in claim 1 , further comprising:
a metal base plate mounted on a second face of the circuit board,
wherein the carrier substrate is mounted within a cut-out on the metal base plate, and
wherein the cut-out is provided in the circuit board.

10. A method for producing a control module, comprising:
mounting a carrier substrate having an electronic control circuit on a circuit board or within a cut-out in the circuit board on a metal base plate that is connected to the circuit board;
producing an electrical connection between the electronic control circuit on the carrier substrate and conductor paths or contact areas on the circuit board;
placing a bowl-shaped cover part over the electronic control circuit so that the bowl-shaped cover part lies with a planar contact area on a first face of the circuit board to produce a circumferential sealed connection;
introducing a flowable material through at least one orifice in the cover part or in the circuit board into a housing inner chamber that is formed between the cover part and the circuit board to completely fill the housing inner chamber except for volume that is occupied by the carrier substrate and electrical components of the electronic control circuit; and
sealing the at least one orifice with a sealing element.

11. The method as claimed in claim 10 , further comprising performing a leak test on the housing inner chamber by applying an overpressure or an underpressure prior to introducing the flowable material through the at least one orifice.

Assignees

• Ott Harald
• Bosch Gmbh Robert

Inventors

• Ott Harald

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H05K1/141

  One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence) · CPC title

• H01L2924/19107

  Electricity · mapped topic

• H01L2224/48091

  Electricity · mapped topic

• H05K3/284

  for encapsulating mounted components (H05K1/185 takes precedence) · CPC title