Transmission control module

Patent metadata

Field	Value
Publication number	US-9532460-B2
Application number	US-201214366503-A
Country	US
Kind code	B2
Filing date	Oct 30, 2012
Priority date	Dec 19, 2011
Publication date	Dec 27, 2016
Grant date	Dec 27, 2016

Abstract

A transmission control module includes a printed circuit board. The circuit board has conductor tracks routed on at least one layer of the circuit board and configured to electrically connect a carrier substrate to electrical components. The circuit board has an inner conductor track layer arranged between two insulating layers. A first outer insulating layer, at least on a first side of the circuit board, has a recess. Surfaces of conductor track sections of conductor tracks of the at least one inner conductor track layer are arranged at the bottom of the recess. The carrier substrate is inserted into the recess and makes electrical contact with the surfaces of the conductor track sections. The recess is filled with a moulding compound which covers at least the carrier substrate and the conductor track sections to protect the carrier substrate and the conductor track sections from transmission fluid.

First claim

The invention claimed is:

1. A transmission control module, comprising:
a printed circuit board at least partially accessible from outside, the printed circuit board configured to be exposed to transmission fluid and including conductor tracks routed on at least one layer of the printed circuit board and configured to electrically connect a carrier substrate of an electronic transmission control circuit to electrical/electronic components arranged outside the carrier substrate on the printed circuit board, the printed circuit board having at least one inner conductor track layer arranged as an intermediate layer between two insulating layers of the printed circuit board, wherein:
the printed circuit board has a first side and a second side facing opposite the first side, the first side of the printed circuit board has a first outer insulating layer including a first recess, and the second side of the printed circuit board has a second outer insulating layer including a second recess,
the second recess is taken through to a rear side of the carrier substrate, the rear side of the carrier substrate faces away from the first side of the printed circuit board and is loaded with components,
surfaces of conductor track portions of conductor tracks of the at least one inner conductor track layer are arranged on a base of the first recess,
the carrier substrate is configured to be inserted into the first recess from the first side of the printed circuit board and brought into electrical contact with the surfaces of the conductor track portions of the inner conductor track layer, and
the first recess is filled with a molding compound to cover at least the carrier substrate and the conductor track portions to protect the carrier substrate and the conductor track portions from transmission fluid, and the second recess is filled with the molding compound covering the rear side of the carrier substrate to protect the rear side of the carrier substrate from transmission fluid.

2. The transmission control module as claimed in claim 1 , wherein the first recess is filled completely with the molding compound and, on the first side of the printed circuit board, an outer peripheral surface of the printed circuit board surrounding the recess is covered by the molding compound.

3. The transmission control module as claimed in claim 1 , wherein the carrier substrate is brought into electrical contact with the surfaces of the conductor track portions of the conductor tracks by bonding wires.

4. The transmission control module as claimed in claim 1 , wherein the carrier substrate is brought into electrical contact with the surfaces of the conductor track portions of the conductor tracks on the rear side by contact elements.

5. The transmission control module as claimed in claim 4 , wherein the contact elements are formed by one of conductive adhesive and solder contacts.

6. A transmission control module, comprising:
a printed circuit board at least partially accessible from outside, the printed circuit board configured to be exposed to transmission fluid and including conductor tracks routed on at least one layer of the printed circuit board and configured to electrically connect a carrier substrate of an electronic transmission control circuit to electrical/electronic components arranged outside the carrier substrate on the printed circuit board, the printed circuit board having at least one inner conductor track layer arranged as an intermediate layer between two insulating layers of the printed circuit board, wherein:
a first side of the printed circuit board has a first outer insulating layer including a recess,
surfaces of conductor track portions of conductor tracks of the at least one inner conductor track layer are arranged on a base of the recess,
the carrier substrate is configured to be inserted into the recess from the first side of the printed circuit board and brought into electrical contact with the surfaces of the conductor track portions of the inner conductor track layer,
the recess is filled with a molding compound to cover at least the carrier substrate and the conductor track portions to protect the carrier substrate and the conductor track portions from transmission fluid,
the carrier substrate is applied in a heat-conducting manner to a large-area conductor track of the inner conductor track layer within the recess,
the large-area conductor track is configured to laterally dissipate heat generated during operation by the transmission control circuit located on the carrier substrate, and
the large-area conductor track is configured to extend on at least one side beyond a lateral extent of the carrier substrate.

7. The transmission control module as claimed in claim 6 , wherein:
on at least one side of the carrier substrate, the large-area conductor track extends beyond lateral dimensions of the carrier substrate up to a conductor track portion,
the conductor track portion is connected in a heat-conducting manner to conductor tracks configured to serve as cooling areas, on at least one of the first side and a second side of the printed circuit board.

8. The transmission control module as claimed in claim 7 , wherein the conductor tracks configured to serve as cooling areas on at least one of the first side and the second side of the printed circuit board are connected in a heat-conducting manner to a heat sink.

9. A transmission control module, comprising:
a printed circuit board at least partially accessible from outside, the printed circuit board configured to be exposed to transmission fluid and including conductor tracks routed on at least one layer of the printed circuit board and configured to electrically connect a carrier substrate of an electronic transmission control circuit to electrical/electronic components arranged outside the carrier substrate on the printed circuit board, the printed circuit board having at least one inner conductor track layer arranged as an intermediate layer between two insulating layers of the printed circuit board, wherein:
the printed circuit board has a first inner conductor track layer and a second inner conductor track layer kept at a distance from one another by at least one inner insulating layer,
the printed circuit board has a first side and a second side facing opposite the first side, the first side of the printed circuit board has a first outer insulating layer including a first recess which is adjoined by a further recess in the inner insulating layer,
lateral dimensions of the further recess are smaller than dimensions of the first recess,
the carrier substrate is inserted from the first side of the printed circuit board into the first recess of the first outer insulating layer and the further recess of the inner insulating layer,
the carrier substrate is electrically connected to surfaces of conductor track portions of the first inner conductor track layer by bonding wires,
a rear side of the carrier substrate, which is facing away from the first side of the printed circuit board, is electrically connected to surfaces of conductor track portions of conductor tracks of the second inner conductor track layer by contact elements, and
the recess is filled with a molding compound to cover at least the carrier substrate and the conductor track portions to protect the carrier substrate and the conductor track portions from transmission fluid.

Assignees

• Bosch Gmbh Robert

Inventors

• Meier Thomas
• Mueller-Vogt Ingo

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/114 Primary

  by a substrate and the encapsulations · CPC title