Card de-bowing mechanism

Patent metadata

Field	Value
Publication number	US-9751253-B2
Application number	US-201615172402-A
Country	US
Kind code	B2
Filing date	Jun 3, 2016
Priority date	May 23, 2013
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

A substrate de-bowing mechanism, system and method are described. The mechanism can include a substrate support, one or more stationary contact members, and one or more dynamic or movable contact members that are adapted to contact the substrate and bend the substrate in a desired direction to reduce or eliminate bowing of the substrate. The mechanism is controlled by a CPU or other controller that can adjust the de-bow parameters of the de-bowing mechanism based on input settings that can be dynamic and/or static settings. The mechanism can be used to de-bow a variety of substrates including plastic cards, passports, and passport pages.

First claim

The invention claimed is:

1. A substrate processing system, comprising:
a substrate transport mechanism that transports a substrate through the substrate processing system in a substrate transport direction along a substrate travel path;
a lamination mechanism disposed along the substrate travel path, the lamination mechanism is configured to apply a laminate to the substrate;
a substrate de-bowing mechanism disposed along the substrate travel path, the substrate de-bowing mechanism has an axial footprint, measured between a pair of movable card contact members at a first home position and that are used to de-bow the substrate, the pair of movable card contact members are disposed on a first side of the substrate travel path when at the first home position and are rotatably movable to a second home position on a second side of the substrate travel path; and
the substrate de-bowing mechanism further includes a stationary card contact member disposed on the second side of the substrate travel path midway along the axial footprint, the stationary card contact member is not movable toward or away from the substrate travel path.

2. The substrate processing system of claim 1 , wherein the substrate is a plastic card having a nominal length of 3.370 inches, and the axial footprint is less than about 80 percent of the nominal length.

3. The substrate processing system of claim 1 , wherein the system is a desktop card processing machine or a central card issuance system.

4. The substrate processing system of claim 3 , wherein the system is a desktop card processing machine.

5. The substrate processing system of claim 1 , wherein the system further includes a print mechanism, and the substrate de-bowing mechanism is downstream of the lamination mechanism.

Assignees

• Entrust Datacard Corp

Inventors

• Zaborowski Alexander Kelly
• Wickstrom David E
• Juriasingani Rajesh Kalachand

Classifications

• B32B37/14

  characterised by the properties of the layers · CPC title

• Y10T156/1002

  with permanent bending or reshaping or surface deformation of self sustaining lamina · CPC title

• B32B37/0015

  to avoid warp or curl · CPC title

• B32B2037/0061

  the apparatus being an office laminator · CPC title

• B29L2017/006

  Memory cards, chip cards · CPC title