Nozzle for heating device, heating device, and nozzle for cooling device

Patent metadata

Field	Value
Publication number	US-9751146-B2
Application number	US-201013497245-A
Country	US
Kind code	B2
Filing date	Aug 3, 2010
Priority date	Sep 24, 2009
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

To achieve an improvement of heat exchanger effectiveness (heat transfer rate) without any increase of a fan motor output.
The gas heated by the heating units or the gas cooled down by the cooling units is sent to the blowing nozzles 2 by a fan. Then, the blowing nozzles 2 blow the gas sent by the fan through their outlets. Each of the outlets has a non-circular planar shape with a projection portion thereof being projected inwardly. This allows a shape of the gas in cross section perpendicular to a direction where the gas is blown through the outlet of each of the blowing nozzles 2 to be changed by the projection portion with time (switching phenomenon). Such a switching phenomenon enables to be increased the heat exchanger effectiveness (heat transfer rate) on the printed board even if any output of the fan motor for rotating the fan does not increase.

First claim

What is claimed is:

1. A heating device of a soldering apparatus, the heating device comprising:
a fan that suctions gas and blows the suctioned gas;
a heater that heats the gas;
a blowing nozzle having a nozzle body part in which a gas flow path is defined for flow of the gas heated by the heater, and the blowing nozzle blows the gas heated by the heater through the gas flow path, which is perpendicular to a printed circuit board, and wherein the gas flow path converges from gas supply side to a gas discharge side of the nozzle body part in a gas discharging direction, and the blowing nozzle having an outlet for discharging the gas heated by the heater, the outlet defining an aperture having a non-circular planar shape that is a cross shape, a star shape or a polygonal shape, the shape including plural inwardly directed projection portions thereof each projecting inwardly from a point on a virtual circle surrounding the aperture of the outlet;
a nozzle cover having a hole for fitting the blowing nozzle and a first suction port for suctioning a quantity of the gas reflected after hitting a printed circuit board to be heated; and
a fitting plate that has a second suction port for recirculating the gas suctioned through the first suction port to the heater, and that fits the blowing nozzle and the nozzle cover,
wherein the heater is provided between the fan and the second suction port of the fitting plate, the suctioned quantity of the gas reflected after hitting the printed circuit board is recirculated through the first and second suction ports, and the recirculated gas is driven to the blowing nozzle by the fan after being heated by the heater.

2. A cooling device of a soldering apparatus, the cooling device comprising:
a fan that suctions gas and blows the suctioned gas;
a cooling mechanism that cools down the gas;
a blowing nozzle having a nozzle body part in which a gas flow path is defined for flow of the gas cooled down by the cooling mechanism, and the blowing nozzle blows the gas cooled by the cooling mechanism through the gas flow path, which is perpendicular to a printed circuit board, and wherein the gas flow path converges, from a gas supply side to a gas discharge side of the nozzle body part in a gas discharging direction, and the blowing nozzle having an outlet for discharging the gas cooled by the cooling mechanism, the outlet defining an aperture having a non-circular planar shape that is a cross shape, a star shape or a polygonal shape, the shape including plural inwardly directed projection portions thereof each projecting inwardly from a point on a virtual circle surrounding the aperture of the outlet;
a nozzle cover having a hole for fitting the blowing nozzle and a first suction port for suctioning a quantity of the gas reflected after hitting a printed circuit board to be cooled; and
a fitting plate that has a second suction port for recirculating the gas suctioned through the first suction port to the cooling mechanism, and that fits the blowing nozzle and the nozzle cover, wherein the cooling mechanism is provided between the fan and the second suction port of the fitting plate, the suctioned quantity of the gas reflected after hitting the printed circuit board is recirculated through the first and second suction ports, and the recirculated gas is driven to the blowing nozzle by the fan after being cooled by the cooling mechanism.

3. A heating device of a soldering apparatus, the heating device comprising:
a fan that suctions gas and blows the suctioned gas;
a heater that heats the gas; and

a plate in which a gas flow path is defined for flow of the gas heated by the heater, and the plate directs the gas heated by the heater through the gas flow path, which is perpendicular to a printed circuit board, and wherein the gas flow path is parallel from a gas supply side to a gas discharge side of the plate in a gas discharging direction, and the plate having an outlet for blowing the gas heated by the heater and a suction port for suctioning a quantity of the gas reflected after hitting a printed circuit board to be heated, the outlet defining an aperture having a non-circular planar shape that is a cross shape, a star shape or a polygonal shape, the shape including plural inwardly directed projection portions thereof each projecting inwardly from a point on a virtual circle surrounding the aperture of the outlet,
wherein the heater is provided between the fan and the suction port of the plate and the suctioned quantity of the gas reflected after hitting the printed circuit board is recirculated to the fan through the suction port and the recirculated gas is driven to the outlet by the fan after being heated by the heater.

4. A cooling device of a soldering apparatus, the cooling device comprising:
a fan that suctions gas and blows the suctioned gas;
a cooling mechanism that cools down the gas; and

a plate in which a gas flow path is defined for flow of the gas cooled down by the cooling mechanism, and the plate directs the gas cooled by the cooling mechanism through the gas flow path, which is perpendicular to a printed circuit board, wherein the gas flow path is parallel from a gas supply side to a gas discharge side of the plate in a gas discharging direction, and the plate having an outlet for blowing the gas cooled by the cooling mechanism and a suction port for suctioning a quantity of the gas reflected after hitting a printed circuit board to be cooled, the outlet defining an aperture having a non-circular planar shape that is a cross shape, a star shape or a polygonal shape, the shape including plural inwardly directed projection portions thereof each projecting inwardly from a point on a virtual circle surrounding the aperture of the outlet,
wherein the cooling mechanism is provided between the fan and the suction port of the plate and the suctioned quantity of the gas reflected after hitting the printed circuit board is recirculated through the suction port and the recirculated gas is driven to the outlet by the fan after being cooled by the cooling mechanism.

5. A heating device of a soldering apparatus, the heating device comprising:
a fan that suctions gas and blows the suctioned gas;
a heater that heats the gas;
a blowing nozzle having a nozzle body part in which a gas flow path is defined for flow of the gas heated by the heater and the blowing nozzle blows the gas heated by the heater through the gas flow path, which is perpendicular to a printed circuit board, and wherein the gas flow path is parallel, from a gas supply side to a gas discharge side of the nozzle body part in a gas discharging direction, and the blowing nozzle having an outlet for discharging the gas heated by the heater, the outlet defining an aperture having a non-circular planar shape that is a cross shape, a star shape or a polygonal shape, the shape including plural inwardly directed projection portions thereof each projecting inwardly from a point on a virtual circle surrounding the aperture of the outlet;
a nozzle cover having a hole for fitting the blowing nozzle and a first suction port for suctioning a quantity of the gas reflected after hitting a printed circuit board to be heated; and
a fitting plate that has a second suction port for recirculating the gas suctioned through the first suction port to the heater, and that fits the blowing nozzle and the nozzle cover, wherein the heater is provided between the fan and the second suction port of the fitting plate, the suctioned quantity of the gas reflected after hitting the printed circuit board is recirculated through the first and second suction ports, and the recirculated gas is driven to the blowing nozzle by the fan after being heated by the heater.

6. A cooling device of a soldering apparatus, the coolin

Assignees

• Kagaya Tomotake
• Senju Metal Industry Co

Inventors

• Kagaya Tomotake

Classifications

• H05K3/3494

  Heating processes for reflow soldering · CPC title

• B23K2201/42

  Operations & Transport · mapped topic

• B23K3/08

  Auxiliary devices therefor · CPC title

• B23K1/008 Primary

  Soldering within a furnace (B23K1/012 takes precedence) · CPC title

• B23K1/0016 Primary

  Soldering of electronic components · CPC title