Semiconductor device and manufacturing method thereof
US-9224792-B2 · Dec 29, 2015 · US
US9748485B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9748485-B2 |
| Application number | US-201615172049-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 2, 2016 |
| Priority date | Oct 16, 2015 |
| Publication date | Aug 29, 2017 |
| Grant date | Aug 29, 2017 |
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A mask frame assembly includes a frame, an open mask, and stick masks. The open mask is supported by the frame. The stick masks are disposed on the open mask and include ends coupled to the frame. The open mask includes: a first opening disposed in association with opposing ends of the open mask; and a second opening disposed between the first openings, the second opening being larger than the first opening. First deposition patterns of a first stick mask of the stick masks and second deposition patterns of a second stick mask of the stick masks overlap the second opening.
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing an organic light-emitting display apparatus, the method comprising: causing, at least in part, a deposition material to be deposited on a substrate of the organic light-emitting display apparatus according to deposition patterns formed in a mask frame assembly, the mask frame assembly comprising: a frame; an open mask on the frame; and stick masks disposed on the open mask and coupled to the frame, the deposition patterns being formed in the stick masks and overlapping openings in the open mask; and causing, at least in part, gases to be sprayed toward the stick masks after depositing the deposition material on the substrate. 2. The method of claim 1 , wherein the openings comprise: first openings disposed in association with opposing ends of the open mask; and second openings disposed between the first openings, the second openings being larger than the first openings. 3. The method of claim 2 , wherein: some of the deposition patterns overlap the first openings; and a remaining some of the deposition patterns overlap the second openings. 4. The method of claim 2 , wherein: a first stick mask of the stick masks comprises first deposition patterns of the deposition patterns; some of the first deposition patterns overlap some of the first openings; and a remaining some of the first deposition patterns overlap some of the second openings. 5. The method of claim 4 , wherein: a second stick mask of the stick masks is disposed adjacent to the first stick mask; the second stick mask comprises second deposition patterns of the deposition patterns; each of the second deposition patterns overlaps only a second opening of the second openings. 6. The method of claim 2 , wherein an area of each second opening of the second openings is twice as large as an area of each first opening of the first openings. 7. The method of claim 2 , wherein the sprayed gases cause: deposition material deposited on the stick masks to be removed; and the stick masks to elastically deform into the openings.
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using masks · CPC title
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