Mram device with octagon profile
US-2024135978-A1 · Apr 25, 2024 · US
US9748471B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9748471-B2 |
| Application number | US-201715440948-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 23, 2017 |
| Priority date | Dec 10, 2010 |
| Publication date | Aug 29, 2017 |
| Grant date | Aug 29, 2017 |
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The present invention is directed to an STT-MRAM device comprising a plurality of memory elements. Each of the memory elements includes an MTJ structure that comprises a magnetic free layer structure and a magnetic reference layer structure with an insulating tunnel junction layer interposed therebetween; a first perpendicular enhancement layer (PEL) formed adjacent to the magnetic free layer structure; a magnetic dead layer formed adjacent to the first PEL; and a magnetic fixed layer exchange coupled to the magnetic reference layer structure through an anti-ferromagnetic coupling layer. The magnetic reference layer structure includes a first magnetic reference layer formed adjacent to the insulating tunnel junction layer and a second magnetic reference layer separated from the first magnetic reference layer by a second PEL. The first and second magnetic reference layers have a first invariable magnetization direction substantially perpendicular to layer planes thereof.
Opening claim text (preview).
What is claimed is: 1. A spin transfer torque magnetic random access memory (STT-MRAM) device comprising a plurality of memory elements, each of said memory elements including a magnetic tunnel junction (MTJ) structure, said MTJ structure comprising: a magnetic free layer and a magnetic reference layer structure with an insulating tunnel junction layer interposed therebetween; a magnetic fixed layer exchange coupled to said magnetic reference layer structure through an anti-ferromagnetic coupling layer; a first perpendicular enhancement layer (PEL) formed adjacent to said magnetic free layer opposite said insulating tunnel junction layer; and a magnetic dead layer formed adjacent to said first PEL opposite said magnetic free layer, wherein said magnetic reference layer structure includes a first magnetic reference layer formed adjacent to said insulating tunnel junction layer and a second magnetic reference layer separated from said first magnetic reference layer by a second PEL, said first and second magnetic reference layers having a first invariable magnetization direction substantially perpendicular to layer planes thereof, said magnetic fixed layer has a second invariable magnetization direction that is substantially perpendicular to a layer plane thereof and is opposite to said first invariable magnetization direction, said magnetic free layer has a variable magnetization direction substantially perpendicular to a layer plane thereof. 2. The STT-MRAM device according to claim 1 , wherein said magnetic free layer comprises cobalt, iron, and boron. 3. The STT-MRAM device according to claim 1 , wherein said first PEL is made of magnesium oxide. 4. The STT-MRAM device according to claim 1 , wherein said magnetic dead layer comprises cobalt and iron. 5. The STT-MRAM device according to claim 1 , wherein said magnetic dead layer comprises cobalt, iron, and boron. 6. The STT-MRAM device according to claim 1 , wherein said magnetic dead layer has a thickness less than about 0.7 nm. 7. The STT-MRAM device according to claim 1 , wherein said second PEL is made of tungsten, molybdenum, tantalum, hafnium, zirconium, niobium, or any combination thereof. 8. The STT-MRAM device according to claim 1 , wherein said first magnetic reference layer comprises cobalt, iron, and boron. 9. A spin transfer torque magnetic random access memory (STT-MRAM) device comprising a plurality of memory elements, each of said memory elements including a magnetic tunnel junction (MTJ) structure, said MTJ structure comprising: a magnetic free layer structure and a magnetic reference layer structure with an insulating tunnel junction layer interposed therebetween; a magnetic fixed layer exchange coupled to said magnetic reference layer structure through an anti-ferromagnetic coupling layer; a magnesium oxide layer formed adjacent to said magnetic free layer structure opposite said insulating tunnel junction layer; and a metal layer comprising cobalt and iron formed adjacent to said magnesium oxide layer opposite said magnetic free layer structure, wherein said magnetic reference layer structure includes a first magnetic reference layer formed adjacent to said insulating tunnel junction layer and a second magnetic reference layer separated from said first magnetic reference layer by a first perpendicular enhancement layer (PEL), said first and second magnetic reference layers having a first invariable magnetization direction substantially perpendicular to layer planes thereof, said magnetic fixed layer has a second invariable magnetization direction that is substantially perpendicular to a layer plane thereof and is opposite to said first invariable magnetization direction, said magnetic free layer structure includes one or more magnetic free layers having a variable magnetization direction substantially perpendicular to layer planes thereof. 10. The STT-MRAM device according to claim 9 , wherein said magnetic free layer structure includes a magnetic free layer that comprises cobalt, iron, and boron. 11. The STT-MRAM device according to claim 9 , wherein said metal layer further comprises boron. 12. The STT-MRAM device according to claim 9 , wherein said metal layer has a thickness less than about 0.7 nm. 13. The STT-MRAM device according to claim 9 , wherein said metal layer is non-magnetic. 14. The STT-MRAM device according to claim 9 , wherein said magnetic free layer structure includes a first magnetic free layer formed adjacent to said insulating tunnel junction layer and a second magnetic free layer separated from said first magnetic free layer by a second PEL, said first and said second magnetic free layers having respectively a first and a second variable magnetization directions that are substantially perpendicular to layer planes thereof and are parallel to each other. 15. The STT-MRAM device according to claim 14 , wherein said first magnetic free layer comprise cobalt, iron, and boron. 16. The STT-MRAM device according to claim 14 , wherein said second PEL is made of tungsten, molybdenum, tantalum, hafnium, zirconium, niobium, or any combination thereof. 17. The STT-MRAM device according to claim 9 , wherein said first magnetic reference layer comprises cobalt, iron, and boron. 18. The STT-MRAM device according to claim 9 , wherein said magnetic fixed layer has a multilayer structure formed by interleaving one or more layers of a first material with one or more layers of a second material, at least one of said first and second materials being magnetic. 19. The STT-MRAM device according to claim 18 , wherein said first material is cobalt or a material comprising cobalt and iron. 20. The STT-MRAM device according to claim 18 , wherein said second material is nickel, or platinum, or palladium.
Electricity · mapped topic
containing iron or nickel ({H01F10/126} , H01F10/13, H01F10/16 take precedence) · CPC title
Exchange coupled hard/soft multilayers, e.g. CoPt/Co or NiFe/CoSm (nanocomposite spring magnets H01F1/0579) · CPC title
containing cobalt ({H01F10/126} , H01F10/13 take precedence) · CPC title
Electricity · mapped topic
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