Optical module heat dissipation structure and electronic product

Patent metadata

Field	Value
Publication number	US-9739960-B2
Application number	US-201514980458-A
Country	US
Kind code	B2
Filing date	Dec 28, 2015
Priority date	Nov 20, 2013
Publication date	Aug 22, 2017
Grant date	Aug 22, 2017

Abstract

An optical module heat dissipation structure, disposed inside an enclosure, where the optical module heat dissipation structure includes an optical module, an elastic component, a fixed wall, and a heat dissipation wall, where the fixed wall and the heat dissipation wall are both connected to the enclosure, the optical module is disposed between the fixed wall and the heat dissipation wall, the elastic component elastically abuts between the fixed wall and the optical module, and elasticity of the elastic component makes the optical module tightly cling to the heat dissipation wall, to improve the heat dissipation efficiency of the optical module heat dissipation structure. An electronic product is further provided where the electronic product includes the optical module heat dissipation structure.

First claim

What is claimed is:

1. An optical module heat dissipation structure, disposed inside an enclosure, wherein the optical module heat dissipation structure comprises:
an optical module;
an elastic component;
a fixed wall; and
a heat dissipation wall,
wherein the fixed wall and the heat dissipation wall are both connected to the enclosure,
wherein the optical module is disposed between the fixed wall and the heat dissipation wall,
wherein the elastic component elastically abuts between the fixed wall and the optical module,
wherein elasticity of the elastic component makes the optical module cling to the heat dissipation wall, to improve the heat dissipation efficiency of the optical module heat dissipation structure, and
wherein the optical heat dissipation structure further comprises at least one of:
a first lamination portion coupled to a back end of the optical module, wherein the first lamination portion clings to the heat dissipation wall;
a heat pipe, wherein the heat pipe is embedded in the heat dissipation wall and conducts heat dissipated from the optical module, to the enclosure; and
a thermoelectric cooling module, wherein the thermoelectric cooling module comprises a control portion and a chip, wherein the control portion is electrically connected to a circuit card in the enclosure, wherein the chip is fixed between the heat dissipation wall and the enclosure, and wherein the chip comprises a cold side and a hot side, wherein the cold side is laminated to the heat dissipation wall and the hot side is laminated to the enclosure.

2. The optical module heat dissipation structure of claim 1 , wherein a joint portion is provided at a front end of the optical module, and wherein the joint portion penetrates the fixed wall to extend out of the enclosure.

3. The optical module heat dissipation structure of claim 1 , wherein the optical module further comprises a second lamination portion, wherein the second lamination portion clings to the enclosure.

4. The optical module heat dissipation structure of claim 1 , wherein a heat conducting material is coated between the first lamination portion and the heat dissipation wall.

5. The optical module heat dissipation structure of claim 1 , wherein the heat pipe comprises a first part and a second part, wherein an insertion slot is formed between the heat dissipation wall and the enclosure, wherein the second part of the heat pipe is accommodated inside the insertion slot, and wherein the first part of the heat pipe is clamped between the optical module and the heat dissipation wall.

6. The optical module heat dissipation structure of claim 5 , wherein the heat pipe is L-shaped.

7. The optical module heat dissipation structure of claim 1 , wherein the elastic component comprises one of a first configuration or a second configuration,
wherein the first configuration comprises: a pair of springs, wherein each of the springs presses between the fixed wall and the optical module, wherein a joint portion is provided at a front end of the optical module, wherein the joint portion penetrates the fixed wall, and wherein the pair of springs are symmetrically distributed on two sides of the joint portion, and
wherein the second configuration comprises a first abutting portion, a second abutting portion, and a connection portion, wherein the connection portion is connected between the first abutting portion and the second abutting portion, wherein the first abutting portion is configured to abut against the fixed wall, wherein the second abutting portion is configured to abut against the optical module, wherein an open slot is provided on the first abutting portion and the second abutting portion, wherein a joint portion is provided at a front end of the optical module, and wherein the joint portion is accommodated inside the open slot and penetrates the fixed wall.

8. An optical module heat dissipation structure, disposed inside an enclosure, wherein the optical module heat dissipation structure comprises:
an optical module;
an elastic component;
a fixed wall; and
a heat dissipation wall,
wherein the fixed wall and the heat dissipation wall are both connected to the enclosure,
where in the optical module is disposed between the fixed wall and the heat dissipation wall,
wherein the elastic component elastically abuts between the fixed wall and the optical module,
wherein elasticity of the elastic component makes the optical module cling to the heat dissipation wall, to improve the heat dissipation efficiency of the optical module heat dissipation structure, and
wherein the elastic component comprises a first abutting portion, a second abutting portion, and a connection portion, wherein the connection portion is connected between the first abutting portion and the second abutting portion, wherein the first abutting portion is configured to abut against the fixed wall, wherein the second abutting portion is configured to abut against the optical module, wherein an open slot is provided on the first abutting portion and the second abutting portion, wherein a joint portion is provided at a front end of the optical module, and wherein the joint portion is accommodated inside the open slots and penetrates the fixed wall.

9. An electronic product, comprising:
an enclosure; and
an optical module heat dissipation structure disposed inside the enclosure,
wherein the optical module heat dissipation structure comprises an optical module, an elastic component, a fixed wall, and a heat dissipation wall,
wherein the fixed wall and the heat dissipation wall are both connected to the enclosure,
wherein the optical module is disposed between the fixed wall and the heat dissipation wall,
wherein the elastic component elastically abuts between the fixed wall and the optical module,
wherein elasticity of the elastic component makes the optical module cling to the heat dissipation wall, to improve the heat dissipation efficiency of the optical module heat dissipation structure, and
wherein the optical heat dissipation structure further comprises at least one of:
a first lamination portion coupled to a back end of the optical module, wherein the first lamination portion clings to the heat dissipation wall;
a heat pipe, wherein the heat pipe is embedded in the heat dissipation wall and conducts heat dissipated from the optical module, to the enclosure; and
a thermoelectric cooling module, wherein the thermoelectric cooling module comprises a control portion and a chip, wherein the control portion is electrically connected to a circuit card in the enclosure, wherein the chip is fixed between the heat dissipation wall and the enclosure, and wherein the chip comprises a cold side and a hot side, wherein the cold side is laminated to the heat dissipation wall and the hot side is laminated to the enclosure.

10. The electronic product of claim 9 , wherein a joint portion is provided at a front end of the optical module, and wherein the joint portion penetrates the fixed wall to extend out of the enclosure.

11. The electronic product of claim 9 , wherein the optical module further comprises a second lamination portion, wherein the second lamination portion clings to the enclosure.

12. The electronic product of claim 9 , wherein a heat conducting material is coated between the first lamination portion and the heat dissipation wall.

13. The electronic product of claim 9 , wherein the heat pipe comprises a first part and a second part, wherein an insertion slot is formed between the heat dissipation wall and the enclosure, wherein the second part of the heat pipe is accommodated inside the insertion slot, and wherein

Assignees

• Huawei Tech Co Ltd

Inventors

• Huang Shuliang
• Liu Zaomeng
• Zhai Liqian

Classifications

• H05K7/2049

  Pressing means used to urge contact, e.g. springs · CPC title

• G02B6/4272 Primary

  with mounting substrates of high thermal conductivity · CPC title

• G02B6/4269

  with heat sinks or radiation fins · CPC title

• G02B6/4271

  with thermo electric cooling · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title