Optical transceiver having heat-dissipating path from assembly substrate directly to upper housing

Patent metadata

Field	Value
Publication number	US-2016246019-A1
Application number	US-201615050952-A
Country	US
Kind code	A1
Filing date	Feb 23, 2016
Priority date	Feb 24, 2015
Publication date	Aug 25, 2016
Grant date	—

Abstract

A pluggable optical transceiver that enhances the heat dissipation function is disclosed. The optical transceiver provides the MPO connector that receives an external MT ferrule, the assembly substrate that installs a semiconductor optical device, a lens block that bends the optical axis of the semiconductor optical device by about 90°, the circuit board electrically connected to the assembly substrate, the inner fiber optically couples the WO connector with the lens block, and the top and bottom housings that installs the MPO connector, the assembly substrate, the circuit board, and the inner fiber therein. The bottom housing mounts the circuit board, while, the assembly substrate is thermally and physically in contact to the top housing through a thermal grease.

First claim

What is claimed is:

1 . An optical transceiver to be plugged into a cage of a host system, comprising:
an multi-fiber push-on (WO) connector that receives an external optical connector; an assembly substrate that mounts at least a semiconductor optical device on a primary surface thereof, the semiconductor optical device having an optical axis substantially in perpendicular to the primary surface of the assembly substrate; a lens block mounted on the assembly substrate, the lens block bending the optical axis of the semiconductor optical device toward a direction substantially in parallel to the primary surface of the assembly substrate; a circuit board that mounts electronic circuits electrically coupled with the semiconductor optical device; at least an inner fiber that couples the lens block with the MPO connector; and a housing including a top housing and a bottom housing forming an inner space that encloses the MPO connector, the assembly substrate, the lens block, the circuit board, and the inner fiber therein, wherein the bottom housing mounts the circuit board thereon and the top housing is thermally and physically in contact to the assembly substrate.

2 . The optical transceiver of claim 1 ,
wherein the optical transceiver provides a plurality of the inner fibers in an arrayed form, wherein the assembly substrate mounts a plurality of the semiconductor optical devices, wherein the lens block provides a plurality of lens elements coupled with the respective semiconductor optical devices, wherein the arrayed fiber provides a first mechanically transferable (MT) ferrule in an end thereof, and a second MT ferrule in another end thereof, the first MT ferrule coupling with the MPO connector, the second MT ferrule coupling with the lens block.

3 . The optical transceiver of claim 2 ,
wherein the assembly substrate mounts a holder thereon, the holder surrounding the lens block.

4 . The optical transceiver of claim 3 ,
wherein the holder provides a clip that secures the second MT ferrule with the lens block.

5 . The optical transceiver of claim 4 ,
wherein the clip provides a rectangular surface, a rear hook in an edge of the rectangular surface, a pair of arms extending from both ends of an other edge of the rectangular surface opposite to the edge, and front hooks provided in respective ends of the arms, and wherein the rear hook latches the holder, and the front hook latches the second MT ferrule.

6 . The optical transceiver of claim 4 ,
wherein the holder provides a rear wall having a hollow latched with the clip and side walls that extending from respective sides of the rear wall and providing steps in respective inner surfaces thereof facing to each other, and wherein the lens block provides cuts in respective sides thereof; the cuts mating with the steps of the holder.

7 . The optical transceiver of claim 3 ,
wherein the holder has a thickness substantially equal to a length between the circuit board and the top housing.

8 . The optical transceiver of claim 7 ,
wherein the assembly substrate is electrically connected to the circuit board with a stack connector.

9 . The optical transceiver of claim 2 ,
wherein the assembly substrate further mounts electronic circuit electrically coupled with the semiconductor optical device.

10 . The optical transceiver of claim 2 ,
wherein the optical semiconductor devices includes a plurality of semiconductor laser diodes (LDs), a plurality of semiconductor photodiodes (PDs), and a plurality of monitor PDs, and wherein the LDs and the PDs each have an arrayed form and are arranged in side by side with respect to a longitudinal axis of the housing.

11 . The optical transceiver of claim 10 ,
wherein the LDs have a type of vertical cavity surface emitting laser diodes (VCSELs).

12 . The optical transceiver of claim 1 ,
wherein the top housing is to be physically in contact to a heat sink provided in the cage of the host system when the optical transceiver is inserted in the cage.

13 . The optical transceiver of claim 1 ,
wherein the assembly substrate is thermally in contact to the top housing via thermal grease.

Assignees

• Sumitomo Electric Industries

Inventors

• Ishii Kuniyuki
• Kurashima Hiromi

Classifications

• G02B6/32

  having lens focusing means {positioned between opposed fibre ends (with lens being an integral part of the single fibre end G02B6/262)} · CPC title

• G02B6/4249

  comprising arrays of active devices and fibres · CPC title

• G02B6/4269

  with heat sinks or radiation fins · CPC title

• G02B6/4292

  the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements · CPC title

• G02B6/3893

  Push-pull type, e.g. snap-in, push-on · CPC title