Electronic fabric with incorporated chip and interconnect

Patent metadata

Field	Value
Publication number	US-9736936-B2
Application number	US-201615012557-A
Country	US
Kind code	B2
Filing date	Feb 1, 2016
Priority date	Dec 20, 2013
Publication date	Aug 15, 2017
Grant date	Aug 15, 2017

Abstract

A system comprises an article comprising one or more fabric layers, a plurality of electronic devices, each being incorporated into or onto one of the one or more fabric layers, and one or more communication links between two or more of the plurality of electronic devices. Each of the plurality of electronic devices can comprise a flexible substrate coupled to the fabric layer, one or more metallization layers deposited on the flexible substrate, and one or more electronic components electrically coupled to the one or more metallization layers.

First claim

What is claimed is:

1. A method of making an electronic device comprising:
depositing one or more metallization layers on a flexible substrate;
coupling the flexible substrate to a first fabric layer; and
electrically coupling a plurality of electronic components to the one or more metallization layers by forming one or more coupling connections in a form factor pattern that is a standard or uniform form factor regardless of individual functionality, die design, or substrate design of the particular electronic component.

2. The method according to claim 1 , further comprising applying a coating over at least a portion of at least one of the plurality of electronic components and at least a portion of the one or more metallization layers, wherein the coating provides mechanical protection or environmental protection, or both, to the at least one of the plurality of electronic components and at least the portion of the one or more metallization layers onto which the coating is applied.

3. The method according to claim 2 , wherein the coating comprises at least one of:
poly(p-xylylene), polystyrene, polymethylmethacrylate, polypropylene, an ethylene-methyl methacrylate copolymer, polyether ether ketone, a nylon, a phenolic epoxy, ethylene tetrafluoroethylene, or a post-consumer commingled polymer.

4. The method according to claim 1 , wherein the flexible substrate comprises at least one of:
apolyimide, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), a polycarbonate, glass, or Kapton.

5. The method according to claim 1 , wherein the coupling of the flexible substrate to the first fabric layer comprises at least one of stitching the flexible substrate to the first fabric layer, adhering the flexible substrate to the first fabric layer, or welding the flexible substrate to the first fabric layer.

6. The method according to claim 1 , wherein the flexible substrate comprises a tape with an adhesive layer, wherein the coupling of the flexible substrate to the first fabric layer comprises applying the adhesive layer of the tape to adhere the flexible substrate to the first fabric layer.

7. The method according to claim 1 , further comprising coupling a second fabric layer to the first fabric layer so that the electronic device is positioned between the first fabric layer and the second fabric layer.

8. A method comprising:
assembling a first electronic device, wherein the assembling of the first electronic device comprises the steps of:
depositing one or more metallization layers on a flexible substrate;
coupling the flexible substrate to a first fabric layer, and
electrically coupling a plurality of electronic components to the one or more metallization layers by forming one or more coupling connections in a form factor pattern that is a standard or uniform form factor regardless of individual functionality, die design, or substrate design of the particular electronic component; and

communicatively connecting the first electronic device to one or more second electronic devices to form a system.

9. The method according to claim 8 , further comprising coupling a second fabric layer to the first fabric layer so that the first electronic device is positioned between the first fabric layer and the second fabric layer.

10. The method according to claim 8 , wherein assembling the first electronic device further comprises applying a coating over at least a portion of at least one of the plurality of electronic components and at least a portion of the one or more metallization layers, wherein the coating provides mechanical protection or environmental protection, or both, to the at least one of the plurality of electronic components and the portion of the one or more metallization layers onto which the coating is applied.

11. The method according to claim 10 , wherein the coating comprises at least one of poly(p-xylylene), polystyrene, polymethylmethacrylate, polypropylene, an ethylene-methyl methacrylate copolymer, polyether ether ketone, a nylon, a phenolic epoxy, ethylene tetrafluoroethylene, and a post-consumer commingled polymer.

12. The method according to claim 8 , wherein the flexible substrate comprises at least one of a polyimide, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), a polycarbonate, a glass, and Kapton.

13. The method according to claim 8 , further comprising forming at least part of an article of clothing, an article of luggage, or an article of furniture with the first fabric layer.

14. The method according to claim 8 , wherein communicatively connecting the first and second electronic devices comprises forming one or both of a wireless communication link or a wired communication link between the first and second electronic devices.

15. A method comprising:
assembling one or more fabric layers to create an article;
incorporating a plurality of electronic devices into or onto at least one of the one or more fabric layers, wherein at least one of the plurality of electronic devices comprises;
a flexible substrate coupled to a first of the one or more of the fabric layers;
one or more metallization layers deposited on the flexible substrate; and
a plurality of electronic components electrically coupled to the one or more metallization layers with one or more coupling connections in a form factor pattern that is a standard or uniform form factor regardless of individual functionality, die design, or substrate design of the particular electronic component; and

connecting one or more communication links between two or more of the plurality of electronic devices.

16. The method according to claim 15 , wherein the one or more communication links comprises one or more of at least one wired communication link and at least one wireless communication link.

17. The method according to claim 15 , wherein the article comprises a clothing article, a luggage article, or a furniture article.

18. The method according to claim 1 , wherein coupling the flexible substrate to the first fabric layer includes at least one of stitching, adhering, or welding the flexible substrate to the first fabric layer.

19. The method according to claim 8 , wherein coupling the flexible substrate to the first fabric layer includes at least one of stitching, adhering, or welding the flexible substrate to the first fabric layer.

20. The method according to claim 15 , wherein incorporating a plurality of electronic devices into or onto at the least one of the one or more fabric layers includes at least one of stitching, adhering, or welding the flexible substrate to the first fabric layer.

Assignees

• Intel Corp

Inventors

• Jezewski Christopher
• Pillarisetty Ravi
• Doyle Brian

Classifications

• H05K2201/0154

  Polyimide · CPC title

• H05K2201/015

  Fluoropolymer, e.g. polytetrafluoroethylene [PTFE] · CPC title

• H05K1/0393 Primary

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• H05K3/32

  electrically connecting electric components or wires to printed circuits · CPC title

• H05K3/10

  in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern · CPC title