Interconnect alloy material and methods

Patent metadata

Field	Value
Publication number	US-9731369-B2
Application number	US-201313801803-A
Country	US
Kind code	B2
Filing date	Mar 13, 2013
Priority date	Mar 13, 2013
Publication date	Aug 15, 2017
Grant date	Aug 15, 2017

Abstract

A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.

First claim

The invention claimed is:

1. A composite solder assembly, comprising:
a number of dispersed phase solder particles having two or more components, and a melting temperature between approximately 100° C. and 250° C.;
a substantially homogenous pure gallium or single alloy gallium based metal matrix that encases the dispersed phase solder particles;
a distribution of metal particles within the substantially homogenous pure gallium or single alloy gallium based metal matrix; and
an electrical contact forming a direct interface with an amount of the composite solder.

2. The composite solder assembly of claim 1 , wherein the dispersed phase solder particles includes indium tin solder particles.

3. The composite solder assembly of claim 1 , wherein the dispersed phase solder particles includes silver tin solder particles.

4. The composite solder assembly of claim 1 , wherein the substantially homogenous pure gallium or single alloy gallium metal matrix is a single metal of substantially pure gallium metal.

5. The composite solder assembly of claim 1 , wherein the metal particles include copper particles.

6. The composite solder assembly of claim 1 , wherein the metal particles include nickel particles.

7. The composite solder assembly of claim 1 , wherein the metal particles include copper and nickel particles.

8. The composite solder assembly of claim 1 , wherein the metal particles are selected from the group consisting of copper, nickel, zinc, gold, silver, platinum, aluminum, and iron.

9. The composite solder assembly of claim 1 , wherein the metal particles have a size that is approximately 200 mesh particle size.

10. The composite solder assembly of claim 1 , wherein the metal particles have a size that ranges from 1 to 10 microns in diameter.

11. The composite solder assembly of claim 1 , wherein substantially all the metal particles have a size that is 1 micron in diameter.

12. The composite solder assembly of claim 1 , wherein the metal particles constitute greater than or equal to 1 percent and less than 30 percent of the composite solder, by volume.

13. The composite solder assembly of claim 1 , wherein the metal particles constitute greater than 30 percent and less than or equal to 45 percent of the composite solder, by volume.

14. The composite solder assembly of claim 1 , wherein the metal particles constitute greater than 45 percent and less than or equal to 55 percent of the composite solder, by volume.

Assignees

• Intel Corp

Inventors

• Zhong Ting
• Baskaran Rajashree Raji
• Aleksov Aleksandar Aleks

Classifications

• B23K35/0244

  Powders, particles or spheres; Preforms made therefrom · CPC title

• B23K3/0623

  for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets · CPC title

• B23K1/206

  Cleaning · CPC title

• B23K35/24

  Selection of soldering or welding materials proper (B23K35/34 takes precedence) · CPC title

• B23K35/302

  Cu as the principal constituent · CPC title