Epoxy compound having alkoxysilyl group, method for preparing the same, composition including the same, cured product made from the composition, and use of the composition

Patent metadata

Field	Value
Publication number	US-9725590-B2
Application number	US-201314427990-A
Country	US
Kind code	B2
Filing date	Sep 17, 2013
Priority date	Sep 17, 2012
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

Provided are an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, particularly low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy and composition of which does not require additional silane coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including at least one alkoxysilyl group and at least two epoxy groups, a method for preparing the same by epoxide ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved. Thus, the composite exhibits good heat resistance properties and the cured product exhibits good flame retardancy.

First claim

The invention claimed is:

1. An epoxy compound having an alkoxysilyl group, comprising:
at least one alkoxysilyl group (1) independently selected from the group consisting of Formulae S11 to S16, (2) independently selected from the group consisting of Formulae S21 to S26, (3) independently selected from the group consisting of Formulae S11 to S16 and Formulae S31 to S38 or (4) independently selected from the group consisting of Formulae S21 to S26 and Formulae S31 to S38; and
at least two epoxy groups independently selected from the group consisting of Formulae S51 to S58 attached to a core,
wherein the core is one selected from the group consisting of Formulae A′ to N′:

in Formula A′, -q- is —CH 2 — or a direct linkage,
in Formula D′, -r- is —C(CH 3 ) 2 —, —CH 2 —, —C(CF 3 ) 2 —, —SO 2 —, —S—,

in Formula K′, s is

in Formula N′, t is

and
in Formulae K′ to N′, n is an integer equal to or greater than 1,

for each Si atom
in each formula of Formulae S11 to S16, at least one of R 1 to R 3 is an alkoxy group having 1 to 5 carbon atoms, the remainder thereof are alkyl groups having 1 to 10 carbon atoms, and the alkoxy group and the alkyl group are linear or branched;

for each Si atom
in each formula of Formulae S21 to S26, at least one of R 1 to R 3 is an alkoxy group having 1 to 5 carbon atoms, the remainder thereof are alkyl groups having 1 to 10 carbon atoms, and the alkoxy group and the alkyl group are linear or branched;

for each Si atom
in each formula of Formulae S31 to S38, at least one of R1 to R3 is an alkoxy group having 1 to 5 carbon atoms, the remainder thereof are alkyl groups having 1 to 10 carbon atoms, and the alkoxy group and the alkyl group are linear or branched;

for each Si atom
in each formula of Formulae S56 to S58, at least one of R 1 to R 3 is an alkoxy group having 1 to 5 carbon atoms, the remainder thereof are alkyl groups having 1 to 10 carbon atoms, and the alkoxy group and the alkyl group are linear or branched.

2. The epoxy compound having an alkoxysilyl group of claim 1 , further comprising a second core selected from selected from a group consisting of Formulae A′ to I′, and the second core is connected to the core by a connecting group independently selected from the group consisting of Formulae LG1 to LG14:

in each formula of Formulae LG8 to LG14, at least one of R 1 to R 3 is an alkoxy group having 1 to 5 carbon atoms, the remainder thereof are alkyl groups having 1 to 10 carbon atoms, and the alkoxy group and the alkyl group are linear or branched, and
in Formulae LG4, LG5, LG7, LG11, LG12 and LG14, ® is hydrogen or a glycidyl group.

3. The epoxy compound having an alkoxysilyl group according to claim 1 , wherein the epoxy compound having an alkoxysilyl group further comprises a substituent selected from the group consisting of Formulae S41 to S45:

4. An epoxy composition comprising the epoxy compound having an alkoxysilyl group according to claim 1 .

5. A cured product of the epoxy composition according to claim 4 .

6. The cured product of claim 5 , wherein the cured product has a glass transition temperature of 100° C. or above, or does not exhibit the glass transition temperature.

7. The epoxy compound having an alkoxysilyl group of claim 1 , further comprising a second core of Formula J′, wherein the second core is connected to the core via a connecting group independently selected from the group consisting of Formulae LG2 and LG9:

in Formula LG9, at least one of R1 to R3 is an alkoxy group having 1 to 5 carbon atoms, the remainder thereof are alkyl groups having 1 to 10 carbon atoms, and the alkoxy group and the alkyl group are linear or branched.

8. A method for preparing an epoxy compound having an alkoxysilyl group, comprising:
a first step of preparing an intermediate by reacting a starting material of an epoxy compound having at least three epoxy groups and allyl alcohol in the presence of a base and an optional solvent, wherein the starting material of the epoxy compound having at least three epoxy groups includes a core selected from the group consisting of Formulae (A′) to (N′) and at least three epoxy groups selected from the group consisting of Formulae S51 to S54; and
a second step of reacting the intermediate and a compound of the following Formula B1 in the presence of a base and an optional solvent to prepare an epoxy compound including at least one alkoxysilyl group independently selected from the group consisting of Formulae S11 to S16 and at least two epoxy groups selected from the group consisting of Formulae S51 to S55 and S57 attached to the core,
wherein the core is selected from the group consisting of Formulae (A′) to (N′):

in Formula A′, -q- is —CH 2 — or a direct linkage,
in Formula D′, -r- is —C(CH 3 ) 2 —, —CH 2 —, —C(CF 3 ) 2 —, —SO 2 —, —S—,

in Formula K′, s is

in Formula N′, t is, and
in Formulae K′ to N′, n is an integer equal to or greater than 1,
OCN(CH 2 ) 3 SiR 1 R 2 R 3   [Formula B1]

in Formula B1, at least one of R 1 to R 3 is an alkoxy group having 1 to 5 carbon atoms, the remainder thereof are alkyl groups having 1 to 10 carbon atoms, and the alkoxy group and the alkyl group are linear or branched,

in each formula of Formulae S11 to S16, at least one of R 1 to R 3 is an alkoxy group having 1 to 5 carbon atoms, the remainder thereof are alkyl groups having 1 to 10 carbon atoms, and the alkoxy group and the alkyl group are linear or branched,

in Formula S57, at least one of R 1 to R 3 is an alkoxy group having 1 to 5 carbon atoms, the remainder thereof are alkyl groups having 1 to 10 carbon atoms, and the alkoxy group and the alkyl group are linear

Assignees

• Korea Ind Tech Inst

Inventors

• Chun Hyun-Aee
• Kim Yun-Ju
• Park Su-Jin
• Tak Sang-Yong
• Park Sung-Hwan
• Kang Kyung-Nam
• Park Sook-Yeon

Classifications

• C07F7/10 Primary

  containing nitrogen {having a Si-N linkage} · CPC title

• C09J163/00

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

• C08G59/3281

  containing silicon · CPC title

• C08G59/306

  containing silicon · CPC title

• C08K7/14 Primary

  Glass · CPC title