Cover for component of polishing apparatus, component of polishing apparatus, and polishing apparatus

US9724798B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9724798-B2
Application numberUS-201514787424-A
CountryUS
Kind codeB2
Filing dateMar 27, 2015
Priority dateMar 31, 2014
Publication dateAug 8, 2017
Grant dateAug 8, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

There is provided a cover to which a polishing liquid is less likely to stick and solidify. The cover for a component of a polishing apparatus for polishing substrates is provided with a locking mechanism disposed inside the cover and configured to latch together a main body of the component and the cover. An external surface of the cover exposed to the outside has no recessed portion, and has no horizontal plane, except on the top portion of the cover.

First claim

Opening claim text (preview).

The invention claimed is: 1. A cover for a component of a polishing apparatus for polishing substrates, the cover comprising a locking mechanism disposed inside the cover and configured to latch together a main body of the component and the cover, wherein an external surface of the cover exposed to the outside has no recessed portion, and has no horizontal plane, except on a top portion of the cover. 2. The cover according to claim 1 , wherein the locking mechanism comprises a ball catch mechanism or a magnet. 3. The cover according to claim 1 , wherein the external surface of the cover exposed to the outside has water repellency. 4. The cover according to claim 1 , wherein the thickness of the cover in an abutment portion thereof between an outer edge of the main body of the component and an outer edge of the cover is smaller than the thicknesses of the cover in portions thereof other than the abutment portion. 5. A component of a polishing apparatus, comprising: a main body of the component; and the cover according to claim 1 . 6. The component according to claim 5 , wherein a protruding part projecting toward an inner side of the cover is formed in an internal surface of the cover over the entire range of the cover along the horizontal direction thereof, and the component comprises a foamable sealing member disposed between the main body of the component and the protruding part. 7. The component according to claim 5 , comprising an auxiliary cover disposed on the cover and configured to cover a partial area of the cover, wherein the cover includes, in an area to be covered with the auxiliary cover, a horizontal plane in which a bolt-hole used to fix together the cover and the main body of the component is formed. 8. A polishing apparatus comprising the component according to claim 5 .

Assignees

Inventors

Classifications

  • Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title

  • B24B37/34Primary

    Accessories · CPC title

  • Protective coverings for parts of machine tools; Splash guards · CPC title

  • Dust extraction equipment on grinding or polishing machines (B24B31/12 takes precedence) · CPC title

  • Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

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Frequently asked questions

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What does patent US9724798B2 cover?
There is provided a cover to which a polishing liquid is less likely to stick and solidify. The cover for a component of a polishing apparatus for polishing substrates is provided with a locking mechanism disposed inside the cover and configured to latch together a main body of the component and the cover. An external surface of the cover exposed to the outside has no recessed portion, and has …
Who is the assignee on this patent?
Ebara Corp
What technology area does this patent fall under?
Primary CPC classification B24B37/34. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 08 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).