Endpointing detection for chemical mechanical polishing based on spectrometry

US9117751B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9117751-B2
Application numberUS-201314010193-A
CountryUS
Kind codeB2
Filing dateAug 26, 2013
Priority dateAug 22, 2005
Publication dateAug 25, 2015
Grant dateAug 25, 2015

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Abstract

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Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum-based endpoint logic. The method includes obtaining a current spectrum. The current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved. The determining is based on the reference and current spectra.

First claim

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What is claimed is: 1. A computer program product, tangibly stored on machine readable medium, the product comprising instructions operable to cause a processor to: select a reference spectrum, the reference spectrum representing a spectrum of white light reflected from a film of interest that has a thickness greater than a target thickness; obtain a current spectrum, the current spectrum being a spectrum of white light reflected from a film of interest that is on a substrate an…

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What does patent US9117751B2 cover?
Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the ta…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification H10P74/238. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 25 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).