Laser processing apparatus

Patent metadata

Field	Value
Publication number	US-9724783-B2
Application number	US-201514953640-A
Country	US
Kind code	B2
Filing date	Nov 30, 2015
Priority date	Dec 1, 2014
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

A laser beam irradiation unit of a laser processing apparatus includes a pulse laser oscillator, a condenser which converges and irradiates a pulse laser beam upon a workpiece held on a chuck table, a dichroic mirror disposed between the pulse laser oscillator and the condenser, a strobo flash irradiation unit which irradiates light on a route of the dichroic mirror and the condenser, a beam splitter disposed between the strobo flash irradiation unit and the dichroic mirror, and an image pickup unit disposed on the route of the light split by the beam splitter. A control unit renders the strobo flash irradiation unit and the image pickup unit operative in a timed relationship with the pulse laser beam oscillated from the pulse laser beam oscillator and irradiated upon the workpiece and detects a processed state on the basis of an image signal from the image pickup unit.

First claim

What is claimed is:

1. A laser processing apparatus, comprising:
a chuck table configured to hold a workpiece thereon;
laser beam irradiation means for irradiating a pulse laser beam upon the workpiece held on the chuck table;
X-axis direction moving means for moving the chuck table and the laser beam irradiation means relative to each other in an X-axis direction;
Y-axis direction moving means for moving the chuck table and the laser beam irradiation means relative to each other in a Y-axis direction perpendicular to the X-axis direction; and
control means for controlling the laser beam irradiation means, the X-axis direction moving means and the Y-axis direction moving means;
the laser beam irradiation means including
pulse laser beam oscillation means for oscillating a pulse laser beam,
a condenser configured to converge the pulse laser beam oscillated from the pulse laser beam oscillation means and irradiate the pulse laser beam upon the workpiece held on the chuck table,
a dichroic mirror disposed between the pulse laser beam oscillation means and the condenser and configured to reflect the pulse laser beam oscillated from the pulse laser beam oscillation means to introduce the pulse laser beam to the condenser while allowing light of wavelengths other than a wavelength of the pulse laser beam to pass therethrough,
strobo flash irradiation means for irradiating strobo flash upon a route of the dichroic mirror and the condenser,
a beam splitter disposed between the strobo flash irradiation means and the dichroic mirror and configured to split light from the workpiece held on the chuck table, and
image pickup means disposed on the route split by the beam splitter;

the control means rendering the strobo flash irradiation means and the image pickup means operative in accordance with a timing of the pulse laser beam oscillated by the pulse laser beam oscillation means and irradiated upon the workpiece held on the chuck table to detect a processed state on the basis of an image signal from the image pickup means.

2. The laser processing apparatus according to claim 1 , wherein the strobo flash irradiation means includes a strobo flash source configured to emit light, an iris configured to define a field size of the light emitted from the strobo flash source, and a lens configured to converge the light having passed through the iris upon the workpiece held on the chuck table, and
the image pickup means includes a lens set configured from an aberration correction lens and an image forming lens, and an image pickup element configured to pick up an image captured by the lens set.

3. The laser processing apparatus according to claim 1 , wherein the control means detects a displacement between an irradiation position of the pulse laser beam irradiated from the laser beam irradiation means and a set processing position on the basis of an image signal from the image pickup means and controls, when the displacement amount exceeds a permissible value set in advance, the X-axis direction moving means or the Y-axis direction moving means so as to correct the displacement.

Assignees

• Disco Corp

Inventors

• Odagiri Wataru
• Nehashi Kouichi
• Koerwer Joel
• Ohkubo Hironari
• Tsukiji Shuichiro
• Oba Ryugo
• Odanaka Kentaro
• Sampei Takashi

Classifications

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• B23K26/067

  Dividing the beam into multiple beams, e.g. multi-focusing · CPC title

• B23K26/359

  by providing a line or line pattern, e.g. a dotted break initiation line · CPC title

• B23K26/032

  using optical means · CPC title