Method and system for measuring heat flux

Patent metadata

Field	Value
Publication number	US-9719867-B2
Application number	US-201414290255-A
Country	US
Kind code	B2
Filing date	May 29, 2014
Priority date	May 30, 2013
Publication date	Aug 1, 2017
Grant date	Aug 1, 2017

Abstract

A heat flux sensor equipped measurement wafer includes a substrate, a cover thermally coupled to a portion of the substrate, a sensor cavity formed between the substrate and the cover, a thermal barrier disposed within at least a portion of the sensor cavity, a bottom temperature sensor thermally coupled to the substrate and insulated from the cover by a portion of the thermal barrier and a top temperature sensor thermally coupled to the cover and insulated from the substrate by an additional portion of the thermal barrier, wherein a temperature difference between the bottom temperature sensor and the top temperature sensor is related to a heat flux passing through the substrate and cover proximate to the sensor cavity.

First claim

What is claimed:

1. A measurement wafer heat flux sensor comprising:
a substrate;
a cover thermally coupled to a portion of the substrate;
a sensor cavity formed between the substrate and the cover;
a thermal barrier disposed within at least a portion of the sensor cavity;
a bottom temperature sensor thermally coupled to the substrate and insulated from the cover by a first portion of the thermal barrier; and
a top temperature sensor thermally coupled to the cover and insulated from the substrate by an additional portion of the thermal barrier, wherein the first portion of the thermal barrier is contiguous with the additional portion of the thermal barrier,
wherein a temperature difference between the bottom temperature sensor and the top temperature sensor is related to a heat flux passing through the substrate and cover proximate to the sensor cavity.

2. The measurement wafer heat flux sensor of claim 1 , wherein the measurement wafer includes one or more sensor circuits providing one or more electrical connections to at least one of the bottom temperature sensor and the top temperature sensor.

3. The measurement wafer heat flux sensor of claim 2 , wherein the thermal barrier includes one or more sensor circuits providing one or more electrical connections to at least one of the bottom temperature sensor and the top temperature sensor.

4. The measurement wafer heat flux sensor of claim 2 , wherein the one or more sensor circuits include at least one of a flexible printed circuit at least partially disposed between the substrate and the cover, a substrate integrated circuit disposed at least partially on the substrate, a cover integrated circuit disposed at least partially on the cover and a multilayer flexible printed circuit at least partially disposed between the substrate and the cover.

5. The measurement wafer heat flux sensor of claim 1 , wherein the substrate comprises:
a substrate wafer.

6. The measurement wafer heat flux sensor of claim 1 , wherein the cover comprises:
a cover wafer.

7. The measurement wafer heat flux sensor of claim 1 , wherein the thermal barrier comprises:
a thermally insulting layer.

8. The measurement wafer heat flux sensor of claim 1 , wherein the measurement wafer heat flux sensor is compatible with a plasma processing chamber.

9. A heat flux sensing system comprising:
a measurement wafer heat flux sensor including:
a substrate;
a cover thermally coupled to a portion of the substrate;
a sensor cavity formed between the substrate and the cover;
a thermal barrier disposed within at least a portion of the sensor cavity;
a bottom temperature sensor thermally coupled to the substrate and insulated from the cover by a first portion of the thermal barrier; and
a top temperature sensor thermally coupled to the cover and insulated from the substrate by an additional portion of the thermal barrier, wherein the first portion of the thermal barrier is contiguous with the additional portion of the thermal barrier, wherein a temperature difference between the bottom temperature sensor and the top temperature sensor is related to a heat flux passing through the substrate and cover proximate to the sensor cavity;

a controller communicatively coupled to the measurement wafer heat flux sensor, the controller including one or more processors configured to execute a set of program instructions, the set of program instructions configured to cause the one or more processors to:
receive temperature measurements from the bottom temperature sensor and the top temperature sensor;
determine the differential temperature between the top temperature sensor and the bottom temperature sensor; and
determine a heat flux passing through the substrate and cover proximate to the sensor cavity based on the differential temperature between the bottom temperature sensor and the top temperature sensor.

10. The heat flux sensing system of claim 9 , wherein the top temperature sensor and the bottom temperature sensor are positioned substantially perpendicular to a direction of thermal energy flow.

11. The heat flux sensing system of claim 9 , wherein the thermal barrier comprises:
one or more thermally insulating layers.

12. The heat flux sensing system of claim 11 , wherein the one or more thermally insulating layers comprise:
at least one of a thermal insulating film and a thermal insulating plate.

13. The heat flux sensing system of claim 9 , wherein the controller is positioned on a portion of the substrate.

14. The heat flux sensing system of claim 9 , wherein the controller is positioned remotely from the substrate.

15. The heat flux sensing system of claim 9 , wherein the measurement wafer heat flux sensor is compatible with a plasma processing chamber.

16. The heat flux sensing system of claim 9 , wherein the determining differential temperature between the top temperature sensor and the bottom temperature sensor comprises:
applying one or more differential calibration factors to the differential temperature to generate a calibrated differential temperature.

17. The heat flux sensing system of claim 9 , wherein the determining the heat flux passing through the substrate and cover proximate to the sensor cavity comprises:
acquiring one or more calibration heat flux measurements via the top temperature sensor and the bottom temperature sensor;
generating one or more heat flux calibration factors from the acquired one or more calibration heat flux measurements; and
applying the generated one or more heat flux calibration factors to the differential temperature between the bottom temperature sensor and the top temperature sensor to determine the heat flux passing through the substrate and cover proximate to the sensor cavity.

18. The heat flux sensing system of claim 9 , wherein the determining the heat flux passing through the substrate and cover proximate to the sensor cavity comprises:
applying one or more heat flux calibration factors to the differential temperature to determine the heat flux passing through the substrate and cover proximate to the sensor cavity.

19. The heat flux sensing system of claim 18 , wherein the one or more heat flux calibration factors are temperature dependent.

20. The heat flux sensing system of claim 9 , wherein the controller is further configured to:
isothermally calibrate the top temperature sensor and the bottom temperature sensor within a thermal calibration range to form one or more sensor calibrations for the measurement wafer heat flux sensor; and
applying the one or more sensor calibrations to temperatures detected from the bottom temperature sensor and top temperature sensor to form one or more heat flux calibration factors.

21. A method for measuring heat flux with a measurement wafer comprising:
providing a measurement wafer heat flux sensor including at least a bottom temperature sensor thermally coupled to a substrate and insulated from a cover by a first portion of the thermal barrier and at least a top temperature sensor thermally coupled to the cover and insulated from the substrate by an additional portion of the thermal barrier, wherein the first portion of the thermal barrier is contiguous with the additional portion of the thermal barrier, the bottom temperature sensor and the top temperature sensor disposed in a sensor cavity of the measurement wafer heat flux sensor;
acquiring temperature measurements from the bottom temperature sensor and the top temperature sensor of the measurement wafer heat flu

Assignees

• Kla Tencor Corp

Inventors

• Sharratt Stephen
• Quli Farhat
• Jensen Earl
• Sun Mei

Classifications

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• G01K19/00 Primary

  Testing or calibrating calorimeters · CPC title

• G01K17/00

  Measuring quantity of heat (measuring temperature by calorimetry G01K3/00 - G01K11/00; specially adapted for measuring thermal properties of materials, e.g. specific heat, heat of combustion G01N) · CPC title