Resin composition and pattern forming method using the same

Patent metadata

Field	Value
Publication number	US-9718901-B2
Application number	US-201414586129-A
Country	US
Kind code	B2
Filing date	Dec 30, 2014
Priority date	Jul 27, 2012
Publication date	Aug 1, 2017
Grant date	Aug 1, 2017

Abstract

A resin composition of the present invention includes a polymer compound (A) containing a repeating unit (Q) represented by the following general formula (1):

wherein
R 1 represents a hydrogen atom, a methyl group, or a halogen atom;
R 2 and R 3 represent a hydrogen atom, an alkyl group, or a cycloalkyl group;
L represents a divalent linking group or a single bond;
Y represents a substituent excluding a methylol group;
Z represents a hydrogen atom or a substituent;
m represents an integer of 0 to 4;
n represents an integer of 1 to 5; and
m+n is 5 or less.

First claim

What is claimed is:

1. A resin composition comprising a polymer compound (A) containing a first repeating unit (Q) represented by the following general formula (2′):

wherein
R 1 represents a hydrogen atom, a methyl group, or a halogen atom;
Y represents a substituent excluding a methylol group;
Z represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, a cycloalkyl group, an aryl group, a haloalkyl group, an alkanoyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, an alkylsulfonyloxy group, an arylsulfonyloxy group, an alkylsulfonyl group, an arylsulfonyl group, a cyano group, an alkylthio group, an arylthio group, an alkoxyalkyl group, or a heterocyclic group;
f represents an integer of 0 to 6;
g represents 0 or 1;
m represents an integer of 0 to 4;
n represents an integer of 1 to 5;
m+n is 5 or less;
in the case where m is 2 or more, plural Y's may be the same as or different from each other;
in the case where n is 2 or more, plural Z's may be the same as or different from each other;
any two or more of Y and Z may be bonded to each other to form a ring structure; and
Ar represents an aromatic ring.

2. The resin composition according to claim 1 , wherein n in general formula (2′) is an integer of 2 to 4.

3. The resin composition according to claim 1 , wherein the polymer compound (A) further contains a second repeating unit (P) represented by the following general formula (4), and the second repeating unit (P) does not correspond to the first repeating unit (Q):

wherein
R 1 ′ represents a hydrogen atom, a methyl group, or a halogen atom;
X represents a (p+1)-valent linking group or a single bond; and
p represents an integer of 1 or more.

4. The resin composition according to claim 3 , wherein the second repeating unit (P) represented by the general formula (4) is represented by the following general formula (5) or (6):

wherein
R 1 ′ and p are as defined in the general formula (4);
B 1 and B 2 represent a divalent linking group or a single bond; and
Ar represents an aromatic ring.

5. The resin composition according to claim 1 , further comprising a compound (B) capable of generating an acid by irradiation with actinic rays or radiation.

6. The resin composition according to claim 5 , the compound (B) including an organic anion represented by the following general formula (9), (10), or (11):

wherein
R c1 , R c2 , R c3 and R c4 each independently represents an alkyl group in which the 1-position is substituted with a fluorine atom or a fluoroalkyl group, or a phenyl group substituted with a fluorine atom or a fluoroalkyl group.

7. The resin composition according to claim 5 , wherein the compound (B) is an onium compound, and the acid that the compound (B) generates by the irradiation with actinic rays or radiation has a volume of 130 Å 3 or more.

8. The resin composition according to claim 1 , wherein the dispersity of the polymer compound (A) is from 1.0 to 1.20.

9. The resin composition according to claim 1 , further comprising a compound (C) as a cross-linking agent.

10. The resin composition according to claim 1 , which is a chemical amplification type resist composition.

11. The resin composition according to claim 1 , further comprising a photodegradable basic compound.

12. The resin composition according to claim 1 , further comprising a compound which has increasing basicity under action of an acid.

13. The resin composition according to claim 1 , wherein in the general formula (2′),
Z represents a methyl group.

14. An actinic ray-sensitive or radiation-sensitive film comprising the resin composition according to claim 1 .

15. Mask blanks having the actinic ray-sensitive or radiation-sensitive film according to claim 14 on a surface thereof.

16. A pattern forming method comprising: irradiating the mask blanks according to claim 15 with actinic rays or radiation; and developing the mask blanks irradiated with actinic rays or radiation.

17. A pattern forming method comprising:
irradiating an actinic ray-sensitive or radiation-sensitive film comprising the resin composition according to claim 1 with actinic rays or radiation; and
developing the film irradiated with the actinic rays or radiation with organic developer, the moisture content in the entire volume of the organic developer being less than 10% by mass.

18. The pattern forming method according to claim 17 , wherein the irradiation with the actinic rays or radiation is carried out using an electron beam or extreme ultraviolet rays.

19. A method for manufacturing an electronic device, comprising the pattern forming method according to claim 17 .

20. The pattern forming method according to claim 17 utilized for forming a negative tone pattern.

21. A polymer compound containing two kinds of repeating units represented by the following general formula (I) or two kinds of repeating units represented by the following general formula (II):

wherein
Y′ represents an alkyl group, a cycloalkyl group, or an aryl group;
Y″ represents a hydrogen atom, an alkyl group, a cycloalkyl group, or an aryl group;
Z′ represents a hydrogen atom, an alkyl group, or a cycloalkyl group;
m is 0 or 1;
n represents an integer of 1 to 3; and
a represents an integer of 2 to 6.

22. A resin composition comprising a polymer compound (A) containing a first repeating unit (Q) represented by the following general formula (3′):

wherein
R 1 represents a hydrogen atom, a methyl group, or a halogen atom;
Y represents a substituent excluding a methylol group;
Z represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, a cycloalkyl group, an aryl group, a haloalkyl group, an alkanoyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, an alkylsulfonyloxy group, an arylsulfonyloxy group, an alkylsulfonyl group, an arylsulfonyl group, a cyano group, an alkylthio group, an arylthio group, an alkoxyalkyl group and a heterocyclic group;
g represents 1;
m represents an integer of 0 to 4;
n represents an integer of 1 to 5;
m+n is 5 or less;
in the case where m is 2 or more, plural Y's may be the same as or different from each other;
in the case where n is 2 or more, plural Z's may be the same as or different from each other;
W 3 represents a monocyclic or polycyclic aromatic hydrocarbon ring which may have a substituent having 6 to 18 carbon atoms, —C(═O)—, a cycloalkylene group, or a cyclic lactone structure; and
any two or more of Y and Z may be bonded to each other to form a ring structure,

Assignees

• Fujifilm Corp

Inventors

• Tsuruta Takuya
• Tsuchimura Tomotaka
• Iwato Kaoru

Classifications

• G03F7/0392

  the macromolecular compound being present in a chemically amplified positive photoresist composition · CPC title

• G03F7/0388

  with ethylenic or acetylenic bands in the side chains of the photopolymer · CPC title

• G03F7/0382

  the macromolecular compound being present in a chemically amplified negative photoresist composition · CPC title

• G03F7/0045

  with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title

• C08F12/32

  containing two or more rings · CPC title