Method and apparatus for polishing workpiece

Patent metadata

Field	Value
Publication number	US-9707659-B2
Application number	US-201113976205-A
Country	US
Kind code	B2
Filing date	Oct 19, 2011
Priority date	Dec 27, 2010
Publication date	Jul 18, 2017
Grant date	Jul 18, 2017

Abstract

In a polishing method of the present invention, the temperature of a carrier plate is measured, and the amount of polishing removal of a workpiece (workpiece) is accurately controlled based on change in the measured temperature of the carrier plate.

First claim

The invention claimed is:

1. A method for polishing a workpiece, in which a front surface and a back surface of the workpiece are simultaneously polished by holding a workpiece in a carrier plate having one or more retention openings each for retaining a workpiece, at least one of the retention openings being eccentrically disposed, and by rotating at least the carrier plate between an upper polishing plate and a lower polishing plate, with a polishing slurry being supplied;
wherein a temperature of the carrier plate is measured, and a termination of polishing of the workpiece is controlled based on a change in the measured temperature of the carrier plate.

2. The method for polishing a workpiece, according to claim 1 , wherein the termination of polishing of the workpiece is controlled based on a change of phase calculated from the change in the temperature of the carrier plate.

3. The method for polishing a workpiece, according to claim 1 , wherein the termination of polishing of the workpiece is controlled based on a change of amplitude calculated from the change in the temperature of the carrier plate.

4. The method for polishing a workpiece, according to claim 1 , wherein the termination of polishing of the workpiece is controlled based on both a change of phase and a change of amplitude calculated from the change in the temperature of the carrier plate.

5. The method for polishing a workpiece, according to any one of claims 1 to 4 , wherein the polishing is performed with an outer edge of the carrier plate being protruded outward in a radial direction from edges of the upper and lower polishing plates, and a temperature of the protruded outer edges of the carrier plate is measured with an optical temperature measurement means.

6. An apparatus for polishing both surfaces of a workpiece, including: a rotatable carrier plate in which one or more retention openings each for retaining a workpiece to be polished is formed, at least one of the retention openings being eccentrically disposed; and a lower polishing plate and an upper polishing plate paired with the lower polishing plate for carrying the carrier plate, comprising:
a means for measuring a temperature of the carrier plate; and
a control means for terminating polishing of the workpiece in accordance with the measured temperature.

7. The apparatus for polishing a workpiece, according to claim 6 , wherein the temperature measurement means is an optical measurement means.

8. A method for polishing a workpiece, in which a front surface and a back surface of the workpiece are simultaneously polished by holding a workpiece in a carrier plate having one or more retention openings each for retaining a workpiece, at least one of the retention openings being eccentrically disposed, and by rotating at least the carrier plate between an upper polishing plate and a lower polishing plate, with a polishing slurry being supplied;
wherein a temperature of the carrier plate is measured, and an amount of polishing removal of the workpiece is controlled based on a change in the measured temperature of the carrier plate, wherein the polishing is performed with an outer edge of the carrier plate being protruded outward in a radial direction from edges of the upper and lower polishing plates, and a temperature of the protruded outer edge of the carrier plate is measured with an optical temperature measurement means.

9. The method for polishing a workpiece, according to claim 8 , wherein the amount of polishing removal of the workpiece is controlled based on a change of phase calculated from the change in the temperature of the carrier plate.

10. The method for polishing a workpiece, according to claim 8 , wherein the amount of polishing removal of the workpiece is controlled based on a change of amplitude calculated from the change in the temperature of the carrier plate.

11. The method for polishing a workpiece, according to claim 8 , wherein the amount of polishing removal of the workpiece is controlled based on both a change of phase and a change of amplitude calculated from the change in the temperature of the carrier plate.

12. An apparatus for polishing both surfaces of a workpiece, including: a rotatable carrier plate in which one or more retention openings each for retaining a workpiece to be polished is formed, at least one of the retention openings being eccentrically disposed; and a lower polishing plate and an upper polishing plate paired with the lower polishing plate for carrying the carrier plate, an outer edge of the carrier plate being protruded outward in a radial direction from the edges of the upper and lower polishing plates, comprising:
an optical measurement means for measuring a temperature of the protruded outer edge of the carrier plate; and
a control means for controlling an amount of the polishing removal of the workpiece in accordance with the measured temperature.

Assignees

• Ogata Shinichi
• Tanimoto Ryuichi
• Takanashi Keiichi
• Sumco Corp

Inventors

• Ogata Shinichi
• Tanimoto Ryuichi
• Takanashi Keiichi

Classifications

• B24B49/14

  taking regard of the temperature during grinding · CPC title

• B24B37/015

  Temperature control · CPC title

• B24B37/005 Primary

  Control means for lapping machines or devices · CPC title

• B24B37/08

  for double side lapping · CPC title

• H10P52/00 Primary

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title