Multi-substrate thermal management apparatus

Patent metadata

Field	Value
Publication number	US-9696097-B2
Application number	US-201414504021-A
Country	US
Kind code	B2
Filing date	Oct 1, 2014
Priority date	Aug 1, 2014
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

Embodiments of multi-substrate thermal management apparatus are provided herein. In some embodiments, a multi-substrate thermal management apparatus includes a plurality of plates vertically arranged above one another; a plurality of channels extending through each of the plurality of plates; a supply manifold including a supply channel coupled to the plurality of plates at first locations; and a return manifold including a return channel coupled to the plurality of plates via a plurality of legs at second locations, wherein the supply and return channels are fluidly coupled to the plurality of channels to flow a heat transfer fluid through the plurality of plates.

First claim

The invention claimed is:

1. A multi-substrate thermal management apparatus, comprising:
a plurality of plates vertically arranged above one another and spaced apart to enable a substrate to be raised off of or lowered onto an upper surface of each of the plurality of plates;
a plurality of channels extending through each of the plurality of plates;
a supply manifold including a supply channel coupled to the plurality of plates at first locations; and
a return manifold including a return channel coupled to the plurality of plates via a plurality of legs at second locations, wherein the supply and return channels are fluidly coupled to the plurality of channels to flow a heat transfer fluid through the plurality of plates, and wherein the plurality of legs includes a plurality of channels fluidly coupled to the plurality of channels in the plurality of plates, and wherein diameters of the plurality of channels in the plurality of legs decrease from a leg furthest from a fluid source to a leg nearest the fluid source.

2. The multi-substrate thermal management apparatus of claim 1 , wherein each of the plurality of plates includes a plurality of contact elements on an upper surface to support a substrate thereon.

3. The multi-substrate thermal management apparatus of claim 2 , wherein the plurality of contact elements includes 41 contact elements.

4. The multi-substrate thermal management apparatus of claim 2 , wherein the plurality of contact elements are formed of silicon nitride (SiN).

5. The multi-substrate thermal management apparatus of claim 2 , wherein the plurality of contact elements have a height of about 0.007 inches from an upper surface of each the plurality of plates.

6. The multi-substrate thermal management apparatus of claim 2 , wherein the plurality of contact elements are equally distributed around each of the plurality of plates.

7. The multi-substrate thermal management apparatus of claim 1 , wherein the diameters of the plurality of channels in the plurality of legs decrease from about 0.1875 inches at the uppermost leg to about 0.1495 inches at the lowermost leg.

8. The multi-substrate thermal management apparatus of claim 1 , wherein each of the plurality of plates has a thickness between about 0.38 inches and 0.5 inches.

9. The multi-substrate thermal management apparatus of claim 1 , further comprising:
a plurality of pins extending from an upper surface of each of the plurality of plates,
wherein when a substrate is disposed atop the plate, the plurality of pins surround the substrate to prevent sliding of the substrate.

10. The multi-substrate thermal management apparatus of claim 1 , further comprising:
a lift assembly including a plurality of prongs which extend through a corresponding plurality of notches in a periphery of the plurality of plates to lift a substrate off of an upper surface of the plate.

11. An apparatus for processing a substrate, comprising:
a factory interface for interfacing with a substrate processing platform, the factory interface including a docking station and a factory interface robot to facilitate transfer of substrates from the factory interface to the substrate processing platform;
a multi-substrate thermal management apparatus disposed between the factory interface and the substrate processing platform such that the factory interface robot can place substrate into or remove substrates from the multi-substrate thermal management apparatus; and
a heat transfer fluid supply coupled to the multi-substrate thermal management apparatus to provide a heat transfer fluid to the multi-substrate thermal management apparatus,
wherein the multi-substrate thermal management apparatus comprises:
a plurality of plates vertically arranged above one another;
a plurality of channels extending through each of the plurality of plates;
a supply manifold including a supply channel coupled to the plurality of plates at first locations; and
a return manifold including a return channel coupled to the plurality of plates via a plurality of legs at second locations, wherein the supply and return channels are fluidly coupled to the plurality of channels to flow a heat transfer fluid through the plurality of plates.

12. The apparatus of claim 11 , wherein each of the plurality of plates includes a plurality of contact elements on an upper surface to support a substrate thereon.

13. The apparatus of claim 12 , wherein the plurality of contact elements includes 41 contact elements.

14. The apparatus of claim 12 , wherein the plurality of contact elements are equally distributed around each of the plurality of plates.

15. The apparatus of claim 11 , wherein the plurality of legs includes a plurality of channels fluidly coupled to the plurality of channels in the plurality of plates.

16. The apparatus of claim 15 , wherein diameters of the plurality of channels in the plurality of legs decrease from a leg furthest from a fluid source to a leg nearest the fluid source.

17. The apparatus of claim 11 , wherein the multi-substrate thermal management apparatus further comprises:
a lift assembly including a plurality of prongs which extend through a corresponding plurality of notches in a periphery of the plurality of plates to lift a substrate off or lower the substrate onto an upper surface of the plate.

18. A multi-substrate thermal management apparatus, comprising:
a plurality of plates vertically arranged above one another and spaced apart to enable a substrate to be raised off of or lowered onto an upper surface of each of the plurality of plates, wherein each of the plurality of plates includes 41 contact elements equally distributed on an upper surface to support a substrate thereon;
a plurality of channels extending through each of the plurality of plates;
a supply manifold including a supply channel coupled to the plurality of plates at first locations; and
a return manifold including a return channel coupled to the plurality of plates via a plurality of legs at second locations,
wherein diameters of the plurality of channels in the plurality of legs decrease from a leg furthest from a fluid source to a leg nearest the fluid source, and
wherein the supply and return channels are fluidly coupled to the plurality of channels to flow a heat transfer fluid through the plurality of plates.

Assignees

• Applied Materials Inc

Inventors

• Bera Kallol
• Vellore Kim
• Constant Andrew
• Newman Jacob
• Blahnik Jeffrey
• Schaller Jason
• Weaver William
• Vopat Robert
• Riordon Benjamin

Classifications

• H10P72/0434 Primary

  mainly by convection · CPC title

• H10P72/12

  Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements · CPC title

• H01L21/67109

  Electricity · mapped topic

• F28F3/12 Primary

  Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)} · CPC title

• H01L21/67303

  Electricity · mapped topic