Wiring board and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9693466-B2
Application number	US-201213397867-A
Country	US
Kind code	B2
Filing date	Feb 16, 2012
Priority date	Feb 22, 2011
Publication date	Jun 27, 2017
Grant date	Jun 27, 2017

Abstract

The present invention is to provide a wiring board which can prevent whitening. The wiring board is made of a fiber reinforced resin plate, and has a through hole and a whitening prevention portion. The whitening prevention portion is made only with matrix resin forming the fiber reinforced resin plate, and is integrally formed in the fiber reinforced resin plate. Furthermore, the whitening prevention portion is arranged around the through hole.

First claim

What is claimed is:

1. A manufacturing method of a wiring board made of a fiber reinforced resin plate formed of matrix resin and a glass fiber portion and having a through hole, the manufacturing method comprising the steps of:
a reinforced fiber removing step which removes a forming portion of the through hole and a surrounding portion thereof from a prepreg forming the fiber reinforced resin plate;
a pressing forming step which presses the prepreg of the fiber reinforced resin plate in which the prepeg of the forming portion of the through hole and the surrounding portion thereof has been removed and causes matrix resin included in the prepeg to flow toward the forming portion, such that the forming portion is subsequently made only with the matrix resin and integrally formed in the fiber reinforced resin plate; and
a forming step which forms the through hole in the forming portion,
wherein the through hole is substantially surrounded by only the matrix resin, which is positioned between the through hole and the glass fiber portion, and configured to receive a terminal press-fit therethrough.

Assignees

• Harao Akira
• Matsunaga Mototatsu
• Takagi Yusuke
• Saneto Akinori
• Yazaki Corp

Inventors

• Harao Akira
• Matsunaga Mototatsu
• Takagi Yusuke
• Saneto Akinori

Classifications

• H05K3/445 Primary

  having insulated holes or insulated via connections through the metal core · CPC title

• H05K1/056

  the metal substrate being covered by an organic insulating layer · CPC title

• H05K2201/1081

  Special cross-section of a lead; Different cross-sections of different leads; Matching cross-section, e.g. matched to a land · CPC title

• H05K2201/1059

  Connections made by press-fit insertion · CPC title

• H05K3/325

  by abutting or pinching; Mechanical auxiliary parts therefor · CPC title