Method of dividing plate-shaped workpieces

Patent metadata

Field	Value
Publication number	US-9685378-B2
Application number	US-201615264031-A
Country	US
Kind code	B2
Filing date	Sep 13, 2016
Priority date	Sep 14, 2015
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

Disclosed herein is a method of dividing rectangular plate-shaped workpieces into individual device chips including a detecting step wherein an annular frame to which a plurality of rectangular plate-shaped workpieces are stuck is held on a chuck table and the positions and angles of the projected dicing lines on each of the plate-shaped workpieces are detected, and a dividing step wherein a laser beam having a wavelength which is absorbable by the plate-shaped workpieces is applied from a laser beam applying unit to the plate-shaped workpieces while the chuck table and the laser beam applying unit are being relatively processing-fed and finely adjusted for each of the plate-shaped workpieces on the basis of the positions and angles detected in the detecting step, thereby dividing the plate-shaped workpieces into a plurality of device chips along the projected dicing lines.

First claim

What is claimed is:

1. A method of dividing rectangular plate-shaped workpieces into individual device chips, each of the plate-shaped workpieces having a plurality of devices formed in areas demarcated by projected dicing lines and arranged in at least one array, the method comprising:
a plate-shaped workpiece sticking step of sticking an adhesive tape to an annular frame having an opening and sticking the rectangular plate-shaped workpieces to a surface of the adhesive tape in such a pattern that the plate-shaped workpieces have shorter sides spaced from each other by predetermined distances in aligned arrays within the opening;
a detecting step, after performing the plate-shaped workpiece sticking step, of holding the annular frame to which the plurality of rectangular plate-shaped workpieces are stuck on a chuck table of a laser processing apparatus and detecting positions and angles of the projected dicing lines on each of the plate-shaped workpieces, with detecting means; and
a dividing step, after performing the detecting step, of applying a laser beam having a wavelength which is absorbable by the plate-shaped workpieces from laser beam applying means to the plate-shaped workpieces while the chuck table and the laser beam applying means are being relatively processing-fed and finely adjusted for each of the plate-shaped workpieces on the basis of the positions and angles detected in the detecting step, thereby dividing the plate-shaped workpieces into a plurality of device chips along the projected dicing lines.

Assignees

• Disco Corp

Inventors

• Yoshikawa Toshiyuki
• Sampei Takashi

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• B23K26/38

  by boring or cutting · CPC title

• B23K2101/40

  Semiconductor devices · CPC title

• B23K2101/42

  Printed circuits · CPC title