Substrate support assembly having metal bonded protective layer

Patent metadata

Field	Value
Publication number	US-9685356-B2
Application number	US-201313842044-A
Country	US
Kind code	B2
Filing date	Mar 15, 2013
Priority date	Dec 11, 2012
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

A substrate support assembly comprises a ceramic body and a thermally conductive base bonded to a lower surface of the ceramic body. The substrate support assembly further comprises a protective layer metal bonded to an upper surface of the ceramic body, wherein the protective layer is a bulk sintered ceramic article.

First claim

What is claimed is:

1. An electrostatic chuck comprising:
a ceramic body having a first ceramic material composition;
a thermally conductive base bonded to a lower surface of the ceramic body; and
a plasma resistant protective layer bonded to an upper surface of the ceramic body by a metal bond that is substantially in direct physical contact with the ceramic body and the plasma resistant protective layer, the plasma resistant protective layer comprising a bulk sintered ceramic article having a second ceramic material composition that is different from the first ceramic material composition, wherein the metal bond functions as an electrode of the electrostatic chuck, and wherein the metal bond comprises:
a first metal layer;
a second metal layer; and
a third metal layer between the first metal layer and the second metal layer, the third metal layer comprising a combination of at least two different metals; and

an electrode connection, formed in the ceramic body, that is to electrically connect the metal bond to at least one of a power source or a radio frequency source, the electrode connection comprising a hole filled with an electrically conductive material.

2. The electrostatic chuck of claim 1 , wherein the plasma resistant protective layer is a ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 .

3. The electrostatic chuck of claim 1 , wherein the ceramic body does not include any electrode.

4. The electrostatic chuck of claim 1 , wherein the thermally conductive base is bonded to the lower surface of the ceramic body by an additional metal bond, and wherein the thermally conductive base comprises one or more heating elements.

5. The electrostatic chuck of claim 1 , wherein a thickness of the metal bond is approximately 5-20 mil and a thickness of the plasma resistant protective layer is approximately 200-900 microns.

6. The electrostatic chuck of claim 1 , wherein:
the first metal layer comprises at least one of tin or indium;
the second metal layer comprises at least one of tin or indium; and
the combination of the two different metals in the third metal layer comprises at least one of a combination of aluminum and nickel or a combination of copper and nickel.

7. The electrostatic chuck of claim 1 , wherein the thermally conductive base is bonded to the lower surface of the ceramic body by a silicone bond, and wherein the ceramic body comprises one or more heating elements.

8. The electrostatic chuck of claim 1 , further comprising:
at least one of a gasket or an o-ring between the upper surface of the ceramic body and the protective layer, at least one of the gasket or the o-ring being at an outer perimeter of the upper surface to protect the metal bond.

9. The electrostatic chuck of claim 1 , wherein the plasma resistant protective layer comprises Y x Al y O z .

10. The electrostatic chuck in claim 1 , wherein the electrostatic chuck is capable of temperature changes at a rate of change of +/−2° C./s.

11. A substrate support assembly having a ceramic body, a thermally conductive base bonded to a lower surface of the ceramic body, and a plasma resistant protective layer bonded to an upper surface of the ceramic body by a metal bond that is substantially in direct physical contact with the ceramic body and the plasma resistant protective layer, the substrate support assembly having been manufactured by a manufacturing process comprising:
bonding the lower surface of the ceramic body to the thermally conductive base, wherein the ceramic body has a first ceramic material composition; and
bonding the upper surface of the ceramic body to the plasma resistant protective layer by a metal bonding process, wherein the plasma resistant protective layer has a second ceramic material composition that is different from the first ceramic material composition, and wherein bonding the upper surface of the ceramic body to the plasma resistant protective layer comprises:
coating the upper surface of the ceramic body with a first metal layer;
coating a surface of the plasma resistant protective layer with a second metal layer;
positioning the coated surface of the plasma resistant protective layer against the coated upper surface of the ceramic body with a reactive foil there between, the reactive foil comprising at least two different metals; and
igniting the reactive foil to form a metal bond based on melting the first metal layer and the second metal layer, wherein the metal bond functions as an electrode of the substrate support assembly, and wherein the metal bond comprises the first metal layer, the second metal layer and a third metal layer between the first metal layer and the second metal layer, the third metal layer comprising a combination of the at least two different metals; and

forming an electrode connection that is to electrically connect the metal bond to at least one of a power source or a radio frequency source, the electrode connection comprising a hole filled with an electrically conductive material.

12. The substrate support assembly of claim 11 , the manufacturing process further comprising:
positioning a gasket on an outer perimeter of the coated upper surface of the ceramic body prior to positioning the plasma resistant protective layer on the ceramic body; and
compressing the gasket.

13. The substrate support assembly of claim 11 , the manufacturing process further comprising:
grinding the plasma resistant protective layer from an initial thickness to a final thickness of approximately 150-400 microns after performing the bonding;
forming mesas on an upper surface of the plasma resistant protective layer; and
drilling holes in at least one of the plasma resistant protective layer or the ceramic body.

Assignees

• Applied Materials Inc

Inventors

• Parkhe Vijay D
• Narendrnath Kadthala Ramaya

Classifications

• H10P72/72 Primary

  using electrostatic chucks · CPC title

• H10P72/0434 Primary

  mainly by convection · CPC title

• H01J37/32715

  Workpiece holder · CPC title

• Y10T279/23

  with magnetic or electrostatic means · CPC title

• Y10T156/10

  Methods of surface bonding and/or assembly therefor · CPC title