Processing apparatus and processing method of stack

Patent metadata

Field	Value
Publication number	US-9682544-B2
Application number	US-201615147020-A
Country	US
Kind code	B2
Filing date	May 5, 2016
Priority date	Aug 30, 2013
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.

First claim

The invention claimed is:

1. A method for manufacturing a semiconductor device comprising the steps of:
fixing part of a stack to a fixing mechanism, the stack including a transistor;
attaching a first adsorption jig, a second adsorption jig and a third adsorption jig to a first periphery of the stack, and attaching a fourth adsorption jig, a fifth adsorption jig and a sixth adsorption jig to a second periphery of the stack;
moving the first adsorption jig, the second adsorption jig and the third adsorption jig so that a flexible substrate is partially separated from the stack;
fixing a first clamp jig to the flexible substrate at a position between the first adsorption jig and the second adsorption jig, and fixing a second clamp jig to the flexible substrate at a position between the second adsorption jig and the third adsorption jig; and
moving the first adsorption jig, the second adsorption jig, the third adsorption jig, the first clamp jig and the second clamp jig so that the flexible substrate is separated from the stack.

2. The method for manufacturing a semiconductor device according to claim 1 , further comprising a step of making a slit to the stack by laser processing before fixing the part of the stack to the fixing mechanism.

3. The method for manufacturing a semiconductor device according to claim 1 , wherein the first adsorption jig, the second adsorption jig and the third adsorption jig are moved in a different direction from the first clamp jig and the second clamp jig.

4. The method for manufacturing a semiconductor device according to claim 3 , wherein the first adsorption jig, the second adsorption jig and the third adsorption jig are moved upward, and the first clamp jig and the second clamp jig are moved in vertical to an end surface of the flexible substrate.

5. A method for manufacturing a semiconductor device comprising the steps of:
fixing part of a stack to a fixing mechanism, the stack including a transistor;
attaching a first adsorption jig, a second adsorption jig and a third adsorption jig to a first periphery of the stack, and attaching a fourth adsorption jig, a fifth adsorption jig and a sixth adsorption jig to a second periphery of the stack;
moving the first adsorption jig, the second adsorption jig and the third adsorption jig while supplying liquid to the stack so that a flexible substrate is partially separated from the stack;
fixing a first clamp jig to the flexible substrate at a position between the first adsorption jig and the second adsorption jig, and fixing a second clamp jig to the flexible substrate at a position between the second adsorption jig and the third adsorption jig; and
moving the first adsorption jig, the second adsorption jig, the third adsorption jig, the first clamp jig and the second clamp jig so that the flexible substrate is separated from the stack.

6. The method for manufacturing a semiconductor device according to claim 5 , further comprising a step of making a slit to the stack by laser processing before fixing the part of the stack to the fixing mechanism.

7. The method for manufacturing a semiconductor device according to claim 5 , wherein the first adsorption jig, the second adsorption jig and the third adsorption jig are moved in a different direction from the first clamp jig and the second clamp jig.

8. The method for manufacturing a semiconductor device according to claim 7 , wherein the first adsorption jig, the second adsorption jig and the third adsorption jig are moved upward, and the first clamp jig and the second clamp jig are moved in vertical to an end surface of the flexible substrate.

Assignees

• Semiconductor Energy Lab

Inventors

• Kumakura Kayo
• Aoyama Tomoya
• Chida Akihiro
• Yokoyama Kohei
• Ohno Masakatsu
• Idojiri Satoru
• Ikeda Hisao
• Adachi Hiroki
• Hirakata Yoshiharu
• Eguchi Shingo
• Jinbo Yasuhiro

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• Y10T156/1168

  Gripping and pulling work apart during delaminating · CPC title

• Y10T156/1961

  Severing delaminating means [e.g., chisel, etc.] · CPC title

• B26D2001/006

  the cutting blade having a special shape, e.g. a special outline, serrations · CPC title