Resin composition, prepreg, metal foil with resin, metal-clad laminated plate, and printed wiring board

Patent metadata

Field	Value
Publication number	US-9681541-B2
Application number	US-201615130943-A
Country	US
Kind code	B2
Filing date	Apr 16, 2016
Priority date	Oct 22, 2014
Publication date	Jun 13, 2017
Grant date	Jun 13, 2017

Abstract

Resin composition of the present disclosure includes: an epoxy resin; and a hardener, in which the hardener contains a styrene-maleic anhydride copolymer (SMA) and an anhydride having only one anhydride group in a molecule. An acid value of the SMA is in a range from 300 to 550, inclusive. A ratio of an anhydride equivalent number of the anhydride with respect to an epoxy group equivalent number of the epoxy resin is in a range from 0.05 to 0.5, inclusive. A ratio of the total number of the equivalent numbers of the anhydride groups of the anhydride and the SMA with respect to the epoxy group equivalent number is a range from 0.5 to 1.2, inclusive.

First claim

What is claimed is:

1. A resin composition comprising:
an epoxy resin; and
a hardener,
wherein the hardener contains a styrene-maleic anhydride copolymer and an anhydride having only one anhydride group in a molecule,
an acid value of the styrene-maleic anhydride copolymer is in a range from 300 to 550, inclusive,
a ratio of an anhydride group equivalent number of the anhydride with respect to an epoxy group equivalent number of the epoxy resin is in a range from 0.05 to 0.5, inclusive, and
a ratio of a total number of an anhydride group equivalent number of the anhydride and an anhydride group equivalent number of the styrene-maleic anhydride copolymer with respect to the epoxy group equivalent number is in a range from 0.5 to 1.2, inclusive.

2. The resin composition of claim 1 , further comprising:
a preliminary reaction product obtained by a reaction between the anhydride and the epoxy resin.

3. The resin composition of claim 1 ,
wherein the epoxy resin contains a dicyclopentadiene type epoxy resin.

4. A prepreg comprising:
the resin composition of claim 1 ; and
a base material impregnated with the resin composition.

5. A metal foil with resin, comprising:
a metal layer; and
an insulating layer provided on the metal layer,
wherein the insulating layer contains an unhardened product of the resin composition of claim 1 .

6. A metal-clad laminated plate comprising:
an insulating layer containing a hardened product of the resin composition of claim 1 ; and
a metal layer provided on the insulating layer.

7. A printed wiring board comprising:
an insulating layer containing a hardened product of the resin composition of claim 1 ; and
a wiring provided on the insulating layer.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Higashida Toshiyuki
• Motobe Hidetsugu
• Nii Daisuke

Classifications

• B32B2260/046

  Synthetic resin · CPC title

• B32B2307/20

  having particular electrical or magnetic properties, e.g. piezoelectric · CPC title

• H05K3/022

  Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates · CPC title

• B32B15/092

  comprising epoxy resins · CPC title

• B32B2260/021

  Fibrous or filamentary layer · CPC title