Multi-chip fan out package and methods of forming the same
US-9691706-B2 · Jun 27, 2017 · US
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Hung Jui-Pin patents
Hung Jui-Pin holds 8 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 8 |
| Recent patents | 0 |
| First publication | Jan 20, 2015 |
| Latest publication | Jun 27, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Molding wafer chamber
US-9679783-B2 · Jun 13, 2017 · US
Methods for molding integrated circuits
US-9662812-B2 · May 30, 2017 · US
Methods of packaging semiconductor devices and structures thereof
US-9117682-B2 · Aug 25, 2015 · US
Packaging methods and structures using a die attach film
US-9064879-B2 · Jun 23, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Multi-chip fan out package and methods of forming the same
US-9691706-B2 · Jun 27, 2017 · US
Molding wafer chamber
US-9679783-B2 · Jun 13, 2017 · US
Methods for molding integrated circuits
US-9662812-B2 · May 30, 2017 · US
Methods of packaging semiconductor devices and structures thereof
US-9117682-B2 · Aug 25, 2015 · US
Packaging methods and structures using a die attach film
US-9064879-B2 · Jun 23, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W72/0198 | 7 |
| H10W74/00 | 6 |
| H10W72/241 | 5 |
| H10W70/09 | 5 |
| H10W74/014 | 5 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 8 |
| Operations & Transport | 2 |