Laser processing of sapphire substrate and related applications

Patent metadata

Field	Value
Publication number	US-9676167-B2
Application number	US-201414529976-A
Country	US
Kind code	B2
Filing date	Oct 31, 2014
Priority date	Dec 17, 2013
Publication date	Jun 13, 2017
Grant date	Jun 13, 2017

Abstract

A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a hole or fault line along the laser beam focal line within the material, and directing a defocused carbon dioxide (CO 2 ) laser from a distal edge of the material over the plurality of holes to a proximal edge of the material.

First claim

What is claimed is:

1. An article comprising sapphire, the article including an edge having a series of defect lines where each defect line extends at least 250 μm, the defect lines are less than 5 μm in diameter, the edge has a surface roughness Ra <0.5 μm, and the subsurface damage of the edge is <100 μm.

2. The article of claim 1 , wherein the subsurface damage of the edge is <75 μm.

3. The article of claim 1 , wherein the defect lines extend through the full thickness of the article.

4. The article of claim 1 , wherein a distance between the defect lines is greater than 0.5 μm and less than or equal to about 15 μm.

5. The article of claim 1 , wherein the article is less than 1.5 mm thick.

6. The article of claim 5 , wherein the article is a circular disk.

7. The article of claim 1 , wherein the article comprises a glass substrate with a sapphire layer attached thereto.

8. The article of claim 7 , wherein the glass substrate is from 100 microns to 1 mm thick, and the sapphire layer is from 1 micron to 600 microns thick.

Assignees

• Corning Inc

Inventors

• Marjanovic Sasha
• Piech Garrett Andrew
• Tsuda Sergio
• Wagner Robert Stephen

Classifications

• B23K26/0613

  having a common axis (B23K26/0619 takes precedence) · CPC title

• Y02P40/57

  Improving the yield, e-g- reduction of reject rates · CPC title

• B32B17/06 Primary

  comprising glass as the main or only constituent of a layer, next to another layer of a specific {material} · CPC title

• Y10T428/24273

  including aperture · CPC title

• B23K26/0624

  using ultrashort pulses, i.e. pulses of 1 ns or less · CPC title