Storage device

Patent metadata

Field	Value
Publication number	US-9668377-B2
Application number	US-201313942858-A
Country	US
Kind code	B2
Filing date	Jul 16, 2013
Priority date	Jul 19, 2012
Publication date	May 30, 2017
Grant date	May 30, 2017

Abstract

A storage device includes: a first semiconductor device mounted on a substrate; a housing accommodating the substrate, with the substrate fixed on a first fixing unit that is coupled to a first surface of the housing; and a first thermal conductive plate disposed between the first semiconductor device and the housing, with the first thermal conductive plate thermally connected to the housing, wherein the first thermal conductive plate has a thermal conductivity that is higher than that of the substrate. Thus, the storage device may dissipate heat generated by the semiconductor device rapidly to the outside or away from the storage device.

First claim

What is claimed is:

1. A storage device comprising:
a first semiconductor device mounted on a substrate;
a housing accommodating the substrate, wherein the substrate is fixed on a first fixing unit that is directly coupled to a first surface of the housing; and
a first thermal conductive plate disposed between the first semiconductor device and the housing, wherein the first thermal conductive plate is thermally connected to the housing,
wherein at least a part of the first fixing unit and the first thermal conductive plate each have a thermal conductivity that is greater than a thermal conductivity of the substrate,
wherein the first thermal conductive plate is spaced apart from the substrate,
wherein the housing further comprises a second fixing unit coupled to a second surface of the housing that is different than the first surface of the housing, wherein the first thermal conductive plate is coupled to the housing via the second fixing unit, and wherein at least a major portion of the first thermal conductive plate is spaced apart from the second surface of the housing.

2. The storage device of claim 1 , wherein the first fixing unit is formed of a material having a thermal conductivity that is greater than a thermal conductivity of the housing.

3. The storage device of claim 1 , further comprising:
an electronic device electrically connected to the substrate; and
a heat insulating pad disposed between the electronic device and the first thermal conductive plate.

4. The storage device of claim 1 , wherein the first fixing unit and the second fixing unit are respectively located on opposite surfaces of the housing, and the first thermal conductive plate coupled to the housing by the second fixing unit is curved convexly toward the first semiconductor device.

5. The storage device of claim 1 , wherein a second semiconductor device is further mounted on the substrate, and the first thermal conductive plate has an opening aligned with the second semiconductor device.

6. The storage device of claim 1 , wherein the first fixing unit comprises a plurality of spaced-apart fixing members.

7. The storage device of claim 3 , wherein the housing comprises:
a first sub-housing comprising the first fixing unit; and
a second sub-housing,
wherein the housing further comprises a heat insulating interposer between at least a portion of the first sub-housing and the second sub-housing.

8. The storage device of claim 4 , wherein the first thermal conductive plate that is curved is configured to physically contact the first semiconductor device.

9. The storage device of claim 8 , wherein the housing comprises:
a first sub-housing comprising the first fixing unit; and
a second sub-housing comprising the second fixing unit,
wherein the first thermal conductive plate elastically contacts the first semiconductor device when the second sub-housing is coupled to the first sub-housing.

10. The storage device of claim 9 , wherein a plurality of the first semiconductor devices are provided on the substrate, and a plurality of the first thermal conductive plates are formed such that a respective one of the first thermal conductive plates elastically contacts a respective one of the plurality of the first semiconductor devices.

11. A storage device comprising:
a first semiconductor device mounted on a substrate;
a housing accommodating the substrate, wherein the substrate is fixed on a first fixing unit that is directly coupled to a first surface of the housing; and
a first thermal conductive plate disposed between the first semiconductor device and the housing, wherein the first thermal conductive plate is thermally connected to the housing,
wherein at least a part of the first fixing unit and the first thermal conductive plate each have a thermal conductivity that is greater than a thermal conductivity of the substrate,
wherein the first thermal conductive plate is spaced apart from the substrate,
wherein the first thermal conductive plate is fixed on the first fixing unit in a spaced-apart relationship with the substrate,
wherein the housing further comprises a second fixing unit coupled to a second surface of the housing that is different from the first surface of the housing, the device further comprising a second thermal conductive plate fixed on the second fixing unit, wherein at least a major portion of the second thermal conductive plate is spaced apart from the second surface of the housing.

12. The storage device of claim 11 , wherein the second thermal conductive plate is curved convexly toward the first thermal conductive plate.

13. The storage device of claim 12 , wherein the housing comprises:
a first sub-housing comprising the first fixing unit; and
a second sub-housing comprising the second fixing unit,
wherein the second thermal conductive plate elastically contacts the first thermal conductive plate when the second sub-housing is coupled to the first sub-housing.

14. A storage device comprising:
a semiconductor device and an electronic device mounted on a substrate;
a housing accommodating the substrate;
a thermal conductor in thermal communication with the semiconductor device and the housing and configured to transfer heat generated by the semiconductor device to the housing; and
a heat insulating feature configured to insulate the electronic device from heat generated by the semiconductor device,
wherein:
the thermal conductor comprises a thermally conductive plate coupled to the housing, wherein the thermally conductive plate is spaced apart from the substrate; and
the heat insulating feature comprises an opening in the thermally conductive plate that is aligned with the electronic device.

15. The storage device of claim 14 , wherein:
the thermal conductor comprises a heat transfer medium disposed between the semiconductor device and the thermally conductive plate; and
the heat insulating feature comprises the electronic device being spaced apart from the thermally conductive plate.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lim Gwang-Man
• Byun Jae-Bum

Classifications

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K7/20445 Primary

  the coupling element being an additional piece, e.g. thermal standoff · CPC title

• H05K7/2039 Primary

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H05K7/20

  Modifications to facilitate cooling, ventilating, or heating · CPC title

• G06F1/20 Primary

  Cooling means · CPC title