Method for slicing wafers from a workpiece by means of a wire saw

US9662804B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9662804-B2
Application numberUS-201414557479-A
CountryUS
Kind codeB2
Filing dateDec 2, 2014
Priority dateDec 6, 2013
Publication dateMay 30, 2017
Grant dateMay 30, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for sawing a multiplicity of wafers from a workpiece by means of a wire web of a wire saw includes providing a wire web consisting of a plurality of parallel wire sections. The wire web is spanned by at least two wire guide rollers where each wire guide rollers comprises a core having two side surfaces and a lateral surface. The core is composed of a first material. Each core is rotatably mounted along its longitudinal axis and comprises at least two separate cavities. The lateral surface of each core is enclosed by a jacket composed of a second material. Parallel groves are cut into the jacket for guiding the wire sections of the web. The length of the jacket is altered thermally by means of at least one cavity being filled with a temperature regulating medium.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of sawing a multiplicity of wafers from a workpiece using a wire web of a wire saw, the method comprising: providing a wire web including a plurality of parallel wire sections wherein the wire web is spanned by at least two wire guide rollers, each wire guide roller comprising a core having two sides surfaces and a lateral surface, each core being composed of a first material and comprising at least two separate cavities; rotatably mounting each core along its longitudinal axis; enclosing the lateral surface of each core by a jacket composed of a second material, the jacket being fixed on at least one side surface of the wire guide roller using at least one clamping ring, and the jacket being configured to expand laterally over the at least one clamping ring, thereby controlling thermally induced expansion of the jacket; and cutting parallel grooves for guiding the wire sections of the wire web into the jacket, wherein a length of the jacket is altered thermally by means of at least one cavity containing a first temperature-regulating medium. 2. The method of claim 1 , wherein each of the at least two cavities contain a second temperature-regulating medium, each temperature-regulating medium having a different temperature. 3. The method of claim 2 , wherein the first and second temperature regulating medium are the same. 4. The method of claim 2 , wherein the first and second temperature regulating medium are the different. 5. The method of claim 1 , wherein the core comprises iron and nickel. 6. The method of claim 1 , wherein the core comprises high-grade steel. 7. The method of claim 1 , wherein the core comprises aluminum. 8. The method of claim 1 , wherein the core comprises a composite material. 9. The method of claim 1 , wherein the jacket comprises a polyurethane. 10. The method of claim 1 , wherein the jacket comprises a polyester. 11. The method of claim 1 , wherein the jacket comprises a polyester-based polyurethane. 12. The method of claim 1 , wherein an external diameter of the at least one clamping ring is smaller than an external diameter of the jacket. 13. The method of claim 1 , wherein at least one jacket side surface and a clamping ring side surface opposite the jacket side surface are not in direct contact with one another. 14. The method of claim 1 , wherein the jacket and the at least one clamping ring have the same outer diameter. 15. The method of claim 1 , wherein a side surface of the at least one clamping ring facing the jacket is perpendicular with respect to the jacket. 16. The method of claim 1 , wherein a side surface of the at least one clamping ring facing the jacket is outwardly linearly beveled. 17. The method of claim 1 , wherein a side surface of the at least one clamping ring facing the jacket is convex. 18. The method of claim 1 , wherein a side surface of the at least one clamping ring facing the jacket is concave. 19. The method of claim 1 , wherein the cavities are symmetric with respect to the longitudinal axis of at least one of the cores. 20. The method of claim 2 , further comprising: separately circulating the first and second temperature-regulating mediums into separate cavities using mutually separate temperature-regulating medium circulations.

Assignees

Inventors

Classifications

  • of devices for guiding or feeding strap saw blades · CPC title

  • B28D5/045Primary

    by cutting with wires or closed-loop blades (B28D5/042 takes precedence) · CPC title

  • Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material (B28D5/0005, B28D5/024 take precedence) · CPC title

  • Wafer tapes, e.g. grinding or dicing support tapes · CPC title

  • of semiconductor materials · CPC title

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Frequently asked questions

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What does patent US9662804B2 cover?
A method for sawing a multiplicity of wafers from a workpiece by means of a wire web of a wire saw includes providing a wire web consisting of a plurality of parallel wire sections. The wire web is spanned by at least two wire guide rollers where each wire guide rollers comprises a core having two side surfaces and a lateral surface. The core is composed of a first material. Each core is rotata…
Who is the assignee on this patent?
Siltronic Ag
What technology area does this patent fall under?
Primary CPC classification B28D5/045. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 30 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).