Stacked wafer-level packaging devices
US-2020091890-A1 · Mar 19, 2020 · US
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Patent family 57730188
This patent family groups 5 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 57730188 |
| Family type | — |
| Earliest priority | Jul 7, 2015 |
| First filing country | US |
| Member publications | 5 |
| Countries | US |
| Representative publication | US2020091890A1 — Stacked wafer-level packaging devices |
Representative publication
Best representative member for this family based on priority and filing country.
US2020091890A1 — Stacked wafer-level packaging devices (published Mar 19, 2020)
Member publications
Related publications in this family.
Stacked wafer-level packaging devices
US-10396753-B2 · Aug 27, 2019 · US
Stacked wafer-level packaging devices
US-2017324395-A1 · Nov 9, 2017 · US
Devices and methods related to stacked duplexers
US-9660609-B2 · May 23, 2017 · US
Devices and methods related to stacked duplexers
US-2017012603-A1 · Jan 12, 2017 · US