Organic semiconductor element, strain sensor, vibration sensor, and manufacturing method for organic semiconductor element
US-12068093-B2 · Aug 20, 2024 · US
US9658121B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9658121-B2 |
| Application number | US-201414913067-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 30, 2014 |
| Priority date | Aug 22, 2013 |
| Publication date | May 23, 2017 |
| Grant date | May 23, 2017 |
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A load sensor is constituted by a rib and a vertical transistor including an organic semiconductor film, and a load measurement can be executed based on a change of a gap between a drain electrode and a source electrode which is a channel length of the vertical transistor. Therefore, a change of a current Ids is in a linear relationship to a load applied to the load sensor.
Opening claim text (preview).
The invention claimed is: 1. A load sensor using a vertical transistor, comprising: a substrate including a surface that is an insulator; a rib arranged on the substrate, the rib including a surface including a side surface and a top surface, the surface that is an insulator, the rib being made of a material different from a material of the substrate and the rib having a Young's modulus smaller than that of the substrate; a transistor including a gate electrode that is arranged on the side surface of the rib, a gate insulating film, and a semiconductor film; a bottom electrode layer arranged on a bottom surface of a recession and being in contact with the semiconductor film, the recession that is a part of the substrate where the rib is arranged; and a top electrode layer arranged on a top surface of a protrusion and being in contact with the semiconductor film, the protrusion that is a part of the substrate where the rib is not arranged, wherein when a gate voltage is applied to the gate electrode, a channel area is generated in the semiconductor film, and a current flows between the bottom electrode layer and the top electrode layer, and when a load is applied to the protrusion, a length of the semiconductor film is changed in a direction parallel to a height of the rib according to a deformation of the rib, and the transistor executes a load measurement based on a change of the current. 2. The load sensor using the vertical transistor according to claim 1 , wherein the side surface of the rib where the gate electrode is arranged is perpendicular to a surface of the substrate, a surface of the rib that is different from the side surface of the rib is tapered, and the top electrode layer extends from the top surface of the rib to the surface of the rib and to a part of the substrate where the rib is not arranged. 3. A load sensor using a vertical transistor, comprising: a substrate including a surface that is an insulator; a rib arranged on the substrate, the rib including a surface including a side surface and a top surface, the surface that is an insulator, the rib being made of a material different from a material of the substrate, the top surface of the rib being a quadrangle or a triangle; a transistor including a gate electrode that is arranged on the side surface of the rib, a gate insulating film, and a semiconductor film; a bottom electrode layer arranged on a bottom surface of a recession and being in contact with the semiconductor film, the recession that is a part of the substrate where the rib is arranged; and a top electrode layer arranged on a top surface of a protrusion and being in contact with the semiconductor film, the protrusion that is a part of the substrate where the rib is not arranged, wherein when a gate voltage is applied to the gate electrode, a channel area is generated in the semiconductor film, and a current flows between the bottom electrode layer and the top electrode layer, and when a load is applied to the protrusion, a length of the semiconductor film is changed in a direction parallel to a height of the rib according to a deformation of the rib, and the transistor executes a load measurement based on a change of the current. 4. The load sensor using the vertical transistor according to claim 3 , wherein the side surface of the rib where the gate electrode is arranged is perpendicular to a surface of the substrate, a surface of the rib that is different from the side surface of the rib is tapered, and the top electrode layer extends from the top surface of the rib to the surface of the rib and to a part of the substrate where the rib is not arranged. 5. A load sensor using a vertical transistor, comprising: a substrate including a surface that is an insulator; a rib arranged on the substrate, the rib including a surface including a side surface and a top surface, the surface that is an insulator, the rib being made of a material that a change rate of the height of the rib is smaller than or equal to 7% in a case where a maximum load considered as the measurement subject is applied to the rib, the material of the rib being different from a material of the substrate; a transistor including a gate electrode that is arranged on the side surface of the rib, a gate insulating film, and a semiconductor film; a bottom electrode layer arranged on a bottom surface of a recession and being in contact with the semiconductor film, the recession that is a part of the substrate where the rib is arranged; and a top electrode layer arranged on a top surface of a protrusion and being in contact with the semiconductor film, the protrusion that is a part of the substrate where the rib is not arranged, wherein when a gate voltage is applied to the gate electrode, a channel area is generated in the semiconductor film, and a current flows between the bottom electrode layer and the top electrode layer, and when a load is applied to the protrusion, a length of the semiconductor film is changed in a direction parallel to a height of the rib according to a deformation of the rib, and the transistor executes a load measurement based on a change of the current. 6. The load sensor using the vertical transistor according to claim 5 , wherein the side surface of the rib where the gate electrode is arranged is perpendicular to a surface of the substrate, a surface of the rib that is different from the side surface of the rib is tapered, and the top electrode layer extends from the top surface of the rib to the surface of the rib and to a part of the substrate where the rib is not arranged.
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