Load sensor using vertical transistor

US9658121B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9658121-B2
Application numberUS-201414913067-A
CountryUS
Kind codeB2
Filing dateJul 30, 2014
Priority dateAug 22, 2013
Publication dateMay 23, 2017
Grant dateMay 23, 2017

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A load sensor is constituted by a rib and a vertical transistor including an organic semiconductor film, and a load measurement can be executed based on a change of a gap between a drain electrode and a source electrode which is a channel length of the vertical transistor. Therefore, a change of a current Ids is in a linear relationship to a load applied to the load sensor.

First claim

Opening claim text (preview).

The invention claimed is: 1. A load sensor using a vertical transistor, comprising: a substrate including a surface that is an insulator; a rib arranged on the substrate, the rib including a surface including a side surface and a top surface, the surface that is an insulator, the rib being made of a material different from a material of the substrate and the rib having a Young's modulus smaller than that of the substrate; a transistor including a gate electrode that is arranged on the side surface of the rib, a gate insulating film, and a semiconductor film; a bottom electrode layer arranged on a bottom surface of a recession and being in contact with the semiconductor film, the recession that is a part of the substrate where the rib is arranged; and a top electrode layer arranged on a top surface of a protrusion and being in contact with the semiconductor film, the protrusion that is a part of the substrate where the rib is not arranged, wherein when a gate voltage is applied to the gate electrode, a channel area is generated in the semiconductor film, and a current flows between the bottom electrode layer and the top electrode layer, and when a load is applied to the protrusion, a length of the semiconductor film is changed in a direction parallel to a height of the rib according to a deformation of the rib, and the transistor executes a load measurement based on a change of the current. 2. The load sensor using the vertical transistor according to claim 1 , wherein the side surface of the rib where the gate electrode is arranged is perpendicular to a surface of the substrate, a surface of the rib that is different from the side surface of the rib is tapered, and the top electrode layer extends from the top surface of the rib to the surface of the rib and to a part of the substrate where the rib is not arranged. 3. A load sensor using a vertical transistor, comprising: a substrate including a surface that is an insulator; a rib arranged on the substrate, the rib including a surface including a side surface and a top surface, the surface that is an insulator, the rib being made of a material different from a material of the substrate, the top surface of the rib being a quadrangle or a triangle; a transistor including a gate electrode that is arranged on the side surface of the rib, a gate insulating film, and a semiconductor film; a bottom electrode layer arranged on a bottom surface of a recession and being in contact with the semiconductor film, the recession that is a part of the substrate where the rib is arranged; and a top electrode layer arranged on a top surface of a protrusion and being in contact with the semiconductor film, the protrusion that is a part of the substrate where the rib is not arranged, wherein when a gate voltage is applied to the gate electrode, a channel area is generated in the semiconductor film, and a current flows between the bottom electrode layer and the top electrode layer, and when a load is applied to the protrusion, a length of the semiconductor film is changed in a direction parallel to a height of the rib according to a deformation of the rib, and the transistor executes a load measurement based on a change of the current. 4. The load sensor using the vertical transistor according to claim 3 , wherein the side surface of the rib where the gate electrode is arranged is perpendicular to a surface of the substrate, a surface of the rib that is different from the side surface of the rib is tapered, and the top electrode layer extends from the top surface of the rib to the surface of the rib and to a part of the substrate where the rib is not arranged. 5. A load sensor using a vertical transistor, comprising: a substrate including a surface that is an insulator; a rib arranged on the substrate, the rib including a surface including a side surface and a top surface, the surface that is an insulator, the rib being made of a material that a change rate of the height of the rib is smaller than or equal to 7% in a case where a maximum load considered as the measurement subject is applied to the rib, the material of the rib being different from a material of the substrate; a transistor including a gate electrode that is arranged on the side surface of the rib, a gate insulating film, and a semiconductor film; a bottom electrode layer arranged on a bottom surface of a recession and being in contact with the semiconductor film, the recession that is a part of the substrate where the rib is arranged; and a top electrode layer arranged on a top surface of a protrusion and being in contact with the semiconductor film, the protrusion that is a part of the substrate where the rib is not arranged, wherein when a gate voltage is applied to the gate electrode, a channel area is generated in the semiconductor film, and a current flows between the bottom electrode layer and the top electrode layer, and when a load is applied to the protrusion, a length of the semiconductor film is changed in a direction parallel to a height of the rib according to a deformation of the rib, and the transistor executes a load measurement based on a change of the current. 6. The load sensor using the vertical transistor according to claim 5 , wherein the side surface of the rib where the gate electrode is arranged is perpendicular to a surface of the substrate, a surface of the rib that is different from the side surface of the rib is tapered, and the top electrode layer extends from the top surface of the rib to the surface of the rib and to a part of the substrate where the rib is not arranged.

Assignees

Inventors

Classifications

  • Electricity · mapped topic

  • G01L1/2293Primary

    of the semi-conductor type · CPC title

  • G01L1/18Primary

    using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material · CPC title

  • being Group II-VI materials, e.g. ZnO · CPC title

  • Devices controlled by mechanical forces, e.g. pressure · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9658121B2 cover?
A load sensor is constituted by a rib and a vertical transistor including an organic semiconductor film, and a load measurement can be executed based on a change of a gap between a drain electrode and a source electrode which is a channel length of the vertical transistor. Therefore, a change of a current Ids is in a linear relationship to a load applied to the load sensor.
Who is the assignee on this patent?
Denso Corp
What technology area does this patent fall under?
Primary CPC classification G01L1/2293. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue May 23 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).