Organic semiconductor element, strain sensor, vibration sensor, and manufacturing method for organic semiconductor element
US-12068093-B2 · Aug 20, 2024 · US
US9500547B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9500547-B1 |
| Application number | US-201615229778-A |
| Country | US |
| Kind code | B1 |
| Filing date | Aug 5, 2016 |
| Priority date | Feb 25, 2014 |
| Publication date | Nov 22, 2016 |
| Grant date | Nov 22, 2016 |
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The present invention provides a shock recording device, comprising: a vibration energy harvester comprising a first electrode and a second electrode, the vibration energy harvester converting an energy of a shock applied thereto into a potential difference between the first electrode and the second electrode; and a ferroelectric transistor comprising a gate electrode, a source electrode, and a drain electrode, the ferroelectric transistor further comprising a stacked structure of a ferroelectric layer and a semiconductor layer. The gate electrode is electrically connected to the first electrode. The source electrode is electrically connected to the second electrode. This shock recording device does not need a power source used to record a shock.
Opening claim text (preview).
The invention claimed is: 1. A shock recording device, comprising: a vibration energy harvester comprising a first electrode and a second electrode, the vibration energy harvester converting an energy of a shock applied thereto into a potential difference between the first electrode and the second electrode; and a ferroelectric transistor comprising a gate electrode, a source electrode, and a drain electrode, the ferroelectric transistor further comprising a stacked structure of a ferroelectric layer and a semiconductor layer, wherein the gate electrode is electrically connected to the first electrode; the source electrode is electrically connected to the second electrode; and the shock recording device comprises a zener diode electrically connected to the source electrode and the drain electrode. 2. The shock recording device according to claim 1 , wherein the zener diode comprises an anode terminal and a cathode terminal; the anode terminal is electrically connected to the source electrode; and the cathode terminal is electrically connected to the gate electrode. 3. The shock recording device according to claim 1 , wherein the zener diode comprises an anode terminal and a cathode terminal; the cathode terminal is electrically connected to the source electrode; and the anode terminal is electrically connected to the gate electrode. 4. The shock recording device according to claim 1 , further comprising: a reset voltage generation circuit comprising a DC power source and a switch element, both of which are electrically connected in series, wherein one end of the DC power source is electrically connected to the drain electrode; and one end of the switch element is electrically connected to the gate electrode. 5. The shock recording device according to claim 1 , further comprising: a resistance, wherein one end of the resistance is electrically connected to the gate electrode; and the other end of the resistance is electrically connected to the zener diode and the vibration energy harvester. 6. The shock recording device according to claim 5 , wherein the ferroelectric transistor has a gate capacitance C G ; the resistance has a resistance value R; and the following mathematical formula (I) is satisfied: 0.7 milliseconds≦time constant T (second)≦7.0 milliseconds (I) where the time constant T (second) is equal to the product of (the resistance value R)·(the gate capacitance C G ).
of the semi-conductor type · CPC title
using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material · CPC title
measuring forces due to impact (G01L5/0061, G01L5/14 take precedence; impact testing of structures G01M7/08; impact testing of material G01N3/00) · CPC title
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