Inorganic adhesive composition and hermetic sealing method using same

Patent metadata

Field	Value
Publication number	US-9656908-B2
Application number	US-201314407254-A
Country	US
Kind code	B2
Filing date	Jun 12, 2013
Priority date	Jun 12, 2012
Publication date	May 23, 2017
Grant date	May 23, 2017

Abstract

The present invention relates to an inorganic adhesive composition and to a hermetic sealing method, and more specifically relates to an inorganic adhesive composition with which an organic solvent is not used and to a hermetic sealing method using same. To this end, the present invention provides an inorganic adhesive composition comprising: between 20 and 80 parts by weight of a water glass diluted solution containing between 60 and 90 parts by weight of water glass (Na2SiO2); between 20 and 80 parts by weight of a refractory inorganic filler; and a black pigment.

First claim

The invention claimed is:

1. A hermetically sealed composition comprising:
a first substrate having an outer edge;
a second substrate having an outer edge;
an inorganic adhesive composition comprising:
20-80 weight parts of diluted solution of water glass, the diluted solution of water glass having 60-90 weight percents of water glass (Na 2 SiO 2 );
20-80 weight parts of fire resistant inorganic filler; and
1-5 weight parts of black pigment for enhancing absorption of a laser,
wherein the black pigment comprises one selected from the group consisting of CuO+Cr 2 O 3 , CuO+Fe 2 O 3 +CoO and CuO+Cr 2 O 3 +Fe 2 O 3 +CoO;
wherein the inorganic adhesive composition is applied for application between the outer edges of the first and second substrates and is configured to respond to laser power applied to the inorganic adhesive composition between the first and second substrates to form a seal between the first and second substrates.

2. The hermetically sealed composition of claim 1 , wherein a thermal expansion coefficient of the inorganic adhesive composition is 32*10 −7 /° C.-40*10 −7 /° C.

3. The hermetically sealed composition of claim 1 , wherein the fire resistant inorganic filler comprises at least one selected from the group consisting of: Alumina(Al 2 O 3 ), Zircon, Cordierite, Silica(SiO 2 ), Eucryptite and Spodumen.

4. The hermetically sealed composition of claim 1 , wherein the fire resistant inorganic filler has an average particle diameter of 0.1-30 μm.

5. The hermetically sealed composition of claim 1 , wherein the diluted solution of water glass comprises the water glass and water.

6. The hermetically sealed composition of claim 1 , wherein the first substrate and the second substrate are organic light-emitting diodes.

Assignees

• Corning Prec Materials Co Ltd

Inventors

• Lee Kiyeon
• Kim Jhee-Mann
• Cha Jaemin
• Lee Jaeho

Classifications

• H10K71/40

  Thermal treatment, e.g. annealing in the presence of a solvent vapour · CPC title

• H10K50/844

  Encapsulations · CPC title

• H10K50/8426

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• C03C2204/00

  Glasses, glazes or enamels with special properties · CPC title

• C03C2207/02

  containing ingredients for securing a good bond between the vitrified enamel and the metal · CPC title