Plate-type heat exchanger and a method for manufacturing same

US12044487B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12044487-B2
Application numberUS-201916979768-A
CountryUS
Kind codeB2
Filing dateMar 27, 2019
Priority dateMar 27, 2018
Publication dateJul 23, 2024
Grant dateJul 23, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A plate-type heat exchanger and a method for manufacturing same are provided. A plate-type heat exchanger includes a first plate and a second plate which have flange parts vertically adhered by an adhesive, respectively. The flange parts are formed in a stepped shape and may thus increase an area adhered to the first plate and the second plate.

First claim

Opening claim text (preview).

The invention claimed is: 1. A plate type heat exchanger, comprising: first and second plates stacked on each other in a vertical direction to form a space portion to allow a fluid to flow; and an adhesive layer interposed between the first and second plates and formed by an adhesive agent, wherein the first plate and the second plate each includes: a plate body having a port opening to allow the fluid to flow in or flow out; and a flange portion configured to define an edge portion of the plate body and having a shape bent at least two times, wherein the plate body includes a plurality of uneven portions in which a plurality of protrusion portions and a plurality recessed portions are alternately arranged, wherein the adhesive layer includes: first and third adhesive portions interposed between the flange portion of the first and second plates configured to extend in a horizontal direction; and a second adhesive portion configured to extend in the vertical direction toward the third adhesive portion from the first adhesive portion, wherein the adhesive agent is provided on an entire surface of the first plate including an entire surface of the plurality protrusion portions of the first plate and an entire surface of the plurality recessed portions of the first plate, wherein the plurality protrusion portions of the first plate and the plurality recessed portions of the second plate are adhered by the adhesive agent to form a flow passage, wherein the flange portion is bent from the plate body fourth times and extends therefrom, wherein the flange portion includes: a first wall bent from the plate body and extending in the vertical direction; a second wall bent from the first wall; a third wall bent from the second wall, and configured to extend parallel to the direction in which the first wall extends; and a fourth wall bent from the third wall, configured to extend parallel to a direction in which the second wall extends, and configured to be supported by the second wall of the other of the first plate or the second plate, and wherein the direction in which the second and fourth wall extend is toward the outside of the plate body. 2. The plate type heat exchange of claim 1 , wherein the first adhesive portion is formed between the first wall of the first plate and the second wall of the second plate. 3. The plate type heat exchange of claim 2 , wherein the second adhesive portion is formed between the first wall of the first plate and the third wall of the second plate. 4. The plate type heat exchange of claim 2 , wherein the third adhesive portion is formed between the third wall of the first plate and the fourth wall of the second plate. 5. The plate type heat exchange of claim 1 , wherein, with respect to a flowing depth indicating a distance between the plate body of the first plate and the plate body of the second plate, a sum of adhesive lengths of the first, second, and third adhesive portions is greater than the flowing depth. 6. The plate type heat exchange of claim 5 , wherein a bending angle between the plate body and the first wall is 90° or more and 96° or less. 7. The plate type heat exchange of claim 5 , wherein a thickness of a plate body is formed in a range of 0.3 mm to 1.0 mm, and the flowing depth is in a range of 1.0 mm to 2.0 mm. 8. The plate type heat exchange of claim 1 , wherein the adhesive agent includes glass frit including P 2 O 5 and TiO 2 and a Group I-based oxide. 9. The plate type heat exchange of claim 8 , wherein the P 2 O 5 is contained in 20% to 30% by weight based on the whole glass frit, wherein the TiO 2 is contained in 10% to 20% by weight based on the whole glass frit, and wherein the Group I-based oxide is contained in 15% to 30% by weight based on the whole glass frit. 10. The plate type heat exchange of claim 9 , wherein the Group I-based oxide includes at least one of Na 2 O, K 2 O, and Li 2 O. 11. The plate type heat exchange of claim 9 , wherein the glass frit further includes SiO 2 , and wherein the SiO 2 is contained in 10% to 20% by weight based on the whole glass frit. 12. The plate type heat exchange of claim 9 , wherein the glass frit further includes B 2 O 3 , and wherein the B 2 O 3 is contained in 5% to 15% by weight based on the whole glass frit. 13. The plate type heat exchange of claim 9 , wherein the glass frit further includes Al 2 O 3 , and wherein the Al 2 O 3 , is contained in 10% to 30% by weight based on the whole glass frit. 14. The plate type heat exchange of claim 9 , wherein the glass frit further includes a fluorine (F) compound, wherein the fluorine compound includes at least one metal oxide of NaF and AlF 3 , and wherein the fluorine compound is contained in 0.1% to 5% by weight based on the whole glass frit. 15. The plate type heat exchange of claim 9 , wherein the glass frit further includes ZrO 2 , and wherein the ZrO 2 is contained in 1% to 5% by weight based on the whole glass frit. 16. The plate type heat exchange of claim 9 , wherein the glass frit further includes a Group II-oxide, wherein the Group II-oxide includes at least one metal oxide of CaO, MgO, and BaO, and wherein the Group II-based oxide is contained in 0.1% to 10% by weight based on the whole glass frit. 17. The plate type heat exchanger of claim 1 , wherein the second and fourth wall extend in the horizontal direction. 18. The plate type heat exchange of claim 1 , further including a third plate stacked in a vertical direction with the first and second plates to form a space portion to allow a fluid to flow, wherein the third plate includes: the plate body having the port opening to allow the fluid to flow in or flow out; and the plurality of protrusion portions and the plurality of recessed portions formed at the plate body and alternately arranged, wherein the plurality of recessed portions of the second plate is in contact with the plurality of protrusion portions of the third plate to form a plurality of the space portion between the second and third plates.

Assignees

Inventors

Classifications

  • F28D9/005Primary

    the plates having openings therein for both heat-exchange media · CPC title

  • the deformations being linear, e.g. corrugations · CPC title

  • Adhesives based on inorganic constituents · CPC title

  • involving heating of the applied adhesive · CPC title

  • Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives · CPC title

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What does patent US12044487B2 cover?
A plate-type heat exchanger and a method for manufacturing same are provided. A plate-type heat exchanger includes a first plate and a second plate which have flange parts vertically adhered by an adhesive, respectively. The flange parts are formed in a stepped shape and may thus increase an area adhered to the first plate and the second plate.
Who is the assignee on this patent?
Lg Electronics Inc
What technology area does this patent fall under?
Primary CPC classification F28D9/005. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Jul 23 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).