Method of extracting properties of a layer on a wafer
US-2024234216-A9 · Jul 11, 2024 · US
US9651498B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9651498-B2 |
| Application number | US-201314412479-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 2, 2013 |
| Priority date | Jul 2, 2012 |
| Publication date | May 16, 2017 |
| Grant date | May 16, 2017 |
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A method and system are presented for use in inspection of via containing structures. According to this technique, measured data indicative of a spectral response of a via-containing region of a structure under measurements is processed, and, upon identifying a change in at least one parameter of the spectral response with respect to a spectral signature of the via-containing region, output data is generated indicative of a possible defect at an inner surface of the via.
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The invention claimed is: 1. A computer-implemented method for use in inspection of via containing structures, the method comprising: illuminating a via-containing region of a structure under measurement with a broadband light beam, detecting specularly reflected light, and generating measured data indicative of the detected specularly reflected light; receiving input data comprising data indicative of said measured data from the via-containing region; processing and analyzing the measured data to determine whether a possible defect exists at an inner surface of a via in said via-containing region, said processing and analyzing comprising: translating the measured data into data corresponding to a spectral response of the via-containing region, transforming the spectral response data into a function describing a frequency of oscillations of measured intensity in said spectral response, and, comparing said function with a spectral signature of a non-defective via-containing region, and upon identifying a disturbance in the frequency of oscillations of the measured intensity of said spectral response with respect to the spectral signature of the non-defective via-containing region, generating output data indicative of a possible defect at the inner surface of the via in said via-containing region under measurement. 2. The method of claim 1 , wherein said illuminating comprises focusing said broadband light beam with normal incidence onto the via-containing region. 3. The method of claim 1 , wherein said illuminating comprises focusing said broadband light beam onto the via-containing region with a numerical aperture substantially not exceeding 0.1. 4. The method of claim 1 , wherein said detecting of the specularly reflected light comprises receiving said specularly reflected light by a spectrometer. 5. The method of claim 1 , wherein said analyzing of the spectral response data comprises applying a Fourier transform to the spectral response data and analyzing Fourier transform data to identify the disturbance in frequency oscillations. 6. The method of claim 5 , wherein said analyzing of the Fourier transform data comprises determining existence of one or more peaks. 7. The method of claim 1 , wherein said illuminating and detecting comprise affecting polarization of at least one of the illuminating and specularly-reflected light beams. 8. The method of claim 1 , wherein said output data is indicative of a possible defect at a bottom region of the via. 9. A system for use in inspection of via containing structures, the system comprising: a measurement unit configured and operable to illuminate a structure under inspection with broadband light beam, detect specularly reflected light from a via-containing region in the structure, and generate measured data indicative of the detected specularly reflected light; and a control system configured as a computer system being in data communication with said measurement unit, the control unit comprising: a data input utility configured to receive the measured data obtained from the via-containing region in the measured structure; and a processing and analyzing utility configured to process and analyze the measured data to determine whether a possible defect exists at an inner surface of a via in said via-containing region, by carrying out the following: translating the measured data into data corresponding to a spectral response of the via-containing region, transforming said spectral response data into a function describing a frequency of oscillations of measured intensity in the spectral response data, comparing said function with a spectral signature of a non-defective via-containing region, and, upon identifying a disturbance in the frequency of oscillations of the measured intensity of the spectral response with respect to the spectral signature of the non-defective via-containing region, generating output data indicative of a possible defect at the inner surface of the via in said via-containing region. 10. The system of claim 9 , wherein the measurement unit comprises a broadband light source, a light directing assembly, and a detection unit comprising a spectrometer. 11. The system of claim 10 , wherein the detection unit further comprises an imaging detector. 12. The system of claim 9 , wherein the measurement unit is configured to operate with a normal incidence mode. 13. The system of claim 9 , wherein the measurement unit is configured for illuminating the structure with numerical aperture substantially not exceeding 0.1. 14. The system of claim 9 , wherein the measurement unit is configured for performing at least one of bright-field and dark-field inspection modes. 15. The system of claim 9 , wherein the measurement unit is configured for performing gray-field inspection mode. 16. The system of claim 9 , wherein the measurement unit comprises an illumination channel and a detection channel, and at least one polarizer located in at least one of the illumination and detection channels. 17. The system of claim 9 , wherein said processing and analyzing utility is configured and operable to perform said analyzing by for applying Fourier transform to the spectral response data and analyzing Fourier transform data to identify the disturbance in frequency oscillations. 18. The system of claim 17 , wherein said processing and analyzing utility is configured and operable for analyzing the Fourier transform data by determining existence of one or more peaks in the spectral response.
Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title
Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20) · CPC title
Circuits of general importance; Signal processing · CPC title
Specular reflectivity · CPC title
Separate detection of dark field and bright field · CPC title
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