Integrated circuit with backside structures to reduce substrate warp
US-10833026-B2 · Nov 10, 2020 · US
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Patent family 52110220
This patent family groups 7 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 52110220 |
| Family type | — |
| Earliest priority | Jun 25, 2013 |
| First filing country | US |
| Member publications | 7 |
| Countries | US |
| Representative publication | US10833026B2 — Integrated circuit with backside structures to reduce substrate warp |
Representative publication
Best representative member for this family based on priority and filing country.
US10833026B2 — Integrated circuit with backside structures to reduce substrate warp (published Nov 10, 2020)
Member publications
Related publications in this family.
Integrated circuit with backside structures to reduce substrate warp
US-2019244914-A1 · Aug 8, 2019 · US
Integrated circuit with backside structures to reduce substrate warp
US-10276513-B2 · Apr 30, 2019 · US
Integrated circuit with backside structures to reduce substrate warp
US-2017243836-A1 · Aug 24, 2017 · US
Integrated circuit with backside structures to reduce substrate warp
US-9646938-B2 · May 9, 2017 · US
Integrated circuit with backside structures to reduce substrate warp
US-2016035682-A1 · Feb 4, 2016 · US
Integrated circuit with backside structures to reduce substrate warp
US-9184041-B2 · Nov 10, 2015 · US