Welding and soldering of transistor leads

Patent metadata

Field	Value
Publication number	US-9642276-B2
Application number	US-201414557381-A
Country	US
Kind code	B2
Filing date	Dec 1, 2014
Priority date	Dec 1, 2014
Publication date	May 2, 2017
Grant date	May 2, 2017

Abstract

In a method of manufacturing an electronic device a transistor having respective input, output and control leads extending parallel to each other is positioned; first and second busbar layers are placed relative to the transistor so that a first tab extending from the first opening aligns with and contacts one of the input and output leads, and so that a second tab extending from the second opening aligns with and contacts another one of the input and output leads; the first tab and one of the input and output leads are welded; a circuit board is placed parallel to the busbar layers so that the control lead and the first and second tabs extend through corresponding openings in the circuit board; and the control lead and the at least one of the first and second tabs are soldered to one or more circuits on the circuit board.

First claim

What is claimed is:

1. A method of manufacturing an electronic device, the method comprising:
positioning a transistor having respective input, output and control leads extending parallel to each other, the control lead longer than the input and output leads;
placing at least first and second busbar layers relative to the transistor so that each of the input, output and control leads extend through a first opening in the first busbar layer and through a second opening in the second busbar layer, the first and second busbar layers placed so that a first tab extending from the first opening aligns with and contacts one of the input and output leads, and so that a second tab extending from the second opening aligns with and contacts another one of the input and output leads;
welding the first tab and the one of the input and output leads to each other, and the second tab and the other one of the input and output leads to each other;
placing a circuit board parallel to the first and second busbar layers so that the control lead and at least one of the first and second tabs extend through corresponding openings in the circuit board; and
soldering the control lead and the at least one of the first and second tabs to one or more circuits on the circuit board.

2. The method of claim 1 , wherein placing the first and second busbar layers relative to the transistor comprises positioning the first busbar layer relative to the transistor, placing an insulation layer on the positioned first busbar layer, and placing the second busbar layer on the placed insulation layer.

3. The method of claim 1 , wherein the electric device comprises multiple transistors having respective input, output and control leads extending parallel to each other, wherein the first and second busbar layers are placed in a corresponding way relative to all of the transistors.

4. The method of claim 3 , wherein the first and second busbar layers are initially assembled into a laminate busbar structure where they are separated by insulation, and wherein the laminate busbar structure is placed relative to the transistor before welding the first and second tabs.

5. The method of claim 1 , wherein the input, output and control leads are initially of equal length, the method further comprising shortening the input and output leads.

6. An electronic device comprising:
a transistor having respective input, output and control leads extending parallel to each other, the control lead longer than the input and output leads;
at least first and second busbar layers placed relative to the transistor so that each of the input, output and control leads extend through a first opening in the first busbar layer and through a second opening in the second busbar layer, the first and second busbar layers placed so that a first tab extending from the first opening aligns with and contacts one of the input and output leads, and so that a second tab extending from the second opening aligns with and contacts another one of the input and output leads;
a circuit board placed parallel to the first and second busbar layers so that the control lead and at least one of the first and second tabs extend through corresponding openings in the circuit board;
wherein the first tab and the one of the input and output leads are connected to each other by a first weld joint, and the second tab and the other one of the input and output leads are connected to each other by a second weld joint; and
wherein the control lead and the at least one of the first and second tabs are connected to one or more circuits on the circuit board by solder joints.

7. The electronic device of claim 6 , further comprising an insulation layer separating the first busbar layer from the second busbar layer.

8. The electronic device of claim 6 , wherein the transistor is essentially perpendicular to each of the first and second busbar layers and the circuit board.

9. An electronic device comprising:
a transistor having respective input, output and control leads extending parallel to each other, the control lead longer than the input and output leads;
at least first and second busbar layers placed relative to the transistor so that each of the input, output and control leads extend through a first opening in the first busbar layer and through a second opening in the second busbar layer, the first busbar layer having first means for forming a first weld joint between one of the input and output leads and the first busbar layer, the second busbar layer having second means for forming a second weld joint between another one of the input and output leads and the second busbar layer; and
a circuit board placed parallel to the first and second busbar layers so that the control lead and at least one of the first and second means extend through corresponding openings in the circuit board, wherein the control lead and the at least one of the first and second means are connected to one or more circuits on the circuit board by solder joints.

10. The electronic device of claim 9 , wherein the first means comprises a first tab extending from the first opening.

11. The electronic device of claim 10 , wherein the first tab extends from a periphery of the first opening and is essentially parallel with the one of the input and output leads.

12. The electronic device of claim 10 , wherein the second means comprises a second tab extending from the second opening.

13. The electronic device of claim 12 , wherein the second tab extends from a periphery of the second opening and is essentially parallel with the other one of the input and output leads.

14. The electronic device of claim 9 , wherein both of the first and second means extend through the corresponding openings in the circuit board and are connected to one or more circuits on the circuit board by solder joints.

Assignees

• Tesla Motors Inc
• Tesla Inc

Inventors

• Ramm Robert James
• Sasaridis Dino
• Campbell Colin
• Liu Wenjun

Classifications

• H05K7/06 Primary

  on insulating boards {, e.g. wiring harnesses (for printed circuits H05K1/18, H05K3/30)} · CPC title

• H05K3/3447

  Lead-in-hole components · CPC title

• B23K37/00 Primary

  Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass · CPC title

• H05K7/1432

  specially adapted for power drive units or power converters · CPC title

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title