Integrated circuit and method that utilize a shape memory material

Patent metadata

Field	Value
Publication number	US-9635764-B2
Application number	US-201514866648-A
Country	US
Kind code	B2
Filing date	Sep 25, 2015
Priority date	Sep 25, 2015
Publication date	Apr 25, 2017
Grant date	Apr 25, 2017

Abstract

An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.

First claim

The invention claimed is:

1. An integrated circuit, comprising:
a substrate that includes a shape memory material, wherein the shape memory material is in a first deformed state and has a first crystallography structure and a first configuration, wherein the shape memory material is able to be physically deformed from a first configuration to a second configuration, wherein the shape memory material changes to a second crystallography structure and physically deforms back to the first configuration upon being supplied with energy, wherein the shape memory material returns to the first crystallography structure upon application of a different amount of energy; and
a plurality electronic components attached to the substrate, wherein applying energy to the shape memory material such that the shape memory material changes from the second configuration to the first configuration includes electrically connecting a first electronic component to a second electronic component.

2. The integrated circuit of claim 1 , wherein the shape memory material changes to a second crystallography structure and physically deforms back to the first configuration upon being supplied with at least one of electrical, thermal, magnetic, mechanical or ultra-violet energy.

3. The integrated circuit of claim 1 , wherein the shape memory material is embedded in the substrate.

4. The integrated circuit of claim 1 , wherein the shape memory material returns to the first crystallography structure upon removal of the energy.

5. The integrated circuit of claim 1 , further comprising at least one of a textile, chassis, and printed circuit board attached to the substrate.

6. An integrated circuit, comprising:
a substrate that includes a shape memory material, wherein the shape memory material is in a first physically deformed state and has a first polymeric conformation and a first configuration, wherein the shape memory material is able to change from a first polymeric conformation to a second polymeric conformation and be physically deformed from a first configuration to a second configuration, wherein the shape memory material changes returns to the first polymeric conformation and physically deforms back to the first configuration upon being supplied with energy, wherein the shape memory material is embedded in the substrate; and
an electronic component attached to substrate.

7. The integrated circuit of claim 6 , wherein the shape memory material changes to the first polymeric conformation and physically deforms back to the first configuration upon being supplied with at least one of electrical, thermal, magnetic or ultra-violet energy.

8. The integrated circuit of claim 6 , wherein the shape memory material maintains the first polymeric conformation upon removal of the energy.

9. The integrated circuit of claim 6 , further comprising a plurality electronic components attached to the substrate, wherein at least two of the plurality electronic components are electrically connected when the substrate is in at least one of the first configuration or the second configuration.

10. The integrated circuit of claim 9 , wherein one of the plurality electronic components is at least one of an electronic package, a display, an antenna, a power source or a display.

11. The integrated circuit of claim 6 , further comprising at least one of a textile, chassis, and printed circuit board attached to the substrate.

12. A method of using an integrated circuit, comprising:
attaching a shape memory material to a substrate;
physically deforming the shape memory material from a first configuration to a second configuration;
applying energy to the shape memory material such that the shape memory material changes from the second configuration to the first configuration; and
attaching a plurality electronic components to the substrate, wherein physically deforming the shape memory material from a first configuration to a second configuration includes electrically connecting a first electronic component to a second electronic component.

13. A method of using an integrated circuit, comprising:
attaching a shape memory material to a substrate;
physically deforming the shape memory material from a first configuration to a second configuration;
applying energy to the shape memory material such that the shape memory material changes from the second configuration to the first configuration; and
attaching a plurality electronic components to the substrate, wherein applying energy to the shape memory material such that the shape memory material changes from the second configuration to the first configuration includes electrically connecting a first electronic component to a second electronic component.

14. The method of claim 12 , further comprising attaching the substrate to at least one of a textile, chassis, and printed circuit board.

15. The method of claim 12 , wherein applying energy to the shape memory material such that the shape memory material changes from the second configuration to the first configuration includes applying at least one of electrical, thermal, magnetic or ultra-violet energy to the shape memory material.

16. The method of claim 12 , wherein one of the plurality electronic components is at least one of an electronic package, a display, an antenna, a power source or a display.

17. The method of claim 13 , wherein applying energy to the shape memory material such that the shape memory material changes from the second configuration to the first configuration includes applying at least one of electrical, thermal, magnetic or ultra-violet energy to the shape memory material.

18. The method of claim 13 , wherein one of the plurality electronic components is at least one of an electronic package, a display, an antenna, a power source or a display.

19. The method of claim 13 , further comprising attaching at least one of a textile, chassis, and printed circuit board attached to the substrate.

Assignees

• Intel Corp

Inventors

• Qiu Shipeng
• Liff Shawna
• Helms Kayleen L
• Heppner Joshua D
• Elsherbini Adel
• Swan Johanna
• Barnes Gary M

Classifications

• H05K2201/0133

  Elastomeric or compliant polymer · CPC title

• H05K1/028

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H05K3/0014 Primary

  Shaping of the substrate, e.g. by moulding · CPC title

• H05K3/361

  Assembling flexible printed circuits with other printed circuits · CPC title

• H05K3/303

  with surface mounted components (H05K3/32 takes precedence) · CPC title