Method for fabricating flexible display using a shape memory alloy film

Patent metadata

Field	Value
Publication number	US-9331126-B2
Application number	US-201414280578-A
Country	US
Kind code	B2
Filing date	May 17, 2014
Priority date	Dec 12, 2013
Publication date	May 3, 2016
Grant date	May 3, 2016

Abstract

Provided is a method for fabricating a flexible display device. The method includes attaching a shape memory alloy film memorizing a shape thereof as a curved shape at a shape memory temperature or lower to a flexible substrate at a temperature higher than the shape memory temperature, forming a display device on the flexible substrate, and returning the shape memory alloy to the curved shape to remove the shape memory alloy film from the flexible substrate.

First claim

What is claimed is:

1. A method for fabricating a flexible display, the method comprising:
attaching a shape memory alloy film memorizing a shape thereof as a curved shape at a shape memory temperature or lower to a flexible substrate at a temperature higher than the shape memory temperature, wherein the shape memory alloy film serves as a carrier substrate;
forming a display device on the flexible substrate; and
returning the shape memory alloy film to the curved shape to remove the shape memory alloy film from the flexible substrate.

2. The method of claim 1 , wherein the shape memory alloy film comprises a Ti—Ni alloy, a Ti—Ni—Fe alloy, a Cu—Al—Ni alloy, an Ag—Cd alloy, and any combinations thereof.

3. The method of claim 1 , wherein the shape memory temperature has a range from about −50° C. to about 0° C.

4. The method of claim 1 , wherein the attaching of the shape memory alloy film to the flexible memory comprises fixing the shape memory alloy film aligned on the flexible substrate to the flexible substrate by pressing the shape memory alloy film with a roller.

5. The method of claim 1 , wherein the forming of the display device comprises forming a thin film transistor array and a pixel array electrically connected to the thin film transistor array on the flexible substrate supported by the shape memory alloy film.

6. The method of claim 5 , wherein the thin film transistor array comprises a gate electrode, a gate insulting film, a source/drain electrode, and an oxide semiconductor thin film, and
the pixel array comprises a pixel electrode, an organic light emitting diode film, and an upper electrode.

7. The method of claim 5 , wherein the thin film transistor is a bottom gate thin film transistor, which comprises a gate buried in a gate insulating film disposed on the flexible substrate, an oxide semiconductor film buried in the gate insulating film and disposed on the gate, and a source/drain electrode disposed on the gate insulting film.

8. The method of claim 1 , wherein the removing of the shape memory film comprises cooling the shape memory alloy film to the shape memory temperature.

9. The method of claim 1 , further comprising forming an encapsulation member on the display device after forming the display device on the flexible substrate.

10. The method of claim 9 , wherein the encapsulation member comprises a glass substrate or a metal cap.

11. The method of claim 9 , wherein the forming of the encapsulation member comprises:
applying a sealant to an edge portion of the flexible substrate, and
curing the sealant to attach the flexible substrate and the encapsulation member to each other.

12. The method of claim 1 , wherein the flexible substrate is a plastic substrate.

13. A method for fabricating a flexible display, the method comprising:
memorizing a curved shape in a shape memory alloy film at a shape memory temperature or lower;
flattening the shape memory alloy film at a temperature higher than the shape memory temperature;
attaching the shape memory alloy film to a plastic substrate, wherein the shape memory alloy film serves as a carrier substrate for the plastic substrate; and
returning the shape memory alloy film to the memorized curved shape by cooling the shape memory alloy film to a temperature not higher than the shape memory temperature to remove the shape memory alloy film from the plastic substrate.

14. The method of claim 13 , further comprising forming a polymer film in the plastic substrate such that upper portions of the polymer film are exposed spaced a predetermined distance.

15. The method of claim 13 , wherein the memorizing of the curved shape in the shape memory alloy film comprises:
fixing the shape memory alloy film in the curved shape in a space between an inner cylinder with a small diameter and an outer cylinder with a large diameter surrounding the inner cylinder; and
memorizing the curved shape by maintaining the shape memory alloy film fixed in the curved shape in the space between the inner cylinder and the outer cylinder at the shape memory temperature or lower.

16. The method of claim 13 , wherein the forming of the display device on the plastic substrate comprises:
forming a thin film transistor array on the plastic substrate, and
forming a pixel array electrically connected to the thin film transistor array on the plastic substrate.

17. The method of claim 13 , wherein the plastic substrate comprises an organic film.

18. The method of claim 17 , wherein the organic film comprises a polydimethylsiloxane.

19. The method of claim 13 , wherein the polymer film comprises a polyimide.

Assignees

• Korea Electronics Telecomm

Inventors

• Lee Sang Seok
• Cho Kyoung Ik
• Na Bock Soon
• Lim Sang Chul
• Park Chan Woo
• Jung Soon-Won
• Koo Jae Bon
• Chu Hye Yong

Classifications

• H10K59/12

  Active-matrix OLED [AMOLED] displays · CPC title

• H10K71/80 Primary

  using temporary substrates · CPC title

• H01L51/003

  Electricity · mapped topic

• H01L51/0097

  Electricity · mapped topic

• H01L51/0094

  Electricity · mapped topic