Opto-electric hybrid board and method of manufacturing same

Patent metadata

Field	Value
Publication number	US-9632263-B2
Application number	US-201415029016-A
Country	US
Kind code	B2
Filing date	Sep 11, 2014
Priority date	Oct 31, 2013
Publication date	Apr 25, 2017
Grant date	Apr 25, 2017

Abstract

In an opto-electric hybrid board according to the present invention, an electrical interconnect line and an optical element are provided on a first surface of a substrate, and an optical waveguide optically coupled to the optical element is provided on a second surface of the substrate. A reinforcement layer for reinforcing the substrate is integrally mounted on the first surface of the substrate on which the electrical interconnect line and the optical element are provided, with an adhesive layer therebetween. A connector pad part for externally electrically connecting the electrical interconnect line is provided on the second surface of the substrate on which the optical waveguide is provided. With this configuration, the reinforcement layer is mounted on the substrate with high strength without adverse effects exerted on the optical element and the optical waveguide.

First claim

The invention claimed is:

1. An opto-electric hybrid board comprising:
a substrate;
an electrical interconnect line provided on a first surface of the substrate;
an optical element provided on the first surface of the substrate and electrically connected to the electrical interconnect line;
a reinforcement layer for reinforcing the substrate, the reinforcement layer being integrally mounted on the first surface of the substrate, with an adhesive layer therebetween;
an optical waveguide provided on a second surface of the substrate and optically coupled to the optical element, the second surface being a surface opposite to the first surface; and
a connector pad part for externally electrically connecting the electrical interconnect line, the connector pad part being provided on the second surface of the substrate.

2. The opto-electric hybrid board according to claim 1 , wherein the reinforcement layer includes a part integrally mounted on the substrate surface, with the adhesive layer therebetween, and a cover part extending toward the optical element and covering an upper surface of the optical element.

3. The opto-electric hybrid board according to claim 1 , wherein the optical element is mounted on a predetermined part of the electrical interconnect line by ultrasonic flip chip bonding.

4. A method of manufacturing an opto-electric hybrid board according to claim 1 , the method comprising the steps of:
preparing a substrate;
forming an electrical interconnect line on a first surface of the substrate;
forming a connector pad part for externally electrically connecting the electrical interconnect line on a second surface of the substrate, the second surface being a surface opposite to the first surface;
forming an optical waveguide on the second surface of the substrate;
mounting a reinforcement layer for reinforcing the substrate under pressure with an adhesive layer therebetween on the first surface of the substrate, which is provided with the electrical interconnect line, the connector pad part and the optical waveguide; and
mounting an optical element on the electrical interconnect line of the substrate, which is provided with the reinforcement layer.

5. A method of manufacturing an opto-electric hybrid board according to claim 1 , the method comprising the steps of:
preparing a substrate;
forming an electrical interconnect line on a first surface of the substrate;
forming a connector pad part for externally electrically connecting the electrical interconnect line on a second surface of the substrate, the second surface being a surface opposite to the first surface;
forming an optical waveguide on the second surface of the substrate;
mounting an optical element on the electrical interconnect line of the substrate; and
mounting a reinforcement layer for reinforcing the substrate under pressure with an adhesive layer therebetween on the first surface of the substrate, which is provided with the electrical interconnect line, the connector pad part, the optical waveguide, and the optical element.

6. The method of manufacturing an opto-electric hybrid board according to claim 4 , wherein the optical element is mounted on a predetermined part of the electrical interconnect line by ultrasonic flip chip bonding in the step of mounting the optical element on the electrical interconnect line of the substrate.

7. The method of manufacturing an opto-electric hybrid board according to claim 5 , wherein the optical element is mounted on a predetermined part of the electrical interconnect line by ultrasonic flip chip bonding in the step of mounting the optical element on the electrical interconnect line of the substrate.

Assignees

• Nitto Denko Corp

Inventors

• Shibata Naoki
• Tsujita Yuichi

Classifications

• H05K2201/0154

  Polyimide · CPC title

• H05K2201/2054

  Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics · CPC title

• H05K1/0274

  Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42) · CPC title

• G02B6/42 Primary

  Coupling light guides with opto-electronic elements · CPC title

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title