Thin film ferrite lamination

Patent metadata

Field	Value
Publication number	US-9627117-B2
Application number	US-201214354409-A
Country	US
Kind code	B2
Filing date	Oct 26, 2012
Priority date	Oct 27, 2011
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

Forming a ferrite thin film laminate includes heating a layered assembly to form a laminate. The layered assembly includes a first coated substrate having a first ferrite layer opposite a first thermoplastic surface and a second coated substrate having a second ferrite layer opposite a second thermoplastic surface to form a laminate. Each coated substrate is formed by forming a ferrite layer on a surface of a thermoplastic substrate. The coated substrates are arranged such that the first ferrite layer contacts the second thermoplastic surface. Heating the layered assembly includes bonding the first coated substrate to the second coated substrate such that the first ferrite layer is sandwiched between a first thermoplastic substrate and a second thermoplastic substrate. The ferrite thin film laminate may include a multiplicity of coated substrates.

First claim

What is claimed is:

1. A method comprising:
heating a layered assembly to form a laminate, the layered assembly comprising:
a first coated substrate having a first ferrite layer opposite a first thermoplastic surface; and
a second coated substrate having a second ferrite layer opposite a second thermoplastic surface,
wherein the first ferrite layer and the second ferrite layer comprise nanostructures, and the nanostructures comprise columns, and
wherein the first ferrite layer contacts the second thermoplastic surface.

2. The method of claim 1 , further comprising forming the layered assembly before heating the layered assembly.

3. The method of claim 2 , wherein forming the layered assembly comprises stacking the first coated substrate on the second coated substrate.

4. The method of claim 2 , wherein forming the layered assembly comprises positioning the second coated substrate on the first coated substrate.

5. The method of claim 1 , wherein the first coated substrate and the second coated substrate have substantially the same dimensions.

6. The method of claim 1 , wherein a thickness of the first coated substrate, a thickness of the second coated substrate, or both is between 10 μm and 100 μm.

7. The method of claim 2 , further comprising forming the first coated substrate and the second coated substrate before forming the layered assembly.

8. The method of claim 7 , wherein forming the first coated substrate and the second coated substrate comprises dividing a single coated substrate into two or more pieces to form the first coated substrate and the second coated substrate.

9. The method of claim 7 , wherein the first thermoplastic surface is a surface of a first thermoplastic substrate and the second thermoplastic surface is a surface of a second thermoplastic substrate, and forming the first coated substrate and the second coated substrate comprises forming the first ferrite layer on the first thermoplastic surface, and forming the second ferrite layer on the second thermoplastic surface, respectively.

10. The method of claim 9 , wherein forming the first ferrite layer on the first thermoplastic surface and forming the second ferrite layer on the second thermoplastic surface comprises depositing the ferrite of the first ferrite layer on the first thermoplastic surface and depositing the ferrite of the second ferrite layer on the second thermoplastic surface, respectively.

11. The method of claim 10 , wherein depositing the first ferrite on the first thermoplastic surface and depositing the second ferrite on the second thermoplastic surface comprises spin-spray plating the first ferrite on the first thermoplastic surface and spin-spray plating the second ferrite on the second thermoplastic surface, respectively.

12. The method of claim 9 , wherein forming the first coated substrate and the second coated substrate comprises heating the first thermoplastic substrate and the second thermoplastic substrate, respectively, to a temperature up to 100° C., up to 200° C., up to 300° C., or up to 400° C.

13. The method of claim 9 , wherein the first thermoplastic substrate and the second thermoplastic substrate differ in composition.

14. The method of claim 7 , wherein forming the first coated substrate and the second coated substrate comprises dividing a unitary coated substrate into two or more pieces to form the first coated substrate and the second coated substrate.

15. The method of claim 14 , wherein forming the unitary coated substrate comprises disposing ferrite on a surface of a unitary thermoplastic substrate and then cutting the unitary thermoplastic substrate to form a first coated substrate and a second coated substrate.

16. The method of claim 1 , further comprising cleaning the first ferrite layer and the second ferrite layer before forming the layered assembly.

17. The method of claim 1 , further comprising compressing the layered assembly before heating the layered assembly.

18. The method of claim 17 , wherein compressing the layered assembly comprises positioning the layered assembly in a press and applying pressure to the layered assembly.

19. The method of claim 9 , wherein the first thermoplastic substrate, the second thermoplastic substrate, or both comprise polyetheretherketone, polyether imide, nylon, or polyetherketoneketone.

20. The method of claim 9 , wherein heating the layered assembly comprises heating the layered assembly to a temperature less than the glass transition temperature of the first thermoplastic substrate, the second thermoplastic substrate, or both.

21. The method of claim 1 , wherein heating the layered assembly comprises heating the layered assembly to a temperature of at least 200° C., at least 250° C., at least 300° C., or at least 350° C., and less than 400° C.

22. The method of claim 1 , wherein heating the layered assembly comprises heating the layered assembly for at least 30 minutes.

23. The method of claim 1 , wherein heating the layered assembly comprises heating the layered assembly at a ramp rate between 5° C./min and 25° C./min.

24. The method of claim 1 , wherein heating the layered assembly comprises thermally annealing the layered assembly.

25. The method of claim 1 , wherein heating the layered assembly comprises heating the layered assembly under a pressure less than atmospheric pressure.

26. The method of claim 1 , wherein the layered assembly comprises a multiplicity of coated substrates.

27. The method of claim 26 , wherein the multiplicity of coated substrates comprises more than two coated substrates.

28. The method of claim 1 , wherein the ferrite of the first ferrite layer and the ferrite of the second ferrite layer independently comprise nickel, zinc, cobalt, iron, copper, manganese, indium, or any combination thereof.

29. The method of claim 1 , wherein the ferrite of the first ferrite layer differs in composition from the ferrite of the second ferrite layer.

30. The method of claim 1 , wherein the ferrite of the first ferrite layer and the ferrite of the second ferrite layer each has a stoichiometry represented by AB 2 O 4 , wherein A and B represent two different lattice sites occupied by cationic species, and O represents oxygen having its own sublattice.

31. The method of claim 1 , wherein the ferrite of the first ferrite layer and the ferrite of the second ferrite layer each has a spinel cubic crystal structure.

32. The method of claim 1 , wherein the first ferrite layer and the second ferrite layer are ferrite thin films.

33. The method of claim 1 , wherein the nanostructures comprise columns with an average height between 0.3 μm and 12 μm, an average diameter between 20 nm and 1500 nm, or both.

34. The method of claim 1 , wherein the columns comprise nanoparticulate structure.

35. The method of claim 9 , wherein a thickness of the first ferrite layer exceeds a thickness of the first thermoplastic substrate, a thickness of the second ferrite layer exceeds a thickness of the second thermoplastic substrate, or both.

36. The method of claim 9 , wherein a thickness of the first ferrite layer, a thickness of the second ferrite layer, or both is between 0.1 μm and 10 μm or between 0.1 μm and 20 μm.

37. The method o

Assignees

• Univ Arizona
• Arizona Board Of Regents A Body Corp Of The State Of Arizona Acting For And On Behalf Of Arizona Sta

Inventors

• Petuskey William T
• Ray Nicole M

Classifications

• H01F41/16

  the magnetic material being applied in the form of particles, e.g. by serigraphy {, to form thick magnetic films or precursors therefor} (H01F41/18 {-H01F41/24} take precedence) · CPC title

• H01F1/344 Primary

  Ferrites, e.g. having a cubic spinel structure (X2+O)(Y23+O3), e.g. magnetite Fe3O4 · CPC title

• Y10T428/32

  Composite [nonstructural laminate] of inorganic material having metal-compound-containing layer and having defined magnetic layer · CPC title

• H01F10/265

  Magnetic multilayers non exchange-coupled (H01F10/32 takes precedence) · CPC title

• H01F10/20 Primary

  Ferrites · CPC title